The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Factory Lead Time
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peripherals
- Primary Attributes
- Operating Temperature:
0°C~100°C TJ
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Core Architecture | Boundary Scan | RAM (words) | Primary Attributes | Number of Logic Cells | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No XC7Z030-3SBG485E | Xilinx Inc. | Datasheet | 792 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-FBGA, FCBGA | 485 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 1GHz | NOT SPECIFIED | Not Qualified | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 2.44mm | 19mm | ROHS3 Compliant | |||||||||||
 | Mfr Part No XCZU3CG-1SFVC784E | Xilinx Inc. | Datasheet | 2373 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU4CG-1FBVB900E | Xilinx Inc. | Datasheet | 32 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVC1760E | Xilinx Inc. | Datasheet | 48 | - | Min: 1 Mult: 1 | 11 Weeks | 1760-BBGA, FCBGA | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU2EG-1SBVA484E | Xilinx Inc. | Datasheet | 1844 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | 82 | 0°C~100°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS066K3F35E2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 396 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.5mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||
 | Mfr Part No XCZU6CG-1FFVC900E | Xilinx Inc. | Datasheet | 186 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-2FFVC900E | Xilinx Inc. | Datasheet | 424 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-1SBVA484E | Xilinx Inc. | Datasheet | 2096 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | 82 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS016E3F29E2LG | Intel | Datasheet | 163 | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 288 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 288 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | 3.35mm | 29mm | 29mm | RoHS Compliant | ||||||||||||||||||||
 | Mfr Part No XCZU3EG-1SFVA625E | Xilinx Inc. | Datasheet | 400 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | 180 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU7EV-2FFVC1156E | Xilinx Inc. | Datasheet | 432 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z007S-2CLG225E | Xilinx Inc. | Datasheet | 2400 | - | Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 54 | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 30 | S-PBGA-B225 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||
| Mfr Part No XCZU4CG-2SFVC784E | Xilinx Inc. | Datasheet | 551 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-2FBVB900E | Xilinx Inc. | Datasheet | 105 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS016E4F27E3SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B672 | 240 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | 3.25mm | 27mm | 27mm | RoHS Compliant | ||||||||||||||||||||
| Mfr Part No XCZU4EG-L2SFVC784E | Xilinx Inc. | Datasheet | 77 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B784 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||
| Mfr Part No 10AS066H3F34E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 492 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.65mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||
| Mfr Part No XCZU7EG-3FFVC1156E | Xilinx Inc. | Datasheet | 44 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-1SFVA625E | Xilinx Inc. | Datasheet | 2116 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | 180 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant |
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XC7Z030-3SBG485E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-1SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4CG-1FBVB900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-2FFVC1760E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-1SBVA484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066K3F35E2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6CG-1FFVC900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU9EG-2FFVC900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-1SBVA484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E3F29E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-1SFVA625E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EV-2FFVC1156E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z007S-2CLG225E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4CG-2SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-2FBVB900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E4F27E3SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EG-L2SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066H3F34E2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EG-3FFVC1156E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-1SFVA625E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire