The category is 'Embedded - System On Chip (SoC)'
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- Package / Case:
896-BGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Packaging | Published | Series | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | HTS Code | Subcategory | Power Rating | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Military Standard | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Flash Size | Features | Diameter | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
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 | Mfr Part No M2S050T-1FGG896 | Microchip | Datasheet | 2333 | - | Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5F31A7N | ALTERA | Datasheet | 2392 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSEMA5F31A7N | 3 | MCU - 181, FPGA - 288 | 125 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.55 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | e1 | Active | TIN SILVER COPPER | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA6F31C7N | ALTERA | Datasheet | 1876 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSEMA6F31C7N | 3 | MCU - 181, FPGA - 288 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.03 | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSTFD6D5F31I7N | ALTERA | Datasheet | 1932 | - | Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSTFD6D5F31I7N | 3 | MCU - 181, FPGA - 288 | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.03 | Compliant | Yes | FPGA - Field Programmable Gate Array Cyclone V ST dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSTFD6 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 5 Gbps | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 110000 | 800 MHz | 41509 | 7 | 9 | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6D6F31I7N | ALTERA | Datasheet | 2296 | - | Min: 1 Mult: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | 100 °C | -40 °C | 800 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 800 MHz | 41509 | 7 | 9 | FPGA - 110K Logic Elements | -- | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5F31I7N | ALTERA | Datasheet | 2392 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSEMA5F31I7N | 3 | MCU - 181, FPGA - 288 | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.02 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 800 MHz | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6D6F31I7 | ALTERA | Datasheet | 651 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSXFC6D6F31I7 | MCU - 181, FPGA - 288 | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.57 | No | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B896 | 288 | Not Qualified | 1.1,1.2/3.3,2.5 V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5D6F31C8N | ALTERA | Datasheet | 1692 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSXFC5D6F31C8N | MCU - 181, FPGA - 288 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.04 | Compliant | Yes | FPGA, Cyclone V SX, 85000 cell, UFBGA896 5CSXFC5D6F31C8N, FPGA Cyclone V SX 85000 Cells, 85000 Gates, 4450K, 32075 Blocks, 1.07 u2192 1.13 V 896-Pin FBGA | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | Active | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 600 MHz | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.13 V | 1.07 V | 556.3 kB | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 85000 | 800 MHz | 32075 | 8 | 9 | FPGA - 85K Logic Elements | 128300 | 85000 | -- | 31 mm | 31 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-FGG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | Through Hole | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050TS-FGG896I | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.82 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tape & Reel (TR) | SmartFusion®2 | 1 % | e1 | 2 | 50 ppm/°C | 1.62 MΩ | Tin/Silver/Copper (Sn/Ag/Cu) | 175 °C | -65 °C | Metal Film | 8542.39.00.01 | Field Programmable Gate Arrays | 250 mW | 250 mW | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | MIL-R-10509 | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | Flame Retardant Coating, Military, Moisture Resistant | 3.68 mm | 8.7376 mm | 3.68 mm | Contains Lead | ||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5F31C6N | ALTERA | Datasheet | 1770 |
| Min: 1 Mult: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 5CSEMA5 | 1.13 V | 556.3 kB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 85000 | 800 MHz | 32075 | 6 | FPGA - 85K Logic Elements | -- | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSTFD5D5F31I7N | ALTERA | Datasheet | 2181 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSTFD5D5F31I7N | 3 | MCU - 181, FPGA - 288 | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.02 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 800 MHz | 5CSTFD5 | S-PBGA-B896 | 288 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 5 Gbps | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | ARM | 800 MHz | 32075 | 7 | 9 | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6D6F31C6N | ALTERA | Datasheet | 2330 | - | Min: 1 Mult: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | Active | 85 °C | 0 °C | 925 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 800 MHz | 41509 | 6 | 9 | FPGA - 110K Logic Elements | -- | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSXFC6D6F31C8NES | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | Cyclone® V SX | Obsolete | 3 (168 Hours) | 5CSXFC6 | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S050-FG896I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 896-BGA | 896-FBGA (31x31) | 377 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FG896I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 896-BGA | YES | 377 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B896 | 377 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 377 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FG896 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 5 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | Obsolete | 3 (168 Hours) | 85°C | 0°C | M2S050 | 1.2V | 256kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 667 Mbps | MCU, FPGA | 56340 | 400MHz | 4695 | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FG896 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S050 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FGG896 | Microsemi Corporation | Datasheet | 1 | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S050 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FG896 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S050 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FGG896 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S050T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | RoHS Compliant | Lead Free |
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M2S050T-1FGG896
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEMA5F31A7N
ALTERA
Package:Embedded - System On Chip (SoC)
390.388033
-
5CSEMA6F31C7N
ALTERA
Package:Embedded - System On Chip (SoC)
318.358666
-
5CSTFD6D5F31I7N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC6D6F31I7N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA5F31I7N
ALTERA
Package:Embedded - System On Chip (SoC)
262.623006
-
5CSXFC6D6F31I7
ALTERA
Package:Embedded - System On Chip (SoC)
662.083315
-
5CSXFC5D6F31C8N
ALTERA
Package:Embedded - System On Chip (SoC)
221.936955
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M2S050TS-FGG896I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA5F31C6N
ALTERA
Package:Embedded - System On Chip (SoC)
326.559107
-
5CSTFD5D5F31I7N
ALTERA
Package:Embedded - System On Chip (SoC)
479.998967
-
5CSXFC6D6F31C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC6D6F31C8NES
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-FG896I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050T-FG896I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FG896
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FG896
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1FGG896
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1FG896
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-1FGG896
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire