The category is 'Embedded - System On Chip (SoC)'

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  • Power Supplies:

    1.5,1.8,2.5,3.3 V

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Length

Width

A2F200M3F-1CS288

Mfr Part No

A2F200M3F-1CS288

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

A2F200

100 MHz

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

A2F200M3F-1CS288

100 MHz

Microchip Technology

Yes

MCU - 31, FPGA - 78

-

2000 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA288,21X21,20

BGA288,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

NOT SPECIFIED

5.24

N

No

1.575 V

1.425 V

1.5 V

SmartFusion

0°C ~ 85°C (TJ)

Tray

A2F200

e0

TIN LEAD SILVER

8542.39.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.5 mm

compliant

S-PBGA-B288

78

Not Qualified

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

FIELD PROGRAMMABLE GATE ARRAY

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

11 mm

11 mm

A2F500M3G-1FG256

Mfr Part No

A2F500M3G-1FG256

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-256

YES

256-FPBGA (17x17)

256

A2F500

100 MHz

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

A2F500M3G-1FG256

100 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

3

SMD/SMT

117 I/O

-

6000 LE

85 °C

Tray

PLASTIC/EPOXY

LBGA

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

Active

30

5.24

N

No

This product may require additional documentation to export from the United States.

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

0 to 85 °C

Tray

A2F500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

66

Not Qualified

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

11520 CLBS, 500000 GATES

1.7 mm

FIELD PROGRAMMABLE GATE ARRAY

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

17 mm

17 mm

A2F500M3G-1CS288

Mfr Part No

A2F500M3G-1CS288

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

A2F500

100 MHz

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

A2F500M3G-1CS288

100 MHz

Microchip Technology

Yes

MCU - 31, FPGA - 78

-

6000 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA288,21X21,20

BGA288,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

NOT SPECIFIED

5.24

N

No

This product may require additional documentation to export from the United States.

1.575 V

1.425 V

1.5 V

SmartFusion

0°C ~ 85°C (TJ)

Tray

A2F500

e0

TIN LEAD SILVER

8542.39.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.5 mm

compliant

S-PBGA-B288

78

Not Qualified

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

11520 CLBS, 500000 GATES

1.05 mm

FIELD PROGRAMMABLE GATE ARRAY

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

11 mm

11 mm

A2F200M3F-1CS288I

Mfr Part No

A2F200M3F-1CS288I

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

A2F200

100 MHz

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

A2F200M3F-1CS288I

100 MHz

Microchip Technology

Yes

MCU - 31, FPGA - 78

-

2000 LE

100 °C

-40 °C

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA288,21X21,20

BGA288,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

20

1.56

N

No

1.575 V

1.425 V

1.5 V

SmartFusion

-40°C ~ 100°C (TJ)

Tray

A2F200

e0

TIN LEAD SILVER

8542.39.00.01

CMOS

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B288

78

Not Qualified

1.5,1.8,2.5,3.3 V

INDUSTRIAL

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

FIELD PROGRAMMABLE GATE ARRAY

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

11 mm

11 mm

A2F200M3F-PQ208I

Mfr Part No

A2F200M3F-PQ208I

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

208-BFQFP

YES

208-PQFP (28x28)

208

A2F200

80 MHz

ARM Cortex M3

64 kB

24

MICROSEMI CORP

-

-

A2F200M3F-PQ208I

80 MHz

+ 100 C

Microchip Technology

- 40 C

Yes

3

SMD/SMT

113 I/O

-

2000 LE

Tray

PLASTIC/EPOXY

FQFP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

Obsolete

Obsolete

20

5.61

N

No

1.575 V

1.425 V

1.5 V

SmartFusion

-40°C ~ 100°C (TJ)

Tray

A2F200

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

GULL WING

225

0.5 mm

compliant

S-PQFP-G208

66

Not Qualified

1.5,1.8,2.5,3.3 V

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

4608 CLBS, 200000 GATES

4.1 mm

FIELD PROGRAMMABLE GATE ARRAY

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

28 mm

28 mm

A2F200M3F-FG484

Mfr Part No

A2F200M3F-FG484

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F200

80 MHz

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

A2F200M3F-FG484

80 MHz

+ 85 C

Microchip Technology

0 C

Yes

3

SMD/SMT

161 I/O

-

2000 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

30

5.24

N

No

1.575 V

1.425 V

1.5 V

SmartFusion

0°C ~ 85°C (TJ)

Tray

A2F200

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

94

Not Qualified

1.5,1.8,2.5,3.3 V

OTHER

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

200000

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

23 mm

23 mm

A2F500M3G-1FGG484I

Mfr Part No

A2F500M3G-1FGG484I

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F500

100 MHz

ARM Cortex M3

64 kB

500000

500000

60

MICROSEMI CORP

-

-

A2F500M3G-1FGG484I

100 MHz

1.575 V

+ 100 C

Microchip Technology

1.425 V

- 40 C

Yes

3

SMD/SMT

204 I/O

-

6000 LE

100 °C

-40 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

30

5.24

Details

Yes

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

-40 to 100 °C

Tray

A2F500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

Not Qualified

1.5 V

1.5,1.8,2.5,3.3 V

INDUSTRIAL

16.5 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

23 mm

23 mm

A2F200M3F-1FGG484I

Mfr Part No

A2F200M3F-1FGG484I

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F200

100 MHz

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

A2F200M3F-1FGG484I

100 MHz

+ 100 C

Microchip Technology

- 40 C

Yes

3

SMD/SMT

161 I/O

-

2000 LE

100 °C

-40 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

30

5.24

Details

Yes

1.575 V

1.425 V

1.5 V

SmartFusion

-40°C ~ 100°C (TJ)

Tray

A2F200

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

94

Not Qualified

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

23 mm

23 mm

A2F500M3G-1FG484I

Mfr Part No

A2F500M3G-1FG484I

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F500

100 MHz

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

A2F500M3G-1FG484I

100 MHz

1.575 V

+ 100 C

Microchip Technology

1.425 V

- 40 C

Yes

3

SMD/SMT

204 I/O

-

6000 LE

100 °C

-40 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

20

5.24

N

No

This product may require additional documentation to export from the United States.

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

-40 to 100 °C

Tray

A2F500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

128

Not Qualified

1.5,1.8,2.5,3.3 V

INDUSTRIAL

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

23 mm

23 mm

A2F500M3G-FGG484I

Mfr Part No

A2F500M3G-FGG484I

Microchip Datasheet

-

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F500

Microchip Technology / Atmel

80 MHz

64 kB

60

MICROSEMI CORP

-

-

Microchip

A2F500M3G-FGG484I

80 MHz

+ 100 C

Microchip Technology

- 40 C

Yes

3

SMD/SMT

204 I/O

-

6000 LE

100 °C

-40 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

30

5.22

Details

Yes

1.575 V

1.425 V

1.5 V

SmartFusion

0.062696 oz

-40°C ~ 100°C (TJ)

Tray

A2F500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

Not Qualified

1.5 V

1.5,1.8,2.5,3.3 V

INDUSTRIAL

16.5 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

A2F500M3G-1FGG484

Mfr Part No

A2F500M3G-1FGG484

Microchip Datasheet

-

-

Min: 1

Mult: 1

484-BGA

YES

484-FPBGA (23x23)

484

A2F500

Microchip Technology / Atmel

100 MHz

64 kB

60

MICROSEMI CORP

-

-

Microchip

A2F500M3G-1FGG484

100 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

3

SMD/SMT

MCU - 41, FPGA - 128

-

6000 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

40

1.36

Details

Yes

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

0.534969 oz

0 to 85 °C

Tray

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

128

Not Qualified

1.5 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

500000

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

512KB

SoC FPGA

23 mm

23 mm

A2F500M3G-FGG484

Mfr Part No

A2F500M3G-FGG484

Microchip Datasheet

284
In Stock

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

A2F500

Microchip Technology / Atmel

40 MHz

80 MHz

64 kB

500000

500000

60

±2.8(20th) ppm/Year

MICROSEMI CORP

-

-

Microchip

A2F500M3G-FGG484

80 MHz

1.575 V

+ 85 C

Microchip Technology

1.425 V

0 C

Yes

3

Surface Mount

SMD/SMT

204 I/O

-

6000 LE

85 °C

40 MHz

Tray

PLASTIC/EPOXY

BGA

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

40

1.37

Details

Yes

This product may require additional documentation to export from the United States.

1.575 V

1.425 V

1.5 V

SmartFusion

1.5000 V

-20 to 70 °C

Tray

A2F500

e1

Temperature Compensated Crystal Oscillator (TCXO)

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

1 mm

compliant

4.6 ppm

10

S-PBGA-B484

128

Not Qualified

3.0000 V

1.5,1.8,2.5,3.3 V

OTHER

16.5 mA

10 pF

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

128

11520 CLBS, 500000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

500000

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

1 Core

500000

Clipped Sinewave

512KB

SoC FPGA

23 mm

23 mm

A2F200M3F-FG484I

Mfr Part No

A2F200M3F-FG484I

Microchip Datasheet

-

-

Min: 1

Mult: 1

484-BGA

YES

484-FPBGA (23x23)

484

A2F200

80 MHz

MICROSEMI CORP

Microsemi Corporation

A2F200M3F-FG484I

Microchip Technology

3

MCU - 41, FPGA - 94

100 °C

-40 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,26X26,40

BGA484,26X26,40

SQUARE

GRID ARRAY

Active

Active

20

5.23

No

1.575 V

1.425 V

1.5 V

-40°C ~ 100°C (TJ)

SmartFusion®

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

94

Not Qualified

1.5,1.8,2.5,3.3 V

INDUSTRIAL

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

23 mm

23 mm

A2F060M3E-TQG144I

Mfr Part No

A2F060M3E-TQG144I

Microchip Datasheet

-

-

Min: 1

Mult: 1

YES

144

80 MHz

MICROSEMI CORP

Microsemi Corporation

A2F060M3E-TQG144I

3

PLASTIC/EPOXY

LFQFP

LFQFP, QFP144,.87SQ,20

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

30

8.63

Yes

1.575 V

1.425 V

1.5 V

e3

PURE MATTE TIN (394)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

QUAD

GULL WING

250

0.5 mm

compliant

S-PQFP-G144

33

Not Qualified

1.5,1.8,2.5,3.3 V

33

1536 CLBS, 60000 GATES

1.6 mm

FIELD PROGRAMMABLE GATE ARRAY

1536

1536

60000

20 mm

20 mm

A2F060M3E-1FGG256

Mfr Part No

A2F060M3E-1FGG256

Microchip Datasheet

-

-

Min: 1

Mult: 1

YES

256

100 MHz

MICROSEMI CORP

Microsemi Corporation

A2F060M3E-1FGG256

3

85 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

30

5.8

Yes

1.575 V

1.425 V

1.5 V

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

66

Not Qualified

1.5,1.8,2.5,3.3 V

OTHER

66

1536 CLBS, 60000 GATES

1.7 mm

FIELD PROGRAMMABLE GATE ARRAY

1536

1536

60000

17 mm

17 mm

A2F060M3E-1CSG288I

Mfr Part No

A2F060M3E-1CSG288I

Microchip Datasheet

-

-

Min: 1

Mult: 1

YES

288

100 MHz

MICROSEMI CORP

Microsemi Corporation

A2F060M3E-1CSG288I

PLASTIC/EPOXY

TFBGA

TFBGA, BGA288,21X21,20

BGA288,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

30

5.25

Yes

1.575 V

1.425 V

1.5 V

e1

TIN SILVER COPPER

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

260

0.5 mm

compliant

S-PBGA-B288

68

Not Qualified

1.5,1.8,2.5,3.3 V

68

1536 CLBS, 60000 GATES

1.05 mm

FIELD PROGRAMMABLE GATE ARRAY

1536

1536

60000

11 mm

11 mm

A2F060M3E-CS288I

Mfr Part No

A2F060M3E-CS288I

Microchip Datasheet

-

-

Min: 1

Mult: 1

YES

288

80 MHz

MICROSEMI CORP

Microsemi Corporation

A2F060M3E-CS288I

PLASTIC/EPOXY

TFBGA

11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, BGA-288

BGA288,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

20

5.84

No

1.575 V

1.425 V

1.5 V

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B288

68

Not Qualified

1.5,1.8,2.5,3.3 V

68

1536 CLBS, 60000 GATES

1.05 mm

FIELD PROGRAMMABLE GATE ARRAY

1536

1536

60000

11 mm

11 mm

A2F060M3E-1FG256

Mfr Part No

A2F060M3E-1FG256

Microchip Datasheet

-

-

Min: 1

Mult: 1

YES

256

100 MHz

MICROSEMI CORP

Microsemi Corporation

A2F060M3E-1FG256

3

85 °C

PLASTIC/EPOXY

LBGA

1 MM PITCH, FBGA-256

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

20

5.84

No

1.575 V

1.425 V

1.5 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

66

Not Qualified

1.5,1.8,2.5,3.3 V

OTHER

66

1536 CLBS, 60000 GATES

1.7 mm

FIELD PROGRAMMABLE GATE ARRAY

1536

1536

60000

17 mm

17 mm

A2F200M3F-1PQG208I

Mfr Part No

A2F200M3F-1PQG208I

Microchip Datasheet

-

-

Min: 1

Mult: 1

208-BFQFP

YES

208-PQFP (28x28)

208

A2F200

100 MHz

200000

MICROSEMI CORP

Microsemi Corporation

A2F200M3F-1PQG208I

1.575 V

Microchip Technology

1.425 V

3

MCU - 22, FPGA - 66

Tray

PLASTIC/EPOXY

FQFP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

Active

Active

30

5.59

Yes

1.575 V

1.425 V

1.5 V

1.5000 V

-40 to 100 °C

SmartFusion®

Yes

Pure Matte Tin (Sn)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

QUAD

GULL WING

245

0.5 mm

compliant

S-PQFP-G208

66

Not Qualified

1.5,1.8,2.5,3.3 V

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

4608 CLBS, 200000 GATES

4.1 mm

FIELD PROGRAMMABLE GATE ARRAY

1

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

28 mm

28 mm

A2F500M3G-1CS288I

Mfr Part No

A2F500M3G-1CS288I

Microchip Datasheet

-

-

Min: 1

Mult: 1

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

A2F500

100 MHz

500000

MICROSEMI CORP

Microsemi Corporation

A2F500M3G-1CS288I

1.575 V

Microchip Technology

1.425 V

MCU - 31, FPGA - 78

100 °C

-40 °C

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA288,21X21,20

BGA288,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

20

5.24

No

1.575 V

1.425 V

1.5 V

1.5000 V

-40 to 100 °C

SmartFusion®

e0

TIN LEAD SILVER

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B288

78

Not Qualified

1.5,1.8,2.5,3.3 V

INDUSTRIAL

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

11520 CLBS, 500000 GATES

1.05 mm

FIELD PROGRAMMABLE GATE ARRAY

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

500000

512KB

11 mm

11 mm