The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Architecture
- Connectivity
- Core Processor
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Peripherals
- Primary Attributes
- RoHS Status:
Non-RoHS Compliant
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Operating Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Core Architecture | Number of Gates | Max Frequency | Boundary Scan | Number of Logic Blocks (LABs) | RAM (words) | Primary Attributes | Number of Logic Cells | Bus Compatibility | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No XC7Z030-2FF676I | Xilinx Inc. | Datasheet | 1744 |
| Min: 1 Mult: 1 | 11 Weeks | 676-BBGA, FCBGA | YES | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 8542.39.00.01 | BOTTOM | BALL | 800MHz | XC7Z030 | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FF676I | Xilinx Inc. | Datasheet | 558 |
| Min: 1 Mult: 1 | 10 Weeks | 676-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | no | Active | 4 (72 Hours) | 676 | 8542.39.00.01 | BOTTOM | BALL | 800MHz | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z100-1FF900I | Xilinx Inc. | Datasheet | 541 | - | Min: 1 Mult: 1 | 10 Weeks | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 100°C | -40°C | 667MHz | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | 667MHz | Kintex™-7 FPGA, 444K Logic Cells | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FF900I | Xilinx Inc. | Datasheet | 720 |
| Min: 1 Mult: 1 | 10 Weeks | 900-BBGA, FCBGA | YES | 130 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B900 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z100-2FF900I | Xilinx Inc. | Datasheet | 2400 | - | Min: 1 Mult: 1 | 10 Weeks | 900-BBGA, FCBGA | 212 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | Active | 4 (72 Hours) | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 444K Logic Cells | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z015-1CL485I | Xilinx Inc. | Datasheet | 2038 |
| Min: 1 Mult: 1 | 10 Weeks | 484-LFBGA, CSPBGA | YES | 130 | -40°C~100°C TJ | Bulk | 2010 | Zynq®-7000 | no | Active | 2A (4 Weeks) | 485 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B485 | 1.05V | 0.95V | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 74K Logic Cells | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | 1.6mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA2U23I7 | Intel | Datasheet | 1872 |
| Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA2 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-2FF900E | Xilinx Inc. | Datasheet | 273 | - | Min: 1 Mult: 1 | 10 Weeks | 900-BBGA, FCBGA | YES | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | no | Active | 4 (72 Hours) | 900 | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | 800MHz | S-PBGA-B900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No BCM3380ZKFSBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FF676I | Xilinx Inc. | Datasheet | 1712 |
| Min: 1 Mult: 1 | 11 Weeks | 676-BBGA, FCBGA | YES | 4 | -40°C~100°C TJ | Tray | Zynq®-7000 | Active | 4 (72 Hours) | 676 | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | S-PBGA-B676 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z015-2CL485I | Xilinx Inc. | Datasheet | 536 | - | Min: 1 Mult: 1 | 10 Weeks | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | 130 | -40°C~100°C TJ | Bulk | 2010 | Zynq®-7000 | Active | 2A (4 Weeks) | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 74K Logic Cells | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU3EG-3SFVC784E | Xilinx Inc. | Datasheet | 488 | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | YES | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Obsolete | 4 (72 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | S-PBGA-B784 | 600MHz, 667MHz, 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3380GKFSBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3380EKFSBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3382ZKFEBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3382DIFEBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3382GKFEBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S050-FCS325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | ||||||||||||||||||||||
 | Mfr Part No A2F200M3F-1FG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | YES | 256 | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 2009 | SmartFusion® | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.5V | 1mm | 100MHz | 20 | A2F200 | 66 | 1.575V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 3mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 200000 | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 1.7mm | 17mm | 17mm | No | Non-RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No M2S050T-FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant |
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XC7Z030-2FF676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
333.279614
-
XC7Z045-2FF676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,516.599846
-
XC7Z100-1FF900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-2FF900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,740.838276
-
XC7Z100-2FF900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z015-1CL485I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
159.197079
-
5CSEBA2U23I7
Intel
Package:Embedded - System On Chip (SoC)
110.554404
-
XC7Z045-2FF900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3380ZKFSBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z030-1FF676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
278.088411
-
XC7Z015-2CL485I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3EG-3SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3380GKFSBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3380EKFSBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3382ZKFEBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM3382DIFEBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3382GKFEBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FCS325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire