The category is 'Embedded - System On Chip (SoC)'
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- Operating Temperature:
0 to 85 °C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Core | Data RAM Size | Device Logic Gates | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Length | Width |
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![]() | Mfr Part No A2F500M3G-FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 60 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-256 | 256-FPBGA (17x17) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 90 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 117 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FG256 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 117 I/O | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 17 mm | 17 mm | |||||||||||||
![]() | Mfr Part No M2S050T-FGG896 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | ARM Cortex M3 | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050T-FGG896 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 377 I/O | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 2.31 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | ||||||||||||||||||||
![]() | Mfr Part No M2S005S-1FGG484T2 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 191 kbit | 60 | MICROSEMI CORP | - | - | M2S005S-1FGG484T2 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 209 I/O | 505 LAB | 6060 LE | Tray | , | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-1VFG400T2 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-400 | 400-VFBGA (17x17) | M2S005 | ARM Cortex M3 | 64 kB | 191 kbit | 90 | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 171 I/O | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0.652216 oz | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-1VF400 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S025 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025-1VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 207 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||
![]() | Mfr Part No M2S150TS-1FCS536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 293 | 12177 LAB | 146124 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-FCSG325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S025 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025T-FCSG325 | 166 MHz | Microchip Technology | Yes | 3 | MSL 3 - 168 hours | 180 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | 0.111027 oz | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | 592Kbit | STD | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||
![]() | Mfr Part No M2S010-VF400 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | 400-VFBGA (17x17) | M2S010 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 195 | 1007 LAB | 12084 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-FCSG325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050T-FCSG325 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | 200 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||
![]() | Mfr Part No M2S005-1VF400 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S005 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S005-1VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 169 | 505 LAB | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 4956 | 1 Core | 128KB | 17 mm | 17 mm | |||||||||||||||||||||
![]() | Mfr Part No M2S010T-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S010 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 233 | 1007 LAB | 12084 LE | Tray | Active | Details | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-VF400 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S025 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025T-VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 207 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||
![]() | Mfr Part No M2S050T-1FG896 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-896 | 896-FBGA (31x31) | M2S050 | ARM Cortex M3 | 64 kB | 27 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 377 | 4695 LAB | 56340 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 896 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060TS-1VF400 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 207 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | 1.2 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-VFG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010-VFG256 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0.406091 oz | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||
![]() | Mfr Part No M2S005-VF400 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S005 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S005-VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 169 | 505 LAB | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 4956 | 1 Core | 128KB | 17 mm | 17 mm | ||||||||||||||||||||||
![]() | Mfr Part No M2S150-FCVG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | ARM Cortex M3 | 64 kB | 84 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 273 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 1 Core | 512KB |
A2F500M3G-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-FG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S090-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-1FG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050T-FGG896
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005S-1FGG484T2
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005S-1VFG400T2
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025-1VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S150TS-1FCS536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025T-FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010-VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050T-FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005-1VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010T-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025T-VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050T-1FG896
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060TS-1VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010-VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005-VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S150-FCVG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
