The category is 'Embedded - System On Chip (SoC)'

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  • Architecture
  • Base Product Number
  • Connectivity
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  • Mfr
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  • Package / Case
  • Peripherals
  • Primary Attributes
  • Operating Temperature:

    0 to 85 °C

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Base Product Number

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Data RAM Size

Device Logic Units

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Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Number of User I/Os

Maximum Operating Supply Voltage

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Mfr

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

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Mounting Styles

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Package Body Material

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Supply Voltage-Nom

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Speed Grade

Resistance Tolerance

Primary Attributes

Number of Registers

Number of CLBs

Number of Logic Cells

Number of Cores

Number of Equivalent Gates

Flash Size

Product Category

Contacts

Product Length

IP Rating

Length

Width

Width (in)

M2S090-FGG484

Mfr Part No

M2S090-FGG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

484-BGA

484-FPBGA (23x23)

M2S090

ARM Cortex M3

64 kB

60

-

-

166 MHz

Microchip Technology

Yes

267

7193 LAB

86316 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 90K Logic Modules

1 Core

512KB

M2S050-1FG896

Mfr Part No

M2S050-1FG896

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-896

YES

896-FBGA (31x31)

896

M2S050

ARM Cortex M3

64 kB

27

MICROSEMI CORP

-

-

M2S050-1FG896

166 MHz

Microchip Technology

Yes

3

SMD/SMT

377

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-896

BGA896,30X30,40

SQUARE

GRID ARRAY

Active

Active

30

5.3

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

896

S-PBGA-B896

377

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 50K Logic Modules

48672

1 Core

256KB

31 mm

31 mm

M2S090T-FG484

Mfr Part No

M2S090T-FG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

484-BGA

484-FPBGA (23x23)

M2S090

ARM Cortex M3

64 kB

60

-

-

166 MHz

Microchip Technology

Yes

267

7193 LAB

86316 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 90K Logic Modules

1 Core

512KB

A2F500M3G-1FG484

Mfr Part No

A2F500M3G-1FG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

484-FPBGA (23x23)

A2F500

ARM Cortex M3

64 kB

60

-

-

100 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

SMD/SMT

204 I/O

-

6000 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

SmartFusion

1.5000 V

0 to 85 °C

Tray

A2F500

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

M2S150T-1FCG1152

Mfr Part No

M2S150T-1FCG1152

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FCBGA-1152

1152-FCBGA (35x35)

M2S150

ARM Cortex M3

64 kB

24

-

-

166 MHz

Microchip Technology

Yes

SMD/SMT

574

12177 LAB

146124 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S010S-TQG144

Mfr Part No

M2S010S-TQG144

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

TQFP-144

144-TQFP (20x20)

M2S010

ARM Cortex M3

64 kB

400 kbit

60

-

-

166 MHz

+ 85 C

Microchip Technology

0 C

SMD/SMT

84 I/O

1007 LAB

12084 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S050-FCSG325

Mfr Part No

M2S050-FCSG325

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2S050

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

M2S050-FCSG325

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

3

200

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

40

5.76

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S025-FCSG325

Mfr Part No

M2S025-FCSG325

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2S025

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

M2S025-FCSG325

166 MHz

1.26 V

Microchip Technology

Yes

3

180

2308 LAB

27696 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

40

5.78

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S010-1FG484

Mfr Part No

M2S010-1FG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

M2S010

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

M2S010-1FG484

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

3

SMD/SMT

233

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.84

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

M2S025-VFG256

Mfr Part No

M2S025-VFG256

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

256-LBGA

YES

256-FPBGA (17x17)

256

M2S025

ARM Cortex M3

64 kB

119

MICROSEMI CORP

-

-

M2S025-VFG256

166 MHz

Microchip Technology

Yes

3

138

2308 LAB

27696 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-256

BGA256,16X16,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

40

5.78

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm

XC7Z035-1FBG676C

Mfr Part No

XC7Z035-1FBG676C

AMD Datasheet

-

-

Min: 1

Mult: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

XC7Z035

275,000

130

AMD

Surface Mount

130

Tray

Active

FCBGA

1.0000 V

Commercial grade

0 to 85 °C

Zynq®-7000

50.0000 ppm/°C

825 Ohm

0.5 W

Industrial

676

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Commercial

1

1

Kintex™-7 FPGA, 275K Logic Cells

343,800

-

6.1

M2S050T-FG484

Mfr Part No

M2S050T-FG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

M2S050

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

M2S050T-FG484

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

3

SMD/SMT

267

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.84

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 50K Logic Modules

48672

1 Core

256KB

23 mm

23 mm

M2S050T-1VFG400

Mfr Part No

M2S050T-1VFG400

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

VFPBGA-400

400-VFBGA (17x17)

M2S050

ARM Cortex M3

64 kB

90

-

-

166 MHz

Microchip Technology

Yes

SMD/SMT

207

4695 LAB

56340 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

1.2000 V

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

M2S010-FGG484

Mfr Part No

M2S010-FGG484

Microchip Datasheet

-

-

Min: 1

Mult: 1

484-BGA

484-FPBGA (23x23)

M2S010

64 kB

-

-

166 MHz

1.26 V

+ 85 C

Microchip Technology

1.14 V

0 C

SMD/SMT

233

12084 LE

Tray

Active

1.2000 V

0 to 85 °C

SmartFusion®2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S005-VFG400

Mfr Part No

M2S005-VFG400

Microchip Datasheet

-

-

Min: 1

Mult: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

M2S005

64 kB

MICROSEMI CORP

-

-

Microsemi Corporation

M2S005-VFG400

166 MHz

+ 85 C

Microchip Technology

0 C

3

SMD/SMT

169

6060 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA400,20X20,32

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

40

5.28

Yes

1.26 V

1.14 V

1.2 V

2.5, 3.3 V

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

171

Not Qualified

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

A2F500M3G-1FGG484

Mfr Part No

A2F500M3G-1FGG484

Microchip Datasheet

-

-

Min: 1

Mult: 1

484-BGA

YES

484-FPBGA (23x23)

484

A2F500

Microchip Technology / Atmel

100 MHz

64 kB

60

MICROSEMI CORP

-

-

Microchip

A2F500M3G-1FGG484

100 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

3

SMD/SMT

MCU - 41, FPGA - 128

-

6000 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

40

1.36

Details

Yes

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

0.534969 oz

0 to 85 °C

Tray

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

Not Qualified

1.5 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

M2S025-FGG484

Mfr Part No

M2S025-FGG484

Microchip Datasheet

-

-

Min: 1

Mult: 1

484-BGA

484-FPBGA (23x23)

M2S025

64 kB

-

-

166 MHz

1.26 V

+ 85 C

Microchip Technology

1.14 V

0 C

SMD/SMT

267

27696 LE

Tray

Active

1.2000 V

25 V

0 to 85 °C

SmartFusion®2

200 ppm/°C

6.8

0.05 W

General Purpose

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

1

FPGA - 25K Logic Modules

1 Core

256KB

M2S010T-VFG256

Mfr Part No

M2S010T-VFG256

Microchip Datasheet

-

-

Min: 1

Mult: 1

Production (Last Updated: 1 month ago)

256-LBGA

256

256-FPBGA (17x17)

CE, CSA, UL

M2S010

64 kB

-

-

Cutler Hammer, Div of Eaton Co

10250T112-2

166 MHz

1.26 V

+ 85 C

Microchip Technology

1.14 V

0 C

SMD/SMT

138

12084 LE

Momentary

Tray

Active

Compliant

1.2000 V

0 to 85 °C

SmartFusion®2

85 °C

0 °C

1.2 V

166MHz

50 kB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

Screw

STD

FPGA - 10K Logic Modules

1 Core

256KB

2NO

IP65

M2S060T-FCSG325

Mfr Part No

M2S060T-FCSG325

Microchip Datasheet

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

Nylon

325

M2S060

64 kB

MICROSEMI CORP

-

-

Thomas & Betts

TY23M-4

166 MHz

1.26 V

Microchip Technology

1.14 V

3

200

56520 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

5.82

Non-Compliant

Yes

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

Yellow

LG-MIN, WD-MIN

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

40

S-PBGA-B325

200

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

0.093

M2S025TS-1VFG256T2

Mfr Part No

M2S025TS-1VFG256T2

Microchip Datasheet

-

-

Min: 1

Mult: 1

256-LBGA

256-FPBGA (17x17)

M2S025

No Display

Honeywell

C7772G1004/U

Microchip Technology

138

Tray

Active

1.2000 V

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

Indoor

10 kOhm NTC

Temperature

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

256KB