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Embedded - System On Chip (SoC) (48)

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Package / Case:
325-TFBGA, FCBGA

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Lifecycle Status	Mount	Mounting Type	Package / Case	Surface Mount	Mounting Feature	Contact Shape	Shell Material	Supplier Device Package	Material	Insert Material	Number of Terminals	Approvals	Base Product Number	Contact Materials	Contact Sizes	Core	Country of Origin	Data RAM Size	ECCN	Factory Pack QuantityFactory Pack Quantity	I/O Voltage	Ihs Manufacturer	Instruction Set Architecture	Interface Type	JTAG Support	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Mfr	Minimum Operating Supply Voltage	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Samacsys Description	Schedule B	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Timing Range	Tradename	Typical Operating Supply Voltage	Usage Level	Voltage Rating AC	Voltage Rating DC	Voltage, Rating	Operating Temperature	Packaging	Series	Tolerance	JESD-609 Code	Part Status	Termination	Connector Type	Type	Number of Positions	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Applications	Additional Feature	HTS Code	Capacitance	Fastening Type	Subcategory	Contact Type	Technology	Terminal Position	Orientation	Terminal Form	Shielding	Peak Reflow Temperature (Cel)	Ingress Protection	Terminal Pitch	Reach Compliance Code	Current Rating	Time@Peak Reflow Temperature-Max (s)	Shell Finish	Pin Count	Shell Size - Insert	Contact Finish	Termination Style	JESD-30 Code	Number of Outputs	Qualification Status	Actuator Type	Housing Color	Operating Supply Voltage	Panel Cutout Dimensions	Power Supplies	Temperature Grade	Note	Interface	Speed	RAM Size	Shell Size, MIL	Core Processor	Illumination	Peripherals	Program Memory Size	Connectivity	Number of Decks	Architecture	Data Bus Width	Number of Inputs	Operating Force	Seated Height-Max	Programmable Logic Type	Includes	Contact Timing	Screening Level	Index Stops	Circuit per Deck	Depth Behind Panel	Speed Grade	Number of Poles per Deck	Angle of Throw	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Mode of Operation	Language	Features	Contacts	Device Core	IP Rating	Height Seated (Max)	Length	Width	Actuator Length	Material Flammability Rating	Lead Free
Mfr Part No M2S050T-1FCS325	Microchip	Datasheet	2261 In Stock	1: $182.056442 10: $171.751360 100: $162.029585 500: $152.858099 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)		Panel Mount	325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325		M2S050	Silver Alloy				64 kB				MICROSEMI CORP				-	-	Microsemi Corporation	M2S050T-1FCS325	166 MHz		Microchip Technology					SMD/SMT		200		56340 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.81	Non-Compliant	No				1.26 V	1.14 V	1.2 V					115V	28V		0°C ~ 85°C (TJ)		42		e0	Active				4	Tin/Lead (Sn/Pb)				LG-MIN, WD-MIN	8542.39.00.01			Field Programmable Gate Arrays		CMOS	BOTTOM		BALL		240		0.5 mm	not_compliant	1A (AC/DC)					--	Solder Lug	S-PBGA-B325	200	Not Qualified	Flatted (6.35mm Dia)			--	1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	3	MCU, FPGA		200	5.761 ~ 83gfm	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY		Non-Shorting (BBM)		Fixed	DP4T	43.61mm		2	36°	FPGA - 50K Logic Modules	56340	1 Core	256KB			--					11 mm	11 mm	11.10mm
Mfr Part No M2S060TS-FCSG325	Microchip	Datasheet	1851 In Stock	-	Min: 1 Mult: 1				325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325		M2S060					64 kB				MICROSEMI CORP				-	-	Microsemi Corporation	M2S060TS-FCSG325	166 MHz		Microchip Technology			3				200		56520 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.81		Yes				1.26 V	1.14 V	1.2 V								0°C ~ 85°C (TJ)		SmartFusion®2		e1						Tin/Silver/Copper (Sn/Ag/Cu)				LG-MIN, WD-MIN	8542.39.00.01			Field Programmable Gate Arrays		CMOS	BOTTOM		BALL		250		0.5 mm	compliant								S-PBGA-B325	200	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY										FPGA - 60K Logic Modules	56520	1 Core	256KB								11 mm	11 mm
Mfr Part No M2S060T-FCSG325I	Microchip	Datasheet	1987 In Stock	-	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)		DIN Rail,Surface	325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325	CSA, UL	M2S060									MICROSEMI CORP						Syrelec, Brand of Crouzet Control	SHS1S24A		1.26 V	Microchip Technology	1.14 V		3				200				Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active		2.36	No	Yes		8542390000		1.26 V	1.14 V	1.2 V	1		1.2000 V					-40 to 100 °C		SmartFusion®2		e1		0.250 in Flat Blade				Tin/Silver/Copper (Sn/Ag/Cu)				LG-MIN, WD-MIN				Field Programmable Gate Arrays		CMOS	BOTTOM		BALL		250		0.5 mm	compliant		40						S-PBGA-B325	200	Not Qualified					1.2 V				166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY							STD			FPGA - 60K Logic Modules	56520		256KB	Interval			Solid State		IP66		11 mm	11 mm			Lead Free
Mfr Part No M2S090T-FCSG325I	Microchip	Datasheet	2276 In Stock	-	Min: 1 Mult: 1				325-TFBGA, FCBGA	YES				325-FCBGA (11x13.5)			325		M2S090					64 kB				MICROSEMI CORP				-	-	Microsemi Corporation	M2S090T-FCSG325I	166 MHz	1.26 V	Microchip Technology	1.14 V		3		SMD/SMT		180		86316 LE		Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.74		Yes				1.26 V	1.14 V	1.2 V			1.2000 V					-40 to 100 °C		SmartFusion®2		e1						Tin/Silver/Copper (Sn/Ag/Cu)				LG-MIN, WD-MIN	8542.39.00.01			Field Programmable Gate Arrays		CMOS	BOTTOM		BALL		250		0.5 mm	compliant								R-PBGA-B325	180	Not Qualified					1.2 V				166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		180		1.16 mm	FIELD PROGRAMMABLE GATE ARRAY							STD			FPGA - 90K Logic Modules	86316	1 Core	512KB								13.5 mm	11 mm
Mfr Part No M2S060-1FCS325	Microchip	Datasheet	1968 In Stock	1: $168.960119 10: $159.396338 100: $150.373904 500: $141.862174 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)		Free Hanging (In-Line)	325-TFBGA, FCBGA		-	Circular	Aluminum	325-FCBGA (11x11)		-			D38999/26ZA		22D			64 kB								-	-			166 MHz		Amphenol Aerospace Operations							200		56520 LE		Bulk								Active			Non-Compliant															-65°C ~ 175°C		Military, MIL-DTL-38999 Series III, Tri-Start™ TV					Plug Housing	For Female Sockets	6								Threaded		Crimp			A		Shielded		Environment Resistant					Zinc Nickel		9-35							Black					Contacts Not Included		166MHz	64KB	A	ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA						-									FPGA - 60K Logic Modules		1 Core	256KB			Coupling Nut, Self Locking								-
Mfr Part No M2S060-1FCSG325I	Microchip	Datasheet	1603 In Stock	1: $188.755069 10: $178.070819 100: $167.991339 500: $158.482395 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325		M2S060					64 kB				MICROSEMI CORP				-	-	Microsemi Corporation	M2S060-1FCSG325I	166 MHz		KYOCERA AVX			3				200		56520 LE		Bulk	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active		5.8	Compliant	Yes				1.26 V	1.14 V	1.2 V								-40°C ~ 100°C (TJ)		*		e1						Tin/Silver/Copper (Sn/Ag/Cu)				LG-MIN, WD-MIN	8542.39.00.01			Field Programmable Gate Arrays		CMOS	BOTTOM		BALL		250		0.5 mm	compliant		40						S-PBGA-B325	200	Not Qualified					1.2 V				166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY										FPGA - 60K Logic Modules	56520	1 Core	256KB								11 mm	11 mm
Mfr Part No M2S060T-1FCSG325I	Microchip	Datasheet	2240 In Stock	1: $202.740066 10: $191.264214 100: $180.437937 500: $170.224469 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)	Through Hole		325-TFBGA, FCBGA					325-FCBGA (11x11)					M2S060					64 kB								-	-			166 MHz		Microchip Technology							200		56520 LE		Tray								Active			Non-Compliant														13 kV	-40°C ~ 100°C (TJ)	Bulk	SmartFusion®2	5 %								100 °C	-55 °C				5 nF																															166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA															FPGA - 60K Logic Modules		1 Core	256KB							45.0088 mm
Mfr Part No M2S090T-1FCS325I	Microchip	Datasheet	2019 In Stock	-	Min: 1 Mult: 1				325-TFBGA, FCBGA					325-FCBGA (11x13.5)					M2S090					64 kB								-	-			166 MHz		PEI-Genesis					SMD/SMT		180		86316 LE		Bulk								Active																		-40°C ~ 100°C (TJ)		*																																													166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA															FPGA - 90K Logic Modules		1 Core	512KB
Mfr Part No M2S090T-FCS325	Microchip Technology	Datasheet	1844 In Stock	1: $244.143980 10: $230.324510 100: $217.287273 500: $204.987994 View all price	Min: 1 Mult: 1				325-TFBGA, FCBGA	YES				325-FCBGA (11x13.5)			325		M2S090			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S090T-FCS325	166 MHz		Microchip Technology		Yes					180	7193 LAB	86316 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.83	N	No			This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V								0°C ~ 85°C (TJ)	Tray	SmartFusion2		e0						Tin/Lead (Sn/Pb)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		240		0.5 mm	not_compliant								R-PBGA-B325	180	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		180		1.16 mm	FIELD PROGRAMMABLE GATE ARRAY										FPGA - 90K Logic Modules	86316	1 Core	512KB								13.5 mm	11 mm
Mfr Part No M2S025TS-FCSG325	Microchip Technology	Datasheet	1968 In Stock	1: $121.140781 10: $114.283756 100: $107.814864 500: $101.712136 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA					325-FCBGA (11x11)					M2S025			ARM Cortex M3		64 kB		176						-	-			166 MHz		Microchip Technology		Yes					180	2308 LAB	27696 LE		Tray								Active			Details				This product may require additional documentation to export from the United States.											0°C ~ 85°C (TJ)	Tray	SmartFusion2																																													166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA															FPGA - 25K Logic Modules		1 Core	256KB
Mfr Part No M2S090-FCSG325	Microchip Technology	Datasheet	1922 In Stock	1: $206.480152 10: $194.792596 100: $183.766601 500: $173.364717 View all price	Min: 1 Mult: 1				325-TFBGA, FCBGA	YES				325-FCBGA (11x13.5)			325		M2S090			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S090-FCSG325	166 MHz		Microchip Technology		Yes	3				180	7193 LAB	86316 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.78	Details	Yes	FPGA - Field Programmable Gate Array SmartFusion2		This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V								0°C ~ 85°C (TJ)	Tray	SmartFusion2		e1						Tin/Silver/Copper (Sn/Ag/Cu)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		250		0.5 mm	compliant								R-PBGA-B325	180	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		180		1.16 mm	FIELD PROGRAMMABLE GATE ARRAY										FPGA - 90K Logic Modules	86316	1 Core	512KB								13.5 mm	11 mm
Mfr Part No M2S090TS-FCS325	Microchip Technology	Datasheet	2092 In Stock	1: $273.522978 10: $258.040545 100: $243.434477 500: $229.655166 View all price	Min: 1 Mult: 1				325-TFBGA, FCBGA	YES				325-FCBGA (11x13.5)			325		M2S090			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S090TS-FCS325	166 MHz		Microchip Technology		Yes					180	7193 LAB	86316 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.83	N	No			This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V			1.2000 V					0 to 85 °C	Tray	SmartFusion2		e0						Tin/Lead (Sn/Pb)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		240		0.5 mm	not_compliant								R-PBGA-B325	180	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		180		1.16 mm	FIELD PROGRAMMABLE GATE ARRAY							STD			FPGA - 90K Logic Modules	86316	1 Core	512KB								13.5 mm	11 mm
Mfr Part No M2S060-FCSG325	Microchip Technology	Datasheet	2103 In Stock	1: $139.864014 10: $131.947183 100: $124.478475 500: $117.432524 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325		M2S060			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S060-FCSG325	166 MHz	1.26 V	Microchip Technology	1.14 V	Yes	3				200	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.81	Details	Yes			This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V		SmartFusion2	1.2000 V					0 to 85 °C	Tray	SmartFusion2		e1						Tin/Silver/Copper (Sn/Ag/Cu)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		250		0.5 mm	compliant								S-PBGA-B325	200	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY							STD			FPGA - 60K Logic Modules	56520	1 Core	256KB								11 mm	11 mm
Mfr Part No M2S060TS-1FCS325	Microchip Technology	Datasheet	1658 In Stock	1: $203.643051 10: $192.116086 100: $181.241590 500: $170.982632 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325		M2S060			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S060TS-1FCS325	166 MHz		Microchip Technology		Yes					200	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.88	N	No			This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V		SmartFusion2						0°C ~ 85°C (TJ)	Tray	SmartFusion2		e0						Tin/Lead (Sn/Pb)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		240		0.5 mm	not_compliant								S-PBGA-B325	200	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY										FPGA - 60K Logic Modules	56520	1 Core	256KB								11 mm	11 mm
Mfr Part No M2S060T-1FCS325I	Microchip Technology	Datasheet	2019 In Stock	-	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325		M2S060			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S060T-1FCS325I	166 MHz		Microchip Technology		Yes					200	4710 LAB	56520 LE		Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.87	N	No			This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V		SmartFusion2						-40°C ~ 100°C (TJ)	Tray	SmartFusion2		e0						Tin/Lead (Sn/Pb)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		240		0.5 mm	not_compliant								S-PBGA-B325	200	Not Qualified					1.2 V				166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY										FPGA - 60K Logic Modules	56520	1 Core	256KB								11 mm	11 mm
Mfr Part No M2S090-FCS325	Microchip Technology	Datasheet	1862 In Stock	1: $206.949476 10: $195.235355 100: $184.184297 500: $173.758771 View all price	Min: 1 Mult: 1				325-TFBGA, FCBGA					325-FCBGA (11x13.5)					M2S090			ARM Cortex M3		64 kB		176	1.2, 1.5, 1.8, 2.5, 3.3 V		RISC	CAN/Ethernet/Serial I2C/SPI/UART/USB	Yes	-	-			166 MHz		Microchip Technology		Yes		Surface Mount		1	180	7193 LAB	86316 LE		Tray								Active			N				This product may require additional documentation to export from the United States.							Commercial grade				0 to 85 °C	Tray	SmartFusion2																														325									0.95, 1.05 V					CAN/Ethernet/Serial	166MHz	64 KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	32 Bit							Commercial							FPGA - 90K Logic Modules		1 Core	512KB					ARM Cortex-M3
Mfr Part No M2S060T-FCS325I	Microchip	Datasheet	2060 In Stock	-	Min: 1 Mult: 1				325-TFBGA, FCBGA					325-FCBGA (11x11)	Polystyrene				M2S060				US	64 kB	EAR99							-	-			166 MHz		Microchip Technology							200		56520 LE		Tray								Active																		-40°C ~ 100°C (TJ)		SmartFusion®2											Facility Identification																																		166MHz	64KB		ARM® Cortex®-M3	Not Illuminated	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA															FPGA - 60K Logic Modules		1 Core	256KB		English
Mfr Part No M2S060T-1FCS325	Microchip Technology	Datasheet	1865 In Stock	1: $199.674672 10: $188.372333 100: $177.709748 500: $167.650705 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325		M2S060			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S060T-1FCS325	166 MHz		Microchip Technology		Yes					200	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.86	N	No			This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V		SmartFusion2						0°C ~ 85°C (TJ)	Tray	SmartFusion2		e0						Tin/Lead (Sn/Pb)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		240		0.5 mm	not_compliant								S-PBGA-B325	200	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY										FPGA - 60K Logic Modules	56520	1 Core	256KB								11 mm	11 mm
Mfr Part No M2S050-FCS325	Microchip Technology	Datasheet	2367 In Stock	1: $138.830361 10: $130.972039 100: $123.558527 500: $116.564648 View all price	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA	YES				325-FCBGA (11x11)			325		M2S050			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S050-FCS325	166 MHz		Microchip Technology		Yes					200	4695 LAB	56340 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.81	N	No			This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V								0°C ~ 85°C (TJ)	Tray	SmartFusion2		e0						Tin/Lead (Sn/Pb)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		240		0.5 mm	not_compliant								S-PBGA-B325	200	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY										FPGA - 50K Logic Modules	56340	1 Core	256KB								11 mm	11 mm			Contains Lead
Mfr Part No M2S090TS-FCSG325	Microchip Technology	Datasheet	2244 In Stock	-	Min: 1 Mult: 1				325-TFBGA, FCBGA	YES				325-FCBGA (11x13.5)			325		M2S090			ARM Cortex M3		64 kB		176		MICROSEMI CORP				-	-		M2S090TS-FCSG325	166 MHz		Microchip Technology		Yes	3				180	7193 LAB	86316 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.8	Details	Yes			This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V			1.2000 V					0 to 85 °C	Tray	SmartFusion2		e1						Tin/Silver/Copper (Sn/Ag/Cu)				LG-MIN, WD-MIN	8542.39.00.01					CMOS	BOTTOM		BALL		250		0.5 mm	compliant								R-PBGA-B325	180	Not Qualified					1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		180		1.16 mm	FIELD PROGRAMMABLE GATE ARRAY							STD			FPGA - 90K Logic Modules	86316	1 Core	512KB								13.5 mm	11 mm

M2S050T-1FCS325

Microchip

Package:Embedded - System On Chip (SoC)

182.056442
M2S060TS-FCSG325

Microchip

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S060T-FCSG325I

Microchip

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S090T-FCSG325I

Microchip

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S060-1FCS325

Microchip

Package:Embedded - System On Chip (SoC)

168.960119
M2S060-1FCSG325I

Microchip

Package:Embedded - System On Chip (SoC)

188.755069
M2S060T-1FCSG325I

Microchip

Package:Embedded - System On Chip (SoC)

202.740066
M2S090T-1FCS325I

Microchip

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S090T-FCS325

Microchip Technology

Package:Embedded - System On Chip (SoC)

244.143980
M2S025TS-FCSG325

Microchip Technology

Package:Embedded - System On Chip (SoC)

121.140781
M2S090-FCSG325

Microchip Technology

Package:Embedded - System On Chip (SoC)

206.480152
M2S090TS-FCS325

Microchip Technology

Package:Embedded - System On Chip (SoC)

273.522978
M2S060-FCSG325

Microchip Technology

Package:Embedded - System On Chip (SoC)

139.864014
M2S060TS-1FCS325

Microchip Technology

Package:Embedded - System On Chip (SoC)

203.643051
M2S060T-1FCS325I

Microchip Technology

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S090-FCS325

Microchip Technology

Package:Embedded - System On Chip (SoC)

206.949476
M2S060T-FCS325I

Microchip

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S060T-1FCS325

Microchip Technology

Package:Embedded - System On Chip (SoC)

199.674672
M2S050-FCS325

Microchip Technology

Package:Embedded - System On Chip (SoC)

138.830361
M2S090TS-FCSG325

Microchip Technology

Package:Embedded - System On Chip (SoC)

Price: please inquire

Embedded - System On Chip (SoC) (48)