The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Architecture
- Connectivity
- Core Processor
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Peripherals
- Primary Attributes
- RoHS Status:
Non-RoHS Compliant
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Core Architecture | Speed Grade | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No M2S050-1FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S050 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | Mfr Part No M2S060T-VF400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No M2S050TS-VF400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||
 | Mfr Part No M2S090-FCS325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 4 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No M2S060TS-FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||
 | Mfr Part No M2S060-1FG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 676-BGA | 676-FBGA (27x27) | 387 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-1FCS325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No M2S060TS-1FG676 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No M2S090TS-FCS325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No M2S060T-1FG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||
 | Mfr Part No M2S050TS-1FG896 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 896-BGA | 896-FBGA (31x31) | 377 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No M2S060TS-FG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No M2S150-FCV484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 273 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||
 | Mfr Part No M2S150T-FCS536 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | not_compliant | NOT SPECIFIED | S-PBGA-B536 | 293 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | Non-RoHS Compliant | |||||||||||||||||||
| Mfr Part No M2S150-1FCS536 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 536 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | not_compliant | NOT SPECIFIED | S-PBGA-B536 | 293 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | Non-RoHS Compliant | |||||||||||||||||||
| Mfr Part No M2S150TS-FCV484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | SmartFusion®2 | no | Active | 3 (168 Hours) | 484 | LG-MIN,WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 1.2V | 0.8mm | S-PBGA-B484 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||
 | Mfr Part No M2S150TS-FC1152 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||||||
| Mfr Part No M2S150T-1FCV484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | 484 | 484-FBGA (19x19) | 273 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 1.2V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 512KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FC1152 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | 166MHz | NOT SPECIFIED | M2S150 | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant |
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M2S050-1FG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-VF400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050TS-VF400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-FCS325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060-1FG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-1FCS325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FCS325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050TS-1FG896
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-FG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-FG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150-FCV484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-FCS536
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150-1FCS536
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-FCV484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-FC1152
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FCV484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150-1FC1152
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire