The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Flash Size
- Number of I/Os
- Package / Case
- Peripherals
- Primary Attributes
- RAM Size
- Series
- Speed
- Operating Temperature
- Package / Case:
536-LFBGA, CSPBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Screening Level | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Device Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2S150TS-1FCS536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 293 | 12177 LAB | 146124 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCS536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FCS536I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150TS-1FCS536I | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.77 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FCSG536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150TS-1FCSG536 | 166 MHz | Microchip Technology | Yes | 3 | 293 | 12177 LAB | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | compliant | S-PBGA-B536 | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||
| Mfr Part No M2S150-FCSG536I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCS536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150T-1FCS536 | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA536,30X30,20 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | not_compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||
| Mfr Part No M2S150-1FCSG536I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150-1FCSG536I | 166 MHz | Microchip Technology | Yes | 3 | 293 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | ||||||||||||||||||||||
| Mfr Part No M2S150TS-1FCSG536I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | 1.2, 1.5, 1.8, 2.5, 3.3 V | RISC | Yes | - | - | 166 MHz | Microchip Technology | Yes | 1 | 293 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | 536 | 1.2 V | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | Industrial | FPGA - 150K Logic Modules | 1 Core | 512KB | ARM Cortex-M3 | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCS536I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCS536I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 293 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||||
| Mfr Part No M2S150T-FCSG536 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | 64 kB | - | - | 166 MHz | KYOCERA AVX | 293 | 146124 LE | Bulk | Active | 0°C ~ 85°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCSG536EES | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-LFBGA | Microchip Technology | MCU - 136, FPGA - 372 | Tray | Active | 0°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-FCSG536I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | 1.2, 1.5, 1.8, 2.5, 3.3 V | MICROSEMI CORP | RISC | Yes | - | - | M2S150TS-FCSG536I | 166 MHz | Microchip Technology | Yes | 3 | 1 | 293 | 12177 LAB | 146124 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | compliant | 536 | S-PBGA-B536 | 1.2 V | INDUSTRIAL | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | FIELD PROGRAMMABLE GATE ARRAY | Industrial | FPGA - 150K Logic Modules | 1 Core | 512KB | ARM Cortex-M3 | ||||||||||||||
| Mfr Part No M2S150-FCSG536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150-FCSG536 | 166 MHz | Microchip Technology | Yes | 3 | 293 | 12177 LAB | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | ||||||||||||||||||||
| Mfr Part No M2S150-FCS536I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150-FCS536I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 293 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | ||||||||||||||||||
| Mfr Part No M2S150-1FCS536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150-1FCS536 | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | not_compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||
| Mfr Part No M2S150TS-FCSG536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-FCS536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150TS-FCS536 | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | No | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | S-PBGA-B536 | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||
| Mfr Part No M2S150TS-FCS536I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150TS-FCS536I | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | No | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||
| Mfr Part No M2S150-FCS536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCSG536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB |
-
M2S150TS-1FCS536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-FCS536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-1FCS536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-1FCSG536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCS536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-1FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-1FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-FCS536I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-FCSG536
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250T-FCSG536EES
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-FCSG536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-FCS536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-1FCS536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-FCSG536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-FCS536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-FCS536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-FCS536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCSG536
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire