The category is 'Embedded - System On Chip (SoC)'
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4-SMD, No Lead
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Base Part Number | Output | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Interface | Memory Size | Load Capacitance | Speed | RAM Size | Operating Mode | Core Processor | Frequency Tolerance | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Speed Grade | Absolute Pull Range (APR) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No A2F200M3FCSG288 | Microsemi Actel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | SG-8101 | EPSON | Tape & Reel (TR) | Active | -40°C ~ 85°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 1.8V ~ 3.3V | 67.4 MHz | ±15ppm | CMOS | Enable/Disable | Crystal | 6.8mA (Typ) | 3.5mA | - | - | 0.055 (1.40mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS057K4F40E3SG | ALTERA | Datasheet | 507 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 1517-FCBGA (40x40) | 1517 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057K4F40E3SG | 1.2 GHz | Suntsu Electronics, Inc. | Yes | SMD/SMT | 696 | 71250 LAB | 570000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 965070 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -20°C ~ 70°C | Tray | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | Active | MHz Crystal | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 19.2 MHz | ±30ppm | S-PBGA-B1517 | 696 | Not Qualified | 100 Ohms | 0.9 V | OTHER | 18pF | 1.5GHz | 256KB | Fundamental | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ±15ppm | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 0.026 (0.65mm) | 40 mm | 40 mm | - | ||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FG484IX456 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | Suntsu Electronics, Inc. | Bulk | Active | -20°C ~ 70°C | SXT324 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | MHz Crystal | 40 MHz | ±25ppm | 40 Ohms | 8pF | Fundamental | ±25ppm | 0.031 (0.80mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U19C8N | ALTERA | Datasheet | 1440 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 484 | 484-UBGA (19x19) | 484 | SG-8101 | INTEL CORP | Intel Corporation | 5CSEBA2U19C8N | EPSON | MCU - 151, FPGA - 66 | 85 °C | Tape & Reel (TR) | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2 | Compliant | Yes | FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 105°C | Tray | SG-8101 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.8V ~ 3.3V | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 12.223 MHz | ±20ppm | 5CSEBA2 | CMOS | S-PBGA-B484 | Standby (Power Down) | Crystal | 6.8mA (Typ) | 66 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | OTHER | 1.1µA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | - | FPGA - 25K Logic Elements | 25000 | -- | 0.051 (1.30mm) | 19 mm | 19 mm | - | ||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-1FFVB1156I | AMD | Datasheet | 521 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1156-FCBGA (35x35) | XCZU9 | AMD | 328 | Tray | Active | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | Active | XO (Standard) | 3.3V | 16MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-1FFVE1924E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1924-FCBGA (45x45) | SG-8101 | EPSON | 668 | Tape & Reel (TR) | Active | -40°C ~ 105°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 1.8V ~ 3.3V | 14.125 MHz | ±20ppm | CMOS | Enable/Disable | Crystal | 6.8mA (Typ) | 3.5mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 0.055 (1.40mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-L2FFVD1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | 2.8V | 6MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-L1SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 625-FCBGA (21x21) | XAZU3 | AMD | 128 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 1.8V | 4MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1L | -- | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VFG256I | Microchip | Datasheet | 86 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 256-FPBGA (14x14) | M2S005 | Microchip Technology / Atmel | 64 kB | 191 kbit | 119 | - | - | Microchip | 166 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | Tray | Active | Details | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | SOC - Systems on a Chip | 3.3V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 36mA | 1.2 V | 31mA | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | -- | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-2FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 900-FCBGA (31x31) | XCZU4 | AMD | 204 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 1.8V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 30mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-3FFVD1760E | AMD | Datasheet | 728 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 1.8V | 125MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 30mA | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L1FBVB900I | AMD | Datasheet | 716 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 1.8V | 98.304MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 30mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5CG-L2SFVC784E | AMD | Datasheet | 700 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | 1.8V | 33.3MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG400I | Microchip | Datasheet | 1804 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 400-VFBGA (17x17) | 400 | M2S025 | Microchip Technology / Atmel | 64 kB | 90 | MICROSEMI CORP | - | - | Microchip | M2S025TS-1VFG400I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 207 | 2308 LAB | 27696 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | e1 | Active | XO (Standard) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | 2.5V | BOTTOM | BALL | 250 | 0.8 mm | compliant | 38MHz | ±10ppm | LVCMOS, LVTTL | S-PBGA-B400 | Standby (Power Down) | MEMS | 33mA | 207 | Not Qualified | 1.2 V | 70µA | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1 | -- | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | SoC FPGA | 0.039 (1.00mm) | 17 mm | 17 mm | -- | ||||||||||||||||||||||||
| Mfr Part No XCZU7CG-L2FBVB900E | AMD | Datasheet | 765 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | 3.3V | 133.333333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 36mA | 31mA | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-1FBVB900E | AMD | Datasheet | 708 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 900-FCBGA (31x31) | XCZU4 | AMD | 204 | Tray | Active | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 2.8V | 26MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H2F34I2SGES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 1152-FCBGA (35x35) | 1152 | 500SAB | INTEL CORP | Intel Corporation | 10AS066H2F34I2SGES | Skyworks Solutions Inc. | 492 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | Obsolete | 5.66 | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 85°C | Tray | Si500S | 0.157 L x 0.126 W (4.00mm x 3.20mm) | Discontinued at Digi-Key | XO (Standard) | 8542.39.00.01 | 3.3V | BOTTOM | BALL | 1 mm | compliant | 70.3125 MHz | ±20ppm | CMOS | S-PBGA-B1152 | Enable/Disable | Crystal | 24mA | INDUSTRIAL | 10.7mA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 660K Logic Elements | -- | 0.035 (0.90mm) | 35 mm | 35 mm | - |
-
A2F200M3FCSG288
Microsemi Actel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS057K4F40E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
3,216.664272
-
M2S090TS-FG484IX456
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA2U19C8N
ALTERA
Package:Embedded - System On Chip (SoC)
94.832552
-
XCZU9CG-1FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
4,437.828078
-
XCZU19EG-1FFVE1924E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-L2FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU3EG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4EV-2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-3FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-L1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,438.364151
-
XCZU5CG-L2SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
119.217709
-
XCZU7CG-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
3,685.985271
-
XCZU4EG-1FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
1,324.742486
-
10AS066H2F34I2SGES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire