The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Flash Size
- Number of I/Os
- Operating Temperature
- Package / Case
- Peripherals
- Primary Attributes
- RAM Size
- Series
- Speed
- Package / Case:
676-BGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Actuator Material | ActuatorColor | Base Product Number | Contact Materials | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mated Stacking Heights | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Number of Positions | Terminal Finish | Number of Rows | HTS Code | Subcategory | Pitch | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Current Rating | Contact Finish | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Housing Color | Panel Cutout Dimensions | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Number of Decks | Architecture | Mating Cycles | Number of Inputs | Operating Force | Seated Height-Max | Programmable Logic Type | Contact Timing | Max Frequency | Index Stops | Circuit per Deck | Depth Behind Panel | Flat Flex Type | Speed Grade | Connector/Contact Type | Number of Poles per Deck | Cable End Type | Angle of Throw | Locking Feature | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Nominal Input Voltage (AC) | Length | Width | Contact Finish Thickness | Actuator Length | Height Above Board | FFC, FCB Thickness | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2S060TS-1FGG676I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FG676I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FGG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FGG676I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090T-FG676 | 166 MHz | Microchip Technology | Yes | 3 | 425 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.83 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S060T-1FG676 | 166 MHz | Microchip Technology | Yes | 3 | 387 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FGG676I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S060T-1FGG676I | 166 MHz | Microchip Technology | Yes | 3 | 387 | 4710 LAB | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 425 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FGG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, Right Angle | 676-BGA | YES | 676-FBGA (27x27) | Thermoplastic, Glass Filled | 676 | -- | -- | M2S090 | Phosphor Bronze | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S090T-FGG676I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 50V | -20°C ~ 85°C | Tape & Reel (TR) | -- | e1 | Active | -- | Solder | 26 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | 0.039 (1.00mm) | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 0.5A | Tin | S-PBGA-B676 | 425 | Not Qualified | Black | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | -- | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPC | Contacts, Bottom | Straight | -- | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | Solder Retention | 27 mm | 27 mm | 120.0µin (3.05µm) | 0.126 (3.20mm) | 0.30mm | UL94 V-0 | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-1FG676 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090T-1FG676 | 22.86mm, 31.9mm | 166 MHz | Microchip Technology | 3 | SMD/SMT | 425 | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tube | MICTOR | e0 | Obsolete | Plug, Outer Shroud Contacts | 266 | Tin/Lead (Sn/Pb) | 2 | 8542.39.00.01 | Field Programmable Gate Arrays | 0.025 (0.64mm) | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | Gold | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | Board Guide, Ground Bus (Plane) | 27 mm | 27 mm | 30.0µin (0.76µm) | 0.892 (22.66mm) | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FGG676 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 676-BGA | 676-FBGA (27x27) | M2S060 | Silver Alloy | 64 kB | - | - | 166 MHz | Microchip Technology | 387 | 56520 LE | Tray | Active | Compliant | 115V | 28V | 0°C ~ 85°C (TJ) | 42 | Active | 8 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 1 | MCU, FPGA | 5.761 ~ 83gfm | Non-Shorting (BBM) | Fixed | SP8T | 26.04mm | 1 | 36° | FPGA - 60K Logic Modules | 1 Core | 256KB | -- | 11.10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-1FG676I | 166 MHz | Microchip Technology | 3 | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG676T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | Johnson Controls | VS027431B-SM1P3 | Microchip Technology | Panel | 387 | JHSN_DRIV_VSD-II | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 15.3125 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 320 Hz | 1 | FPGA - 60K Logic Modules | 256KB | 480 VAC | 9.40625 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | 64 kB | - | - | 166 MHz | PEI-Genesis | 387 | 56520 LE | Bulk | Active | Non-Compliant | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090TS-1FGG676I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FGG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | MICROSEMI CORP | Microsemi Corporation | M2S060TS-FGG676I | Microchip Technology | 3 | 387 | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | Microchip Technology | 387 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FGG676I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB |
-
M2S060TS-1FGG676I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FG676I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FGG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FGG676I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FGG676I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-1FG676
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FGG676
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG676T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-FG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-FGG676I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire