The category is 'Embedded - System On Chip (SoC)'
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- Connectivity
- Core Processor
- Flash Size
- Number of I/Os
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- Primary Attributes
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- Series
- Speed
- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Programmable Logic Type | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No A2F060M3E-FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256 | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 8542.39.00.01 | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 256-LBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 161 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256 | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.5V | 1mm | 100MHz | 30 | A2F060M3E | 66 | Not Qualified | 1.575V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | 1536 CLBS, 60000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 60000 | 128KB | 1.7mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG256IX94 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | A2F500M3G | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 125°C | -55°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 125°C | -55°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256 | MCU - 25, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | 80MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2009 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | 128KB | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2 Weeks | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 8542.39.00.01 | unknown | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-VFG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | yes | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||||||||
| Mfr Part No M2S025-1VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LBGA | YES | 138 | 0°C~85°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LBGA | YES | 138 | 0°C~85°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256 | MCU - 25, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | 8542.39.00.01 | 100MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant |
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A2F060M3E-FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FG256IX94
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-1VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FGG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-FG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F060M3E-1FG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-1VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-1VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire