The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Data RAM Size
- Factory Pack QuantityFactory Pack Quantity
- L1 Cache Data Memory
- L1 Cache Instruction Memory
- Maximum Clock Frequency
- Maximum Operating Temperature
- Minimum Operating Temperature
- Mounting Styles
- Number of Cores
- Number of I/Os
- Number of Logic Elements
- Package / Case
- Package / Case:
BGA-484
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No M2S050-FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | ARM Cortex M3 | 64 kB | 1.314 Mbit | 64 kB | 60 | - | - | 166 MHz | + 85 C | 0 C | Yes | SMD/SMT | 267 I/O | 4695 LAB | 56340 LE | Details | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-1FGG484T2 | Microchip Technology | Datasheet | 4000 |
| Min: 1 Mult: 1 | BGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 191 kbit | 60 | MICROSEMI CORP | - | - | M2S005S-1FGG484T2 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 209 I/O | 505 LAB | 6060 LE | Tray | , | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060TS-1FG484M | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | - | - | 166 MHz | + 125 C | - 55 C | Yes | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | This product may require additional documentation to export from the United States. | SmartFusion2 | 0.326090 oz | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090TS-1FGG484T2 | Microchip Technology | Datasheet | 2360 |
| Min: 1 Mult: 1 | BGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 2074 kbit | 60 | - | - | 166 MHz | + 125 C | Microchip Technology | - 40 C | SMD/SMT | 267 I/O | 7193 LAB | 86316 LE | Tray | Active | 2.110353 oz | -40°C ~ 125°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060T-1FGG484M | Microchip Technology | Datasheet | 1672 | - | Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | M2S060T-1FGG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | Yes | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||
![]() | Mfr Part No M2S060TS-1FGG484M | Microchip Technology | Datasheet | 480 | - | Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | M2S060TS-1FGG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | Yes | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||
![]() | Mfr Part No M2S010-FGG484I | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 400 kbit | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-FGG484I | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 233 I/O | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0.404535 oz | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||
![]() | Mfr Part No MPFS250TS-1FCVG484I | Microchip Technology | Datasheet | 1872 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250TLS-FCVG484I | Microchip Technology | Datasheet | 1736 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095TLS-FCVG484I | Microchip Technology | Datasheet | 2326 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS160TS-1FCVG484I | Microchip Technology | Datasheet | 2125 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 312 I/O | 161000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095T-1FCVG484E | Microchip Technology | Datasheet | 1932 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS160TS-FCVG484I | Microchip Technology | Datasheet | 1789 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 312 I/O | 161000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250TS-FCVG484I | Microchip Technology | Datasheet | 1920 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z020-1CLG484TSNI | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | ARM Cortex A9 | 256 kB | 1 | 32 kB | 32 kB | 667 MHz | + 100 C | - 40 C | SMD/SMT | 130 I/O | 6650 LAB | 85000 LE | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z014S-1CLG484C4878 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | ARM Cortex A9 | 256 kB | 1 | 32 kB | 32 kB | 667 MHz | + 85 C | 0 C | SMD/SMT | 130 I/O | 5075 LAB | 65000 LE | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-FG484 | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 400 kbit | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-FG484 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 233 I/O | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.28 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | ||||||
![]() | Mfr Part No M2S005-FG484 | Microchip Technology | Datasheet | 39 | - | Min: 1 Mult: 1 | BGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 191 kbit | 64 kB | 60 | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 209 I/O | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS095T-1FCVG484I | Microchip Technology | Datasheet | 1900 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060T-1FG484M | Microchip Technology | Datasheet | 1951 |
| Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | M2S060T-1FG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | Yes | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm |
M2S050-FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005S-1FGG484T2
Microchip Technology
Package:Embedded - System On Chip (SoC)
71.017540
M2S060TS-1FG484M
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S090TS-1FGG484T2
Microchip Technology
Package:Embedded - System On Chip (SoC)
235.661838
M2S060T-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060TS-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
75.770077
MPFS250TS-1FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
508.222938
MPFS250TLS-FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
446.845006
MPFS095TLS-FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
196.194694
MPFS160TS-1FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
289.397590
MPFS095T-1FCVG484E
Microchip Technology
Package:Embedded - System On Chip (SoC)
153.487936
MPFS160TS-FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
267.550188
MPFS250TS-FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
353.205132
XC7Z020-1CLG484TSNI
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z014S-1CLG484C4878
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
MPFS095T-1FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
214.764698
M2S060T-1FG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
531.711716
