The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Package / Case
- Peripherals
- Primary Attributes
- Series
- Speed
- Supplier Device Package
- Flash Size
- Number of I/Os
- Operating Temperature:
0°C ~ 85°C (TJ)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Number of I/Os | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Terminal Finish | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Flash Size | Length | Width |
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![]() | Mfr Part No 5ASXMB5G4F40C5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXMB5G4F40C5N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXMB5 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | ||||||||||
![]() | Mfr Part No XC7Z020-1CLG400C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | XC7Z020 | AMD | 130 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z010-1CL225I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z010 | AMD | 84 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F200M3F-1FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CSEMA5U23C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEMA5U23C6N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.25 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEMA5 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | ||||||||||
![]() | Mfr Part No A2F500M3G-FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB |
5ASXMB5G4F40C5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z020-1CLG400C
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z010-1CL225I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F200M3F-1FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
5CSEMA5U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
