The category is 'Embedded - System On Chip (SoC)'
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- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Approvals | Base Product Number | Clock Frequency-Max | Core | Data RAM Size | Device Logic Gates | Device System Gates | Display | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Operation | Outside Length | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Output | JESD-30 Code | Function | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Terminal Type | Core Architecture | Speed Grade | Primary Attributes | Number of Bands | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Contacts | IP Rating | Length | Width |
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 | Mfr Part No M2S010-VFG256 | Microchip Technology | Datasheet | 4 |
| Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010-VFG256 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0.406091 oz | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VFG256 | Microchip Technology | Datasheet | 1979 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S025 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S025-VFG256 | 166 MHz | Microchip Technology | Yes | 3 | 138 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-VFG256 | Microchip Technology | Datasheet | 1918 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | 138 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-VFG256I | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S025 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S025T-VFG256I | 166 MHz | Microchip Technology | Yes | 3 | 138 | 2308 LAB | 27696 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VFG256I | Microchip | Datasheet | 131 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-VFG256 | Microchip | Datasheet | 115 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 256-LBGA | 256 | 256-FPBGA (17x17) | CE, CSA, UL | M2S010 | 64 kB | - | - | Cutler Hammer, Div of Eaton Co | 10250T112-2 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | SMD/SMT | 138 | 12084 LE | Momentary | Tray | Active | Compliant | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 85 °C | 0 °C | 1.2 V | 166MHz | 50 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Screw | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | 2NO | IP65 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG256I | Microchip | Datasheet | 32 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 138 | 27696 LE | Tray | Active | Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256T2 | Microchip | Datasheet | 2150 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S025 | No Display | Honeywell | C7772G1004/U | Microchip Technology | 138 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | Indoor | 10 kOhm NTC | Temperature | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | Klockner-Moeller, Div of Eaton | DIL2MKV-00(24V50/60HZ) | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256 | Microchip | Datasheet | 36 | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | 161 | 6060 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1VFG256I | Microchip | Datasheet | 20 |
| Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010-1VFG256I | Microchip Technology | 3 | 138 | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG256I | Microchip | Datasheet | 36 | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Continental Belt | 11/5V2650 | Microchip Technology | MCU - 25, FPGA - 66 | 265 Inches | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG256I | Microchip | Datasheet | 36 | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A2F200 | 100 MHz | 200000 | 200000 | MICROSEMI CORP | ABB | ACH580-BCR-027A-6+E213+K465+L512 | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 25, FPGA - 66 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 100 °C | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A2F500 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-1FGG256I | Microchip Technology | 3 | MCU - 25, FPGA - 66 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VFG256T2 | Microchip | Datasheet | 22 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | MICROSEMI CORP | Microsemi Corporation | M2S005S-1VFG256T2 | Microchip Technology | 161 | Tray | , | Active | Active | 40 | 5.8 | Yes | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | A2F500 | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-1FG256M | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | Active | 2.54 | Non-Compliant | No | -55°C ~ 125°C (TJ) | SmartFusion® | 125 °C | -55 °C | 8542.39.00.01 | unknown | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-VFG256I | Microchip Technology | Datasheet | 2141 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | 138 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256I | Microchip Technology | Datasheet | 1696 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB |
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M2S010-VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
38.458812
-
M2S025-VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
143.226219
-
M2S025T-VFG256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
46.619806
-
M2S010T-VFG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
207.144895
-
A2F200M3F-1FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-VFG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
76.910595
-
A2F200M3F-1FG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FGG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FGG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
57.597934
-
A2F500M3G-1FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FG256M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-VFG256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire