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      Home / All Categories / Integrated Circuits (ICs) / Embedded - System On Chip (SoC) /

      The category is 'Embedded - System On Chip (SoC)'

      • All Manufacturers
      • Architecture
      • Base Product Number
      • Connectivity
      • Core Processor
      • Flash Size
      • Mfr
      • Number of I/Os
      • Operating Temperature
      • Package
      • Package / Case
      • Peripherals
      • Primary Attributes
      • Operating Temperature:

        0 to 85 °C

      Image

      Part Number

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      Base Product Number

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      Core

      Data RAM Size

      Device Logic Gates

      Factory Pack QuantityFactory Pack Quantity

      I/O Voltage

      Ihs Manufacturer

      Instruction Set Architecture

      Interface Type

      JTAG Support

      L1 Cache Data Memory

      L1 Cache Instruction Memory

      Manufacturer

      Manufacturer Part Number

      Maximum Clock Frequency

      Maximum Operating Supply Voltage

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      Minimum Operating Supply Voltage

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      Moisture Sensitivity Levels

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      Mounting Styles

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      Supply Voltage-Max

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      Typical Operating Supply Voltage

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      Power Rating

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      Terminal Form

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      Terminal Pitch

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      Time@Peak Reflow Temperature-Max (s)

      Pin Count

      JESD-30 Code

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      Speed

      RAM Size

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      Data Bus Width

      Number of Inputs

      Seated Height-Max

      Programmable Logic Type

      Core Architecture

      Screening Level

      Speed Grade

      Legend

      Resistance Tolerance

      Primary Attributes

      Number of Logic Cells

      Number of Cores

      Flash Size

      Mesh Length

      Product Length

      Product Width

      Device Core

      Length

      Width
      M2S090-FG676

      Mfr Part No

      M2S090-FG676

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      676-BGA

      YES

      676-FBGA (27x27)

      676

      M2S090

      ARM Cortex M3

      64 kB

      40

      MICROSEMI CORP

      -

      -

      M2S090-FG676

      166 MHz

      Microchip Technology

      Yes

      3

      425

      7193 LAB

      86316 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      BGA

      FBGA-676

      BGA676,26X26,40

      SQUARE

      GRID ARRAY

      Active

      Active

      30

      5.83

      N

      No

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e0

      Tin/Lead (Sn/Pb)

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      240

      1 mm

      not_compliant

      S-PBGA-B676

      425

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      512 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      425

      2.44 mm

      FIELD PROGRAMMABLE GATE ARRAY

      STD

      FPGA - 90K Logic Modules

      86316

      1 Core

      512KB

      27 mm

      27 mm

      M2S150-FC1152

      Mfr Part No

      M2S150-FC1152

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      1152-BBGA, FCBGA

      YES

      1152-FCBGA (35x35)

      1152

      M2S150

      ARM Cortex M3

      64 kB

      24

      MICROSEMI CORP

      -

      -

      M2S150-FC1152

      166 MHz

      Microchip Technology

      Yes

      574

      12177 LAB

      146124 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      BGA

      FBGA-1152

      BGA1152,34X34,40

      SQUARE

      GRID ARRAY

      Active

      Active

      30

      5.81

      N

      No

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e0

      Tin/Lead (Sn/Pb)

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      240

      1 mm

      not_compliant

      S-PBGA-B1152

      574

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      512 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      574

      2.9 mm

      FIELD PROGRAMMABLE GATE ARRAY

      STD

      FPGA - 150K Logic Modules

      146124

      1 Core

      512KB

      35 mm

      35 mm

      M2S010-1VFG256

      Mfr Part No

      M2S010-1VFG256

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      VFPBGA-256

      YES

      256-FPBGA (17x17)

      256

      M2S010

      ARM Cortex M3

      64 kB

      119

      MICROSEMI CORP

      -

      -

      M2S010-1VFG256

      166 MHz

      Microchip Technology

      Yes

      3

      SMD/SMT

      138

      1007 LAB

      12084 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      LFBGA

      VFBGA-256

      BGA256,16X16,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Active

      40

      5.77

      Details

      Yes

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e1

      Tin/Silver/Copper (Sn/Ag/Cu)

      LG-MIN, WD-MIN

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      250

      0.8 mm

      compliant

      S-PBGA-B256

      138

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      138

      1.56 mm

      FIELD PROGRAMMABLE GATE ARRAY

      1

      FPGA - 10K Logic Modules

      12084

      1 Core

      256KB

      14 mm

      14 mm

      M2S090TS-FCS325

      Mfr Part No

      M2S090TS-FCS325

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      325-TFBGA, FCBGA

      YES

      325-FCBGA (11x13.5)

      325

      M2S090

      ARM Cortex M3

      64 kB

      176

      MICROSEMI CORP

      -

      -

      M2S090TS-FCS325

      166 MHz

      Microchip Technology

      Yes

      180

      7193 LAB

      86316 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      TFBGA

      TFBGA, BGA325,21X21,20

      BGA325,21X21,20

      RECTANGULAR

      GRID ARRAY, THIN PROFILE, FINE PITCH

      Active

      Active

      30

      5.83

      N

      No

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e0

      Tin/Lead (Sn/Pb)

      LG-MIN, WD-MIN

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      240

      0.5 mm

      not_compliant

      R-PBGA-B325

      180

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      512 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      180

      1.16 mm

      FIELD PROGRAMMABLE GATE ARRAY

      STD

      FPGA - 90K Logic Modules

      86316

      1 Core

      512KB

      13.5 mm

      11 mm

      M2S060-FCSG325

      Mfr Part No

      M2S060-FCSG325

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      Production (Last Updated: 2 months ago)

      325-TFBGA, FCBGA

      YES

      325-FCBGA (11x11)

      325

      M2S060

      ARM Cortex M3

      64 kB

      176

      MICROSEMI CORP

      -

      -

      M2S060-FCSG325

      166 MHz

      1.26 V

      Microchip Technology

      1.14 V

      Yes

      3

      200

      4710 LAB

      56520 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      TFBGA

      FBGA-325

      BGA325,21X21,20

      SQUARE

      GRID ARRAY, THIN PROFILE, FINE PITCH

      Active

      Active

      40

      5.81

      Details

      Yes

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      SmartFusion2

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e1

      Tin/Silver/Copper (Sn/Ag/Cu)

      LG-MIN, WD-MIN

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      250

      0.5 mm

      compliant

      S-PBGA-B325

      200

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      200

      1.01 mm

      FIELD PROGRAMMABLE GATE ARRAY

      STD

      FPGA - 60K Logic Modules

      56520

      1 Core

      256KB

      11 mm

      11 mm

      M2S090TS-1FGG484

      Mfr Part No

      M2S090TS-1FGG484

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      FPBGA-484

      484-FPBGA (23x23)

      M2S090

      ARM Cortex M3

      64 kB

      60

      -

      -

      166 MHz

      1.26 V

      Microchip Technology

      1.14 V

      Yes

      SMD/SMT

      267

      7193 LAB

      86316 LE

      Tray

      Active

      Details

      This product may require additional documentation to export from the United States.

      1.2 V

      0 to 85 °C

      Tray

      SmartFusion2

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      512 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      1

      FPGA - 90K Logic Modules

      1 Core

      512KB

      A2F500M3G-1FGG256M

      Mfr Part No

      A2F500M3G-1FGG256M

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      256-LBGA

      256

      256-FPBGA (17x17)

      A2F500

      ARM Cortex M3

      64 kB

      500000

      90

      MICROSEMI CORP

      -

      -

      A2F500M3G-1FGG256M

      100 MHz

      1.575 V

      Microchip Technology

      1.425 V

      Yes

      3

      MCU - 25, FPGA - 66

      -

      6000 LE

      Tray

      Active

      Active

      5.79

      Details

      Yes

      This product may require additional documentation to export from the United States.

      SmartFusion

      1.5000 V

      0 to 85 °C

      Tray

      A2F500

      125 °C

      -55 °C

      8542.39.00.01

      compliant

      100 MHz

      EBI/EMI, Ethernet, I2C, SPI, UART, USART

      100MHz

      64KB

      ARM® Cortex®-M3

      DMA, POR, WDT

      512 kB

      EBI/EMI, Ethernet, I²C, SPI, UART/USART

      MCU, FPGA

      ARM

      1

      ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

      1 Core

      512KB

      M2S010T-1VF400

      Mfr Part No

      M2S010T-1VF400

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      VFPBGA-400

      YES

      400-VFBGA (17x17)

      400

      M2S010

      ARM Cortex M3

      64 kB

      90

      MICROSEMI CORP

      -

      -

      M2S010T-1VF400

      166 MHz

      1.26 V

      Microchip Technology

      1.14 V

      Yes

      SMD/SMT

      195

      1007 LAB

      12084 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      LFBGA

      VFBGA-400

      BGA400,20X20,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Active

      30

      5.84

      N

      No

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e0

      Tin/Lead (Sn/Pb)

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      240

      0.8 mm

      not_compliant

      S-PBGA-B400

      160

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      160

      1.51 mm

      FIELD PROGRAMMABLE GATE ARRAY

      1

      FPGA - 10K Logic Modules

      9744

      1 Core

      256KB

      17 mm

      17 mm

      M2S090-FCS325

      Mfr Part No

      M2S090-FCS325

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      325-TFBGA, FCBGA

      325-FCBGA (11x13.5)

      M2S090

      ARM Cortex M3

      64 kB

      176

      1.2, 1.5, 1.8, 2.5, 3.3 V

      RISC

      CAN/Ethernet/Serial I2C/SPI/UART/USB

      Yes

      -

      -

      166 MHz

      Microchip Technology

      Yes

      Surface Mount

      1

      180

      7193 LAB

      86316 LE

      Tray

      Active

      N

      This product may require additional documentation to export from the United States.

      Commercial grade

      0 to 85 °C

      Tray

      SmartFusion2

      325

      0.95, 1.05 V

      CAN/Ethernet/Serial

      166MHz

      64 KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      512 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      32 Bit

      Commercial

      FPGA - 90K Logic Modules

      1 Core

      512KB

      ARM Cortex-M3

      M2S010-1VF400

      Mfr Part No

      M2S010-1VF400

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      VFPBGA-400

      YES

      400-VFBGA (17x17)

      400

      M2S010

      ARM Cortex M3

      64 kB

      90

      MICROSEMI CORP

      -

      -

      M2S010-1VF400

      166 MHz

      1.26 V

      Microchip Technology

      1.14 V

      Yes

      SMD/SMT

      195

      1007 LAB

      12084 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      LFBGA

      LFBGA, BGA400,20X20,32

      BGA400,20X20,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Active

      30

      5.84

      N

      No

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e0

      Tin/Lead (Sn/Pb)

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      240

      0.8 mm

      not_compliant

      S-PBGA-B400

      160

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      160

      1.51 mm

      FIELD PROGRAMMABLE GATE ARRAY

      1

      FPGA - 10K Logic Modules

      9744

      1 Core

      256KB

      17 mm

      17 mm

      M2S090T-FGG676

      Mfr Part No

      M2S090T-FGG676

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      676-BGA

      676-FBGA (27x27)

      M2S090

      ARM Cortex M3

      64 kB

      40

      -

      -

      166 MHz

      1.26 V

      Microchip Technology

      1.14 V

      Yes

      425

      7193 LAB

      86316 LE

      Tray

      Active

      Details

      This product may require additional documentation to export from the United States.

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      512 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      STD

      FPGA - 90K Logic Modules

      1 Core

      512KB

      M2S090T-1FGG484

      Mfr Part No

      M2S090T-1FGG484

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      FPBGA-484

      484-FPBGA (23x23)

      M2S090

      ARM Cortex M3

      64 kB

      60

      -

      -

      166 MHz

      Microchip Technology

      Yes

      SMD/SMT

      267

      7193 LAB

      86316 LE

      Tray

      Active

      Details

      This product may require additional documentation to export from the United States.

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      512 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      1

      FPGA - 90K Logic Modules

      1 Core

      512KB

      M2S050-1FCSG325

      Mfr Part No

      M2S050-1FCSG325

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      Production (Last Updated: 2 months ago)

      FCBGA-325

      YES

      325

      325-FCBGA (11x11)

      325

      M2S050

      ARM Cortex M3

      64 kB

      176

      MICROSEMI CORP

      -

      -

      M2S050-1FCSG325

      166 MHz

      1.26 V

      Microchip Technology

      1.14 V

      Yes

      3

      SMD/SMT

      200

      4695 LAB

      56340 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      TFBGA

      FBGA-325

      BGA325,21X21,20

      SQUARE

      GRID ARRAY, THIN PROFILE, FINE PITCH

      Active

      Active

      5.76

      Details

      Yes

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e1

      Tin/Silver/Copper (Sn/Ag/Cu)

      85 °C

      0 °C

      LG-MIN, WD-MIN

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      250

      0.5 mm

      compliant

      40

      S-PBGA-B325

      200

      Not Qualified

      1.2 V

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      200

      1.01 mm

      FIELD PROGRAMMABLE GATE ARRAY

      1

      FPGA - 50K Logic Modules

      56340

      1 Core

      256KB

      11 mm

      11 mm

      M2S050T-FGG484

      Mfr Part No

      M2S050T-FGG484

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      FPBGA-484

      YES

      484-FPBGA (23x23)

      484

      M2S050

      ARM Cortex M3

      64 kB

      60

      MICROSEMI CORP

      -

      -

      M2S050T-FGG484

      166 MHz

      Microchip Technology

      Yes

      3

      SMD/SMT

      267

      4695 LAB

      56340 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      BGA

      FBGA-484

      BGA484,22X22,40

      SQUARE

      GRID ARRAY

      Active

      Active

      40

      5.76

      Details

      Yes

      This product may require additional documentation to export from the United States.

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      e1

      Tin/Silver/Copper (Sn/Ag/Cu)

      8542.39.00.01

      CMOS

      BOTTOM

      BALL

      250

      1 mm

      compliant

      S-PBGA-B484

      267

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      267

      2.44 mm

      FIELD PROGRAMMABLE GATE ARRAY

      STD

      FPGA - 50K Logic Modules

      56340

      1 Core

      256KB

      23 mm

      23 mm

      M2S025TS-FGG484

      Mfr Part No

      M2S025TS-FGG484

      		Microchip Technology Datasheet

      -

      -

      Min: 1

      Mult: 1

      Production (Last Updated: 2 months ago)

      484-BGA

      484-FPBGA (23x23)

      M2S025

      ARM Cortex M3

      64 kB

      60

      -

      -

      166 MHz

      1.26 V

      Microchip Technology

      1.14 V

      Yes

      267

      2308 LAB

      27696 LE

      Tray

      Active

      Details

      This product may require additional documentation to export from the United States.

      1.2000 V

      0 to 85 °C

      Tray

      SmartFusion2

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      STD

      FPGA - 25K Logic Modules

      1 Core

      256KB

      A2F200M3F-FG256

      Mfr Part No

      A2F200M3F-FG256

      		Microchip Datasheet

      -

      -

      Min: 1

      Mult: 1

      256-LBGA

      256-FPBGA (17x17)

      A2F200

      200000

      Cooper

      SKT12516

      1.575 V

      Microchip Technology

      1.425 V

      MCU - 25, FPGA - 66

      Tray

      Active

      1.5000 V

      0 to 85 °C

      SmartFusion®

      80MHz

      64KB

      ARM® Cortex®-M3

      DMA, POR, WDT

      EBI/EMI, Ethernet, I²C, SPI, UART/USART

      MCU, FPGA

      STD

      ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

      256KB

      17

      M2S050-1VF400

      Mfr Part No

      M2S050-1VF400

      		Microchip Datasheet

      -

      -

      Min: 1

      Mult: 1

      400-LFBGA

      YES

      400-VFBGA (17x17)

      Polystyrene

      400

      M2S050

      64 kB

      MICROSEMI CORP

      -

      -

      Brady

      119817

      166 MHz

      1.26 V

      Microchip Technology

      1.14 V

      SMD/SMT

      207

      56340 LE

      85 °C

      Tray

      PLASTIC/EPOXY

      LFBGA

      VFBGA-400

      BGA400,20X20,32

      SQUARE

      GRID ARRAY, LOW PROFILE, FINE PITCH

      Active

      Active

      30

      5.84

      No

      1.26 V

      1.14 V

      1.2 V

      1.2000 V

      0 to 85 °C

      SmartFusion®2

      e0

      Fire/Emergency Signs

      Tin/Lead (Sn/Pb)

      8542.39.00.01

      Field Programmable Gate Arrays

      CMOS

      BOTTOM

      BALL

      240

      0.8 mm

      not_compliant

      S-PBGA-B400

      160

      Not Qualified

      1.2 V

      OTHER

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      160

      1.51 mm

      FIELD PROGRAMMABLE GATE ARRAY

      1

      Emergency Fire Alarm

      FPGA - 50K Logic Modules

      48672

      1 Core

      256KB

      17 mm

      17 mm

      M2S010TS-1VFG256T2

      Mfr Part No

      M2S010TS-1VFG256T2

      		Microchip Datasheet

      -

      -

      Min: 1

      Mult: 1

      256-LBGA

      256-FPBGA (17x17)

      M2S010

      MICROSEMI CORP

      Microsemi Corporation

      M2S010TS-1VFG256T2

      Microchip Technology

      138

      Tray

      Active

      Active

      40

      5.8

      Yes

      1.2000 V

      0 to 85 °C

      Automotive, AEC-Q100, SmartFusion®2

      e1

      Yes

      100 ppm/K

      28 Ohm

      Tin/Silver/Copper (Sn/Ag/Cu)

      0.5 W

      250

      General Purpose

      compliant

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      FIELD PROGRAMMABLE GATE ARRAY

      1

      1

      FPGA - 10K Logic Modules

      256KB

      3.2

      2.5

      M2S050-FGG896

      Mfr Part No

      M2S050-FGG896

      		Microchip Datasheet

      -

      -

      Min: 1

      Mult: 1

      896-BGA

      896-FBGA (31x31)

      M2S050

      10%

      64 kB

      -

      -

      166 MHz

      + 85 C

      Microchip Technology

      0 C

      SMD/SMT

      377

      56340 LE

      Tray

      Active

      1.2000 V

      0 to 85 °C

      SmartFusion®2

      1 uF

      896

      1.2 V

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      STD

      FPGA - 50K Logic Modules

      1 Core

      256KB

      3.2 mm

      3.2 x 2.5 x 2.79 mm

      M2S050T-1FGG896

      Mfr Part No

      M2S050T-1FGG896

      		Microchip Datasheet

      -

      -

      Min: 1

      Mult: 1

      896-BGA

      896-FBGA (31x31)

      M2S050

      64 kB

      -

      -

      166 MHz

      Microchip Technology

      SMD/SMT

      377

      56340 LE

      Tray

      Active

      1.2000 V

      0 to 85 °C

      SmartFusion®2

      166MHz

      64KB

      ARM® Cortex®-M3

      DDR, PCIe, SERDES

      256 kB

      CANbus, Ethernet, I²C, SPI, UART/USART, USB

      MCU, FPGA

      1

      FPGA - 50K Logic Modules

      1 Core

      256KB