The category is 'Embedded - System On Chip (SoC)'
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- Package / Case:
FPBGA-256
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Core | Data RAM Size | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Number of Gates | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Length | Width |
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 | Mfr Part No A2F200M3F-FGG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-256 | ARM Cortex M3 | 64 kB | 90 | - | - | 80 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 117 I/O | - | 2000 LE | Details | SmartFusion | 0.690329 oz | Tray | A2F200 | 1.5 V | 7 mA | 256 kB | 200000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256 | Microchip Technology | Datasheet | 1766 |
| Min: 1 Mult: 1 | FPBGA-256 | 256-FPBGA (17x17) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 90 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 117 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG256 | Microchip Technology | Datasheet | 2246 |
| Min: 1 Mult: 1 | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FG256 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 117 I/O | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 17 mm | 17 mm | |||||||||||||
| Mfr Part No A2F200M3F-FGG256I | Microchip | Datasheet | 724 | - | Min: 1 Mult: 1 | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | A2F200 | Microchip Technology / Atmel | 80 MHz | 64 kB | 200000 | 200000 | 90 | MICROSEMI CORP | - | - | Microchip | A2F200M3F-FGG256I | 80 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 117 I/O | - | 2000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.33 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0.690329 oz | -40 to 100 °C | Tray | A2F200 | e3 | Matte Tin (Sn) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 7 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 200000 | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | SoC FPGA | 17 mm | 17 mm |
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A2F200M3F-FGG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-FG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
116.364817
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A2F500M3G-1FG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
130.593301
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A2F200M3F-FGG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire