The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Number of I/Os
- Operating Temperature
- Package / Case
- Peripherals
- Primary Attributes
- RAM Size
- Series
- Speed
- Flash Size
- Package / Case:
1156-BBGA, FCBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Supplier Device Package | Brand | Factory Pack QuantityFactory Pack Quantity | Manufacturer | Mfr | Mounting | Number of I/Os | Package | Product Status | Qualification | Standard Frequency | Supplier Package | Voltage, Rating | Operating Temperature | Series | Temperature Coefficient | Resistance | Subcategory | Power Rating | Resistor Type | Pin Count | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Series Resistance | Resistance Tolerance | Primary Attributes | Output Level | Flash Size | Product Category | Product Length |
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 | Mfr Part No XCZU55DR-L2FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Xilinx | 1 | Xilinx | AMD Xilinx | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | SOC - Systems on a Chip | 500 mW | High Reliability, MIL-PRF-39017 | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 2 | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | ||||||||||||
| Mfr Part No XCZU57DR-1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Xilinx | 1 | Xilinx | AMD Xilinx | Through Hole | - | Tray | Active | 5 MHz | Metal DIP | -20 to 70 °C | Zynq® UltraScale+™ RFSoC DR | SOC - Systems on a Chip | 4 | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | HCMOS/TTL | - | SoC FPGA | ||||||||||
| Mfr Part No XCZU57DR-1FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Xilinx | 1 | Xilinx | AMD Xilinx | - | Tray | Active | MIL-PRF-39017 | 200 V | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 100.0000 ppm/°C | 2 kOhm | SOC - Systems on a Chip | 0.125 W | High Reliability, MIL-PRF-39017 | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 2 | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | 4.75 | |||||||
| Mfr Part No XCZU57DR-L2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Xilinx | 1 | Xilinx | AMD Xilinx | Surface Mount | - | Tray | Active | 12.8 MHz | CSMD | -20 to 70 °C | Zynq® UltraScale+™ RFSoC DR | SOC - Systems on a Chip | 4 | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 50 Ohm | Zynq® UltraScale+™ RFSoC | - | SoC FPGA |
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XCZU55DR-L2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU57DR-1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU57DR-1FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU57DR-L2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire