The category is 'Embedded - System On Chip (SoC)'
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- Architecture
- Base Product Number
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- Core Processor
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- Primary Attributes
- Package / Case:
325-TFBGA, FCBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Housing Material | Shape | Number of Terminals | Contact Material - Mating | Contact Material - Post | Board Material | Base Product Number | Contact Finish Mating | Core | Country of Origin | Data RAM Size | ECCN | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Type | Terminal Finish | Applications | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Time@Peak Reflow Temperature-Max (s) | Pitch - Mating | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Contact Finish - Post | Operating Supply Voltage | Power Supplies | Interface | Plating | Attachment Method | Speed | RAM Size | Core Processor | Illumination | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Screening Level | Speed Grade | Termination Post Length | Pitch - Post | Convert From (Adapter End) | Convert To (Adapter End) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Language | Features | Device Core | Height | Length | Width | Plating Thickness | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating |
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 | Mfr Part No M2S090-FCS325 | Microchip Technology | Datasheet | 1862 |
| Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x13.5) | M2S090 | ARM Cortex M3 | 64 kB | 176 | 1.2, 1.5, 1.8, 2.5, 3.3 V | RISC | CAN/Ethernet/Serial I2C/SPI/UART/USB | Yes | - | - | 166 MHz | Microchip Technology | Yes | Surface Mount | 1 | 180 | 7193 LAB | 86316 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | Commercial grade | 0 to 85 °C | Tray | SmartFusion2 | 325 | 0.95, 1.05 V | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | Commercial | FPGA - 90K Logic Modules | 1 Core | 512KB | ARM Cortex-M3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCS325I | Microchip | Datasheet | 2060 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | Polystyrene | M2S060 | US | 64 kB | EAR99 | - | - | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | Facility Identification | 166MHz | 64KB | ARM® Cortex®-M3 | Not Illuminated | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | English | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FCSG325I | Microchip | Datasheet | 2267 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | Rectangle | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-FCSG325I | 166 MHz | Microchip Technology | 3 | 200 | 56520 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | -- | e1 | Active | Fabric Over Foam | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | -- | Adhesive | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 0.079 (2.00mm) | 18.000 (457.20mm) | 0.161 (4.10mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FCSG325I | Microchip | Datasheet | 1869 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050T-1FCSG325I | 166 MHz | PEI-Genesis | 3 | SMD/SMT | 200 | 56340 LE | Bulk | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 5.76 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | * | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FCSG325 | Microchip | Datasheet | 2039 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 200 | 56520 LE | Tray | Active | Compliant | 1.2 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-FCSG325I | Microchip | Datasheet | 2396 |
| Min: 1 Mult: 1 | Through Hole | 325-TFBGA, FCBGA | YES | 20 | 325-FCBGA (11x13.5) | -- | 325 | -- | Brass | FR4 Epoxy Glass | M2S090 | -- | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S090-FCSG325I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 180 | 86316 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.74 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | Correct-A-Chip® 352000 | e1 | Active | -- | Solder | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 1A | 0.050 (1.27mm) | R-PBGA-B325 | 180 | Not Qualified | Tin-Lead | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.125 (3.18mm) | 0.100 (2.54mm) | PLCC | DIP, 0.3 (7.62mm) Row Spacing | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | -- | 13.5 mm | 11 mm | -- | -- | -- | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FCSG325 | Microchip | Datasheet | 1880 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | Miscellaneous | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | Compliant | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-FCSG325I | Microchip | Datasheet | 276 |
| Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S025 | 64 kB | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 180 | 27696 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB |
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M2S090-FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
206.949476
-
M2S060T-FCS325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-1FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FCSG325
Microchip
Package:Embedded - System On Chip (SoC)
201.912441
-
M2S090-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
365.103440
-
M2S060-1FCSG325
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
102.735292