The category is 'Embedded - System On Chip (SoC)'
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VFPBGA-256
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Core | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Resistance | Terminal Finish | Additional Feature | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Total RAM Bits | Resistance Tolerance | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Length | Width |
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 | Mfr Part No M2S005-VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 191 kbit | 119 | - | - | 166 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | Details | Tray | SmartFusion2 | 1.2 V | 128 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Yes | SMD/SMT | 1007 LAB | 12084 LE | Details | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Yes | SMD/SMT | 505 LAB | 6060 LE | Details | Tray | SmartFusion2 | 128 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 138 I/O | 1007 LAB | 12084 LE | Details | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VF256I | Microchip Technology | Datasheet | 32 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010TS-1VF256I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||
| Mfr Part No M2S005-1VFG256 | Microchip Technology | Datasheet | 205 | - | Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M2S005 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S005-1VFG256 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 161 | 505 LAB | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.79 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 191Kbit | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | ||||||||||||||||
| Mfr Part No M2S010-VF256I | Microchip Technology | Datasheet | 90 |
| Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010-VF256I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||
| Mfr Part No M2S010T-1VF256 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010T-1VF256 | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||
| Mfr Part No M2S010TS-VFG256I | Microchip Technology | Datasheet | 287 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (17x17) | M2S010 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VFG256 | Microchip Technology | Datasheet | 39 |
| Min: 1 Mult: 1 | VFPBGA-256 | 256-FPBGA (17x17) | M2S005 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 161 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256 | Microchip Technology | Datasheet | 2373 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M2S025 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S025TS-1VFG256 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 138 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||
| Mfr Part No M2S010T-1VF256I | Microchip Technology | Datasheet | 39 |
| Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010T-1VF256I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||
| Mfr Part No M2S010-1VF256I | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010-1VF256I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||
| Mfr Part No M2S005S-VFG256I | Microchip | Datasheet | 92 | - | Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M2S005 | Microchip Technology / Atmel | 64 kB | 119 | MICROSEMI CORP | - | - | Microchip | M2S005S-VFG256I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 161 | 505 LAB | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 2.4 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | 50 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | 8.06 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | SOC - Systems on a Chip | 0.125 W | CMOS | BOTTOM | BALL | 250 | 0.8 mm | General Purpose | compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | SoC FPGA | 14 mm | 14 mm | ||||||||||||
| Mfr Part No M2S010TS-1VFG256I | Microchip | Datasheet | 75 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | 256-FPBGA (17x17) | M2S010 | Microchip Technology / Atmel | 64 kB | 119 | - | - | Microchip | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | Active | Compliant | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VF256I | Microchip Technology | Datasheet | 39 | - | Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S005 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S005-1VF256I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 161 | 505 LAB | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | |||||||||||||||||||||
| Mfr Part No M2S005S-1VF256 | Microchip Technology | Datasheet | 39 |
| Min: 1 Mult: 1 | VFPBGA-256 | 256-FPBGA (14x14) | M2S005 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 161 | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-VF256I | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S010TS-VF256I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||
| Mfr Part No M2S025TS-1VF256 | Microchip Technology | Datasheet | 2335 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (14x14) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1VFG256 | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (17x17) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB |
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M2S005-VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-1VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-1VF256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
89.645975
-
M2S005-1VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-VF256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
68.410251
-
M2S010T-1VF256
Microchip Technology
Package:Embedded - System On Chip (SoC)
74.156266
-
M2S010TS-VFG256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
85.234446
-
M2S005S-1VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
42.203537
-
M2S025TS-1VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
159.148902
-
M2S010T-1VF256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
65.406389
-
M2S010-1VF256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
76.892078
-
M2S005S-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
89.756640
-
M2S005-1VF256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VF256
Microchip Technology
Package:Embedded - System On Chip (SoC)
31.832073
-
M2S010TS-VF256I
Microchip Technology
Package:Embedded - System On Chip (SoC)
85.041150
-
M2S025TS-1VF256
Microchip Technology
Package:Embedded - System On Chip (SoC)
159.148902
-
M2S025-1VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire