The category is 'Embedded - System On Chip (SoC)'
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- Architecture
- Connectivity
- Core Processor
- Flash Size
- Mfr
- Number of I/Os
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- RAM Size
- Package / Case:
1024-BFBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Supplier Device Package | Brand | Factory Pack QuantityFactory Pack Quantity | Manufacturer | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Number of I/Os | Package | Product Status | Operating Temperature | Series | Subcategory | Operating Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Product Type | Primary Attributes | Flash Size | Product Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCVM1302-1LSINBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||
| Mfr Part No XCVM1402-2LSENBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||
| Mfr Part No XCVM1402-1MSINBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||
| Mfr Part No XCVM1402-1LLINBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||
| Mfr Part No XCVM1302-2MLINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | |
| Mfr Part No XCVM1402-2MLENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | 0 C | 424 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | |
| Mfr Part No XCVM1302-2MLENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | 0 C | 316 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | |
| Mfr Part No XCVM1302-2MSINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA |
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XCVM1302-1LSINBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-2LSENBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1MSINBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1LLINBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2MLINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2MLENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2MLENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2MSINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire