The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Factory Lead Time
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
- Operating Temperature:
0°C~100°C TJ
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Propagation Delay | Connectivity | Architecture | Data Bus Width | Core Architecture | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XC7Z020-2CLG400E | Xilinx Inc. | Datasheet | 396 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 400-LFBGA, CSPBGA | YES | 400 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | 30 | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | No | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No XC7Z045-3FFG900E | Xilinx Inc. | Datasheet | 444 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No XC7Z010-2CLG400E | Xilinx Inc. | Datasheet | 396 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 400-LFBGA, CSPBGA | YES | 400 | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | XC7Z010 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | No | ROHS3 Compliant | |||||||||||||||||||
 | Mfr Part No XC7Z045-2FFG676E | Xilinx Inc. | Datasheet | 698 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No XC7Z007S-2CLG400E | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | 400-LFBGA, CSPBGA | YES | 100 | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 400 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||
| Mfr Part No XC7Z045-2FFG900E | Xilinx Inc. | Datasheet | 683 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z045 | S-PBGA-B900 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | |||||||||||||||||
 | Mfr Part No XC7Z030-2FBG484E | Xilinx Inc. | Datasheet | 2036 |
| Min: 1 Mult: 1 | 10 Weeks | 484-BBGA, FCBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 23mm | No | ROHS3 Compliant | |||||||||||||||||||
| Mfr Part No XC7Z030-2FFG676E | Xilinx Inc. | Datasheet | 2154 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.24mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No XC7Z020-2CLG484E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-LFBGA, CSPBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | 30 | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | No | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XC7Z015-3CLG485E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | 485 | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 866MHz | NOT SPECIFIED | Not Qualified | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Artix™-7 FPGA, 74K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XC7Z020-3CLG400E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 400-LFBGA, CSPBGA | YES | 400 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | No | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XC7Z030-2FBG676E | Xilinx Inc. | Datasheet | 1960 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No XC7Z010-3CLG225E | Xilinx Inc. | Datasheet | 1200 |
| Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 225 | 86 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z010 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | No | ROHS3 Compliant | |||||||||||||||||||
| Mfr Part No XC7Z020-3CLG484E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-LFBGA, CSPBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | No | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XC7Z035-2FFG900E | Xilinx Inc. | Datasheet | 16 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | S-PBGA-B900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 2 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | 3.35mm | 31mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No XC7Z010-3CLG400E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 400-LFBGA, CSPBGA | YES | 400 | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z010 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | No | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XC7Z035-2FFG676E | Xilinx Inc. | Datasheet | 480 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 110 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 2 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | 3.37mm | ROHS3 Compliant | ||||||||||||||||||||||
| Mfr Part No XC7Z030-3FBG484E | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-BBGA, FCBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 1GHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 23mm | No | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XC7Z035-3FFG676E | Xilinx Inc. | Datasheet | 765 |
| Min: 1 Mult: 1 | 10 Weeks | 676-BBGA, FCBGA | YES | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||
| Mfr Part No XC7Z015-2CLG485E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | 485 | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 766MHz | NOT SPECIFIED | Not Qualified | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Artix™-7 FPGA, 74K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 1.6mm | 19mm | ROHS3 Compliant |
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XC7Z020-2CLG400E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-3FFG900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
3,365.194975
-
XC7Z010-2CLG400E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-2FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,156.775703
-
XC7Z007S-2CLG400E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
27.605599
-
XC7Z045-2FFG900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,479.051314
-
XC7Z030-2FBG484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
330.077763
-
XC7Z030-2FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
475.616577
-
XC7Z020-2CLG484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
24.704218
-
XC7Z015-3CLG485E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
49.198031
-
XC7Z020-3CLG400E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
37.026978
-
XC7Z030-2FBG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
429.054570
-
XC7Z010-3CLG225E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
97.848472
-
XC7Z020-3CLG484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
34.421492
-
XC7Z035-2FFG900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z010-3CLG400E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
34.579075
-
XC7Z035-2FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z030-3FBG484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
168.025544
-
XC7Z035-3FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,416.404209
-
XC7Z015-2CLG485E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
44.419165