The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Number of I/Os
- Operating Temperature
- Package / Case
- Peripherals
- Primary Attributes
- RAM Size
- Series
- Speed
- Length
- Package / Case:
225-LFBGA, CSPBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Shape | Antenna Connector Type | Base Product Number | Brand | Cable Types | Center Frequency | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Instruction Set Architecture | Interface Type | Manufacturer | Mechanical Style | Mfr | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Package | Product Status | Protocol - Sub GHz | Protocol - WiFi - 802.11 | Supplier Package | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Applications | Additional Feature | HTS Code | Subcategory | Power Rating | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Style | Resistor Type | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Termination Style | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Plating | Attachment Method | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Data Bus Width | Product Type | Gain | Core Architecture | Boundary Scan | Speed Grade | RAM (words) | Resistance Tolerance | Primary Attributes | Number of Bands | Bus Compatibility | Flash Size | Product | UV Erasable | Product Category | Product Length | Device Core | Height | Height Seated (Max) | Length | Width | Plating Thickness | Radiation Hardening | REACH SVHC | RoHS Status |
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 | Mfr Part No XC7Z010-1CLG225I | Xilinx Inc. | Datasheet | 356 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 225-LFBGA, CSPBGA | YES | 225 | 86 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z010 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-1CLG225C | Xilinx Inc. | Datasheet | 40 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 225-LFBGA, CSPBGA | YES | 225 | 86 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | XC7Z010 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG225C | Xilinx Inc. | Datasheet | 3600 |
| Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 54 | 0°C~85°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 30 | S-PBGA-B225 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | 1.5mm | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-2CLG225I | Xilinx Inc. | Datasheet | 1890 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 225-LFBGA, CSPBGA | YES | 225 | 86 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 766MHz | 30 | XC7Z010 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | No | No SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-3CLG225E | Xilinx Inc. | Datasheet | 1200 |
| Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 225 | 86 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z010 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG225I | Xilinx Inc. | Datasheet | 1584 |
| Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 54 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 30 | S-PBGA-B225 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG225I | Xilinx Inc. | Datasheet | 1280 |
| Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 54 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 30 | S-PBGA-B225 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG225E | Xilinx Inc. | Datasheet | 2400 | - | Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 54 | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 30 | S-PBGA-B225 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-L1CLG225I | Xilinx Inc. | Datasheet | 8 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 225-LFBGA, CSPBGA | 86 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 667MHz | 30 | S-PBGA-B225 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XA7Z010-1CLG225Q | Xilinx Inc. | Datasheet | 1280 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 225-LFBGA, CSPBGA | 225 | 86 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Active | 3 (168 Hours) | 225 | EAR99 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 1V | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 28K Logic Cells | N | 1.5mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z010-3CLG225E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z010 | AMD | 86 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 866MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-1CLG225C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z010 | AMD | 86 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG225I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | Beryllium Copper | -- | XC7Z007 | AMD | 54 | Tray | Active | 121°C | Slot Mount | Active | Fingerstock | Zinc + Clear Chromate | Slot | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | 0.130 (3.30mm) | 0.975 (24.77mm) | 0.370 (9.40mm) | 299.21µin (7.60µm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-L1CLG225I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z010 | 1.2, 3.3 V | RISC | CAN/I2C/SPI/UART/USB | AMD | Surface Mount | 2 | 86 | Tray | Active | CSBGA | -40 to 100 °C | Zynq®-7000 | 100.0000 ppm/°C | 1.21 kOhm | 1.0000 W | High Reliability, MIL-PRF-39017 | 225 | 3.3 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | 1 | Artix™-7 FPGA, 28K Logic Cells | - | 15.87 | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG225C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z007 | AMD | 54 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG225I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z007 | AMD | 54 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG225E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | - | XC7Z007 | TE Connectivity / Laird External Antennas | - | 460 MHz | 1 | TE Connectivity | Whip | AMD | Magnetic Mount | 54 | Tray | Active | UHF | - | 0°C ~ 100°C (TJ) | QW | Passive Antenna | Mobile Antennas | Antennas | Straight with Base | - | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | GPS Antennas - GNSS, GLONASS, Galileo, Beidou | Unity | Artix™-7 FPGA, 23K Logic Cells | 1 Band | - | Outdoor Antennas | Antennas | 6 in | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-1CL225I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z010 | AMD | 84 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XA7Z010-1CLG225Q | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XA7Z010 | AMD | 86 | Tray | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, Zynq®-7000 XA | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - |
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XC7Z010-1CLG225I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z010-1CLG225C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z007S-1CLG225C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
59.700972
-
XC7Z010-2CLG225I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z010-3CLG225E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
97.724940
-
XC7Z007S-1CLG225I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
32.215545
-
XC7Z007S-2CLG225I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
71.108316
-
XC7Z007S-2CLG225E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z010-L1CLG225I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
87.126782
-
XA7Z010-1CLG225Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
87.016916
-
XC7Z010-3CLG225E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z010-1CLG225C
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z007S-1CLG225I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z010-L1CLG225I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z007S-1CLG225C
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z007S-2CLG225I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z007S-2CLG225E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z010-1CL225I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XA7Z010-1CLG225Q
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire