The category is 'Embedded - System On Chip (SoC)'

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  • Primary Attributes
  • Operating Temperature:

    0 to 85 °C

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Part Number

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Base Product Number

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Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Manufacturer Part Number

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Maximum Operating Supply Voltage

Maximum Operating Temperature

Mfr

Minimum Operating Supply Voltage

Minimum Operating Temperature

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Moisture Sensitivity Levels

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MSL

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Supply Voltage-Min

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Flash Size

Length

Width

A2F500M3G-FG484

Mfr Part No

A2F500M3G-FG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

484-FPBGA (23x23)

A2F500

ARM Cortex M3

64 kB

500000

60

-

-

80 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

SMD/SMT

204 I/O

-

6000 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

SmartFusion

1.5000 V

0 to 85 °C

Tray

A2F500

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

A2F500M3G-FG256

Mfr Part No

A2F500M3G-FG256

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-256

256-FPBGA (17x17)

A2F500

ARM Cortex M3

64 kB

500000

90

-

-

80 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

SMD/SMT

117 I/O

-

6000 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

SmartFusion

1.5000 V

0 to 85 °C

Tray

A2F500

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

M2S090-1FGG484

Mfr Part No

M2S090-1FGG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

484-FPBGA (23x23)

M2S090

ARM Cortex M3

64 kB

60

-

-

166 MHz

Microchip Technology

Yes

SMD/SMT

267

7193 LAB

86316 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

A2F500M3G-1FG256

Mfr Part No

A2F500M3G-1FG256

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-256

YES

256-FPBGA (17x17)

256

A2F500

100 MHz

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

A2F500M3G-1FG256

100 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

3

SMD/SMT

117 I/O

-

6000 LE

85 °C

Tray

PLASTIC/EPOXY

LBGA

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

Active

30

5.24

N

No

This product may require additional documentation to export from the United States.

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

0 to 85 °C

Tray

A2F500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

66

Not Qualified

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

11520 CLBS, 500000 GATES

1.7 mm

FIELD PROGRAMMABLE GATE ARRAY

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

17 mm

17 mm

M2S050T-FGG896

Mfr Part No

M2S050T-FGG896

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-896

YES

896-FBGA (31x31)

896

M2S050

ARM Cortex M3

64 kB

27

MICROSEMI CORP

-

-

M2S050T-FGG896

166 MHz

+ 85 C

Microchip Technology

0 C

Yes

SMD/SMT

377 I/O

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-896

BGA896,30X30,40

SQUARE

GRID ARRAY

Active

Active

40

2.31

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

Not Qualified

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

M2S005S-1FGG484T2

Mfr Part No

M2S005S-1FGG484T2

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-484

484-FPBGA (23x23)

M2S005

ARM Cortex M3

64 kB

191 kbit

60

MICROSEMI CORP

-

-

M2S005S-1FGG484T2

166 MHz

+ 85 C

Microchip Technology

0 C

Yes

SMD/SMT

209 I/O

505 LAB

6060 LE

Tray

,

Active

Active

40

5.81

Details

Yes

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e1

Yes

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 5K Logic Modules

1 Core

128KB

M2S005S-1VFG400T2

Mfr Part No

M2S005S-1VFG400T2

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

BGA-400

400-VFBGA (17x17)

M2S005

ARM Cortex M3

64 kB

191 kbit

90

-

-

166 MHz

+ 85 C

Microchip Technology

0 C

Yes

SMD/SMT

171 I/O

505 LAB

6060 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

1.2000 V

0.652216 oz

0 to 85 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 5K Logic Modules

1 Core

128KB

M2S025-1VF400

Mfr Part No

M2S025-1VF400

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

M2S025

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

M2S025-1VF400

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

SMD/SMT

207

2308 LAB

27696 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-400

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.87

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

M2S150TS-1FCS536

Mfr Part No

M2S150TS-1FCS536

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

M2S150

ARM Cortex M3

64 kB

90

-

-

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

293

12177 LAB

146124 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

536

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S025T-FCSG325

Mfr Part No

M2S025T-FCSG325

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2S025

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

M2S025T-FCSG325

166 MHz

Microchip Technology

Yes

3

MSL 3 - 168 hours

180

2308 LAB

27696 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

40

5.78

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

2.5, 3.3 V

0.111027 oz

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

592Kbit

STD

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S010-VF400

Mfr Part No

M2S010-VF400

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

VFPBGA-400

400-VFBGA (17x17)

M2S010

ARM Cortex M3

64 kB

90

-

-

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

SMD/SMT

195

1007 LAB

12084 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S050T-FCSG325

Mfr Part No

M2S050T-FCSG325

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2S050

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

M2S050T-FCSG325

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

3

200

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA325,21X21,20

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

40

5.76

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

2.5, 3.3 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S005-1VF400

Mfr Part No

M2S005-1VF400

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

M2S005

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

M2S005-1VF400

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

SMD/SMT

169

505 LAB

6060 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA400,20X20,32

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.86

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 5K Logic Modules

4956

1 Core

128KB

17 mm

17 mm

M2S010T-1FGG484

Mfr Part No

M2S010T-1FGG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

484-FPBGA (23x23)

M2S010

ARM Cortex M3

64 kB

60

-

-

166 MHz

Microchip Technology

Yes

SMD/SMT

233

1007 LAB

12084 LE

Tray

Active

Details

1.2000 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 10K Logic Modules

1 Core

256KB

M2S025T-VF400

Mfr Part No

M2S025T-VF400

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

M2S025

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

M2S025T-VF400

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

207

2308 LAB

27696 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA400,20X20,32

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.3

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

M2S050T-1FG896

Mfr Part No

M2S050T-1FG896

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-896

896-FBGA (31x31)

M2S050

ARM Cortex M3

64 kB

27

-

-

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

SMD/SMT

377

4695 LAB

56340 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

896

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

M2S060TS-1VF400

Mfr Part No

M2S060TS-1VF400

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

400-LFBGA

400-VFBGA (17x17)

M2S060

ARM Cortex M3

64 kB

90

-

-

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

207

4710 LAB

56520 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

SmartFusion2

1.2 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 60K Logic Modules

1 Core

256KB

M2S010-VFG256

Mfr Part No

M2S010-VFG256

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

256-LBGA

YES

256-FPBGA (17x17)

256

M2S010

ARM Cortex M3

64 kB

119

MICROSEMI CORP

-

-

M2S010-VFG256

166 MHz

+ 85 C

Microchip Technology

0 C

Yes

3

SMD/SMT

138 I/O

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-256

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

40

5.77

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0.406091 oz

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

Not Qualified

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S005-VF400

Mfr Part No

M2S005-VF400

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

M2S005

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

M2S005-VF400

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

169

505 LAB

6060 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-400

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.3

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 5K Logic Modules

4956

1 Core

128KB

17 mm

17 mm

M2S150-FCVG484

Mfr Part No

M2S150-FCVG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

484-BFBGA

484-FBGA (19x19)

M2S150

ARM Cortex M3

64 kB

84

-

-

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

273

12177 LAB

146124 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 150K Logic Modules

1 Core

512KB