The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Architecture
- Connectivity
- Core Processor
- Number of I/Os
- Operating Temperature
- Package / Case
- Packaging
- Peripherals
- Primary Attributes
- RoHS Status:
Non-RoHS Compliant
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Programmable Logic Type | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No M2S090TS-FG676 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 425 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||
| Mfr Part No BCM3380MIFSBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S090-1FG676IX417 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 676-BGA | 676-FBGA (27x27) | 425 | -40°C~100°C TJ | Tray | 2016 | SmartFusion®2 | Obsolete | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 512KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-CS288 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | MCU - 28, FPGA - 68 | 0°C~85°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1CS288I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 99 Weeks | 288-TFBGA, CSPBGA | 288-CSP (11x11) | MCU - 28, FPGA - 68 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-CS288I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 288-TFBGA, CSPBGA | YES | MCU - 28, FPGA - 68 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 288 | Tin/Lead/Silver (Sn/Pb/Ag) | BOTTOM | BALL | 235 | 1.5V | 0.5mm | 80MHz | 20 | A2F060M3E | 68 | Not Qualified | 1.575V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | 68 | 1536 CLBS, 60000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 60000 | 128KB | 1.05mm | 11mm | 11mm | Non-RoHS Compliant | |||||||||||||||||
| Mfr Part No A2F200M3F-CS288 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 288-TFBGA, CSPBGA | 288-CSP (11x11) | MCU - 31, FPGA - 78 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F200 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1CS288 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 288-TFBGA, CSPBGA | 288 | 288-CSP (11x11) | MCU - 28, FPGA - 68 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1CS288 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 288-TFBGA, CSPBGA | 288-CSP (11x11) | MCU - 31, FPGA - 78 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | Non-RoHS Compliant |
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M2S090TS-FG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM3380MIFSBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-1FG676IX417
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-CS288
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1CS288I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-CS288I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-CS288
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1CS288
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1CS288
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire