The category is 'Embedded - System On Chip (SoC)'
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- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Contact Finish Mating | Core | Data RAM Size | Device Logic Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Additional Feature | HTS Code | Fastening Type | Subcategory | Power Rating | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Supply Voltage | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Speed | RAM Size | Shell Size, MIL | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Core Architecture | Total RAM Bits | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Resistance Tolerance | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Mesh Length | Product Category | Product Length | Product Width | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No M2S025-1VFG256I | Microchip Technology | Datasheet | 1618 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | 138 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG256M | Microchip Technology | Datasheet | 745 | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FGG256M | 100 MHz | 1.575 V | Microchip Technology | 1.425 V | Yes | 3 | MCU - 25, FPGA - 66 | - | 6000 LE | Tray | Active | Active | 5.79 | Details | Yes | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 125 °C | -55 °C | 8542.39.00.01 | compliant | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | 200000 | Cooper | SKT12516 | 1.575 V | Microchip Technology | 1.425 V | MCU - 25, FPGA - 66 | Tray | Active | 1.5000 V | 0 to 85 °C | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 17 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VFG256I | Microchip | Datasheet | 127 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | Microchip Technology | MSL 3 - 168 hours | 161 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 191Kbit | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG256T2 | Microchip | Datasheet | 29 | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010TS-1VFG256T2 | Microchip Technology | 138 | Tray | Active | Active | 40 | 5.8 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | 100 ppm/K | 28 Ohm | Tin/Silver/Copper (Sn/Ag/Cu) | 0.5 W | 250 | General Purpose | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | 1 | FPGA - 10K Logic Modules | 256KB | 3.2 | 2.5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG256 | Microchip | Datasheet | 1742 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount, Through Hole | 256-LBGA | - | Die Cast | 256-FPBGA (17x17) | T 3303 | Silver | 64 kB | - | - | 166 MHz | Amphenol Tuchel Industrial | SMD/SMT | 138 | 27696 LE | Bulk | Metal | Active | Compliant | 250V | -40°C ~ 100°C | C091A | Solder | Receptacle, Female Sockets | 4 | Silver | Threaded | 10A | Keyed | Shielded | IP40 | Nickel | M16-4 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG256I | Microchip | Datasheet | 1875 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-VFG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | 64 kB | MICROSEMI CORP | - | - | GE - General Electric | M2S010T-VFG256I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 138 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VFG256I | Microchip | Datasheet | 2367 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | Microchip Technology / Atmel | 64 kB | 119 | - | - | Microchip | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | SMD/SMT | 138 I/O | 2308 LAB | 27696 LE | Tray | Active | Non-Compliant | 8542390000 | 1.2000 V | 0.241494 oz | -40 to 100 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | A2F500 | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-FGG256M | PEI-Genesis | 3 | MCU - 25, FPGA - 66 | Bulk | Active | Active | 5.81 | Compliant | Yes | -55°C ~ 125°C (TJ) | * | 125 °C | -55 °C | compliant | 80 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG256 | Microchip | Datasheet | 28 | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A2F200M3F-1FG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | YES | 256 | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 2009 | SmartFusion® | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.5V | 1mm | 100MHz | 20 | A2F200 | 66 | 1.575V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 3mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 200000 | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 1.7mm | 17mm | 17mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-VFG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256I | Microsemi Corporation | Datasheet | 77 | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | YES | 161 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 161 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FG256 | Microsemi Corporation | Datasheet | 543 | - | Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 256-LBGA | 256 | MCU - 25, FPGA - 66 | 0°C~85°C TJ | Tray | 2012 | SmartFusion® | Active | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | BOTTOM | BALL | 225 | 1.5V | 1mm | 80MHz | 30 | A2F200 | 66 | Not Qualified | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 2mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 200000 | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 1.7mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | YES | 256 | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.5V | 1mm | 80MHz | 20 | A2F500M3G | 66 | Not Qualified | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 2mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 500000 | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 1.7mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 2mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 500000 | 100MHz | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256 | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | 100MHz | 30 | A2F500M3G | 66 | Not Qualified | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 500000 | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 1.7mm | 17mm | 17mm | RoHS Compliant | Lead Free |
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M2S025-1VFG256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
148.532486
-
A2F500M3G-1FGG256M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
40.672212
-
M2S010TS-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-1VFG256
Microchip
Package:Embedded - System On Chip (SoC)
143.652787
-
A2F500M3G-FGG256I
Microchip
Package:Embedded - System On Chip (SoC)
133.700487
-
M2S010T-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FGG256M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FGG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-FG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire