The category is 'Embedded - System On Chip (SoC)'
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BGA-484
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Material | Number of Terminals | Base Product Number | Brand | Core | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Speed Grade | Legend | Primary Attributes | Number of Logic Cells | Number of Cores | Background Color | Flash Size | Language | Product Category | Length | Width |
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 | Mfr Part No M2S060TS-1FG484M | Microchip | Datasheet | 2063 |
| Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | Microchip Technology / Atmel | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | Microchip | M2S060TS-1FG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0.326090 oz | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | Yes | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | SoC FPGA | 23 mm | 23 mm | ||||||||||||||||||||
| Mfr Part No MPFS095T-1FCVG484I | Microchip Technology | Datasheet | 1900 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-1CLG484C4878 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | ARM Cortex A9 | 256 kB | 1 | 32 kB | 32 kB | 667 MHz | + 85 C | 0 C | SMD/SMT | 130 I/O | 5075 LAB | 65000 LE | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FG484M | Microchip Technology | Datasheet | 1951 |
| Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | M2S060T-1FG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | Yes | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||
| Mfr Part No M2S010-FG484 | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 400 kbit | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-FG484 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 233 I/O | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.28 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||
| Mfr Part No M2S005-FG484 | Microchip Technology | Datasheet | 39 | - | Min: 1 Mult: 1 | BGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 191 kbit | 64 kB | 60 | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 209 I/O | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG484 | Microchip | Datasheet | 2153 | - | Min: 1 Mult: 1 | BGA-484 | 484-FPBGA (23x23) | Polyester | M2S050 | Microchip Technology / Atmel | 64 kB | 1.314 Mbit | 64 kB | 60 | - | - | Brady | 125819 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 267 I/O | 4695 LAB | 56340 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | Warning Signs | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | Vinyl Chloride May Cause Cancer Authorized Personnel Only | FPGA - 50K Logic Modules | 1 Core | White | 256KB | English | SoC FPGA |
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M2S060TS-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
402.630243
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MPFS095T-1FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
214.764698
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XC7Z014S-1CLG484C4878
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-1FG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
531.711716
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M2S010-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire