The category is 'Embedded - System On Chip (SoC)'
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FPBGA-484
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Device Logic Gates | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Gates | Screening Level | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
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 | Mfr Part No A2F500M3G-FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 80 MHz | + 85 C | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Details | This product may require additional documentation to export from the United States. | SmartFusion | Tray | A2F500 | 1.5 V | 16.5 mA | 512 kB | 500000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 80 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Details | SmartFusion | 0.062696 oz | Tray | A2F500 | 1.5 V | 16.5 mA | 512 kB | 500000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 100 MHz | + 85 C | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Details | SmartFusion | 0.534969 oz | Tray | A2F500 | 1.5 V | 16.5 mA | 512 kB | 500000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 60 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | + 85 C | 0 C | Yes | SMD/SMT | 273 I/O | 2308 LAB | 27696 LE | Details | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S025 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S025TS-1FGG484 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||
| Mfr Part No M2S050-FG484I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Yes | SMD/SMT | 4695 LAB | 56340 LE | N | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG484I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Yes | SMD/SMT | 4695 LAB | 56340 LE | Details | This product may require additional documentation to export from the United States. | 0.489749 oz | Tray | SmartFusion2 | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||
| Mfr Part No M2S025T-1FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F200 | ARM Cortex M3 | 64 kB | 60 | - | - | 100 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 161 I/O | - | 2000 LE | Tray | Active | N | SmartFusion | -40°C ~ 100°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484M | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||
| Mfr Part No M2S050TS-1FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S050 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 209 | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050TS-1FGG484M | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||
| Mfr Part No M2S025T-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-1FG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 233 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||
| Mfr Part No M2S090T-FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S090 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S090T-FGG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||
| Mfr Part No M2S005-FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 6,060 | 60 | - | - | 166 MHz | 209 | 1.26 V | Microchip Technology | 1.14 V | Yes | Surface Mount | SMD/SMT | 209 | 505 LAB | 6060 LE | Tray | Active | Details | FPBGA | 1.2000 V | 0.377729 oz | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | 484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Industrial | STD | FPGA - 5K Logic Modules | 1 Core | 128KB |
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A2F500M3G-FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-FGG484I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-FG484I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FGG484I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050T-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050T-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050TS-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050TS-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090T-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire