The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | 1st Contact Gender | 2nd Contact Gender | Base Product Number | Brand | Cable Types | Clock Frequency-Max | Core | Current Short Circuit (Isc) | Data RAM Size | Data RAM Type | Development Kit | Factory Pack QuantityFactory Pack Quantity | Frequency-Max | Ihs Manufacturer | Instruction Set Architecture | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | MSL | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Overall Impedance | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Processor Series | Product Status | Risk Rank | RoHS | Shipping Restrictions | Supplier Package | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | Size / Dimension | Type | Color | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Ingress Protection | Terminal Pitch | Style | Reach Compliance Code | Frequency | JESD-30 Code | Function | Operating Frequency | Operating Supply Voltage | Temperature Grade | Interface | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Current - Supply | Data Rate | Architecture | Data Bus Width | Seated Height-Max | Utilized IC / Part | Product Type | Operating Temperature Range | Protocol | 1st Connector | 2nd Connector | Total RAM Bits | Frequency Range | Screening Level | Power - Output | RF Family/Standard | Antenna Type | Sensitivity | Data Rate (Max) | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Modulation | Number of Cores | GPIO | Flash Size | Features | Voltage @ Pmpp | Power (Watts) - Max | Current @ Pmpp | Voltage - Open Circuit | Product Category | Device Core | Height | Length | Width |
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 | Mfr Part No EP06ELA-512-SGA | Quectel | Datasheet | - | - | Min: 1 Mult: 1 | Card Edge | Module | EP06 | 250 | Quectel | Tray | Active | Details | Wireless communication module | 0.360853 oz | -35°C ~ 75°C | Reel | - | 3.1V ~ 4.4V | - | - | 300Mbps | - | BeiDou, Galileo, GLONASS, GPS, GNSS, HSPA+, LTE, WCDMA | - | Cellular, Navigation | Antenna Not Included | - | I²C, PCM, USB | 31.3mA | 31.3mA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIC32CX1025SG41100-I/E5X | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-100 | EV06X38A | 1000 | CAN, Ethernet, USB | 120 MHz | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 81 I/O | Tray | PIC32CX | Active | Details | 3.63 V | 1.71 V | Tray | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025T-FCVG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MSL 3 - 168 hours | 108 I/O | 23000 LE | Tray | Active | -40°C ~ 100°C | Tray | - | 1 V | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | 1843.2Kbit | FPGA - 23K Logic Modules | 5 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EG21GGB-MINIPCIE-S | Quectel | Datasheet | - | - | Min: 1 Mult: 1 | Card Edge | Module | EG21 | 100 | Quectel | Socket Mount | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | Details | Mini PCIe | Wireless communication module | 0.368613 oz | Industrial grade | -40 to 80 °C | Reel | - | LTE Cat 1 Module | 3V ~ 3.6V | - | 3.8 V | - | 42Mbps | - | BeiDou, EDGE, Galileo, GLONASS, GPS, GNSS, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA | 700/800/850/900/1700/1800/1900/2100/2600 MHz | Industrial | 33dBm | Cellular, Navigation | Antenna Not Included | -110.5dBm | I²C, PCM, UART, USB | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU1EG-1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Tray | Active | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-2UBVA530I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | - | 533MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1UBVA530I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU1EG-1SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | Tray | Active | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM6750A2KFEBG | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | - | Broadcom / Avago | 420 | Broadcom Limited | Broadcom Limited | Tray | Active | Details | - | - | TxRx Only | Wireless & RF Modules | - | 6GHz | - | WiFi Modules | 802.11a/b/g/-x | - | WiFi | - | - | I²S, SPI, PCI, UART, USB | - | - | 1024QAM | WiFi Modules - 802.11 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160T-FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM63138DKFSBG | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | - | Broadcom | 420 | RISC | Ethernet | Broadcom Limited | Broadcom Limited | 2 | Tray | Active | - | - | Ethernet & Communication Modules | - | Ethernet | Ethernet | - | 32 Bit | Gateways | Gateways | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-2UBVA530E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | - | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU1EG-1SBVA484Q | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | Active | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24B2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Cell (36) | - | TPS-12 | 2.19 A | Tycon Systems Inc. | 768 | Box | Active | -40°C ~ 85°C | - | 21.457 L x 19.291 W x 1.378 H (545.00mm x 490.00mm x 35.00mm) | Monocrystalline | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | 16.92 V | 35 W | 2.07 A | 20.87 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU1EG-1SBVA484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | Active | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1UBVA530E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ATWINC1500B-MU-Y042 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | QFN-40 | YES | 40-QFN (5x5) | 40 | ATWINC1500 | Microchip Technology / Atmel | 48 MHz | 64 kB, 128 kB | RAM | 490 | MICROCHIP TECHNOLOGY INC | I2C, SPI, UART | Microchip | ATWINC1500B-MU-Y042 | 48 MHz | 72.2 Mbps | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | HQCCN | VQFN-40 | LCC40,.2SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 5.06 | 61 mA | 268 mA | 4.2 V | 2.7 V | 3.3 V | -40°C ~ 85°C | Tray | - | Wi-Fi | Wireless & RF Integrated Circuits | Si | 2.7V ~ 3.6V | QUAD | NO LEAD | 0.4 mm | compliant | 2.4GHz | S-PQCC-N40 | 2.4 GHz | INDUSTRIAL | 4MB Flash, 128kB ROM, 224kB RAM | NETWORK CONTROLLER | Flash | 4 MB | 18.5 dBm | 32 bit | 1 mm | RF System on a Chip - SoC | 802.11b/g/n | 20.5dBm | WiFi | - 74 dBm | 72.2Mbps | I²C, SDIO, SPI, UART | 22mA ~ 58.5mA | 22mA ~ 294mA | CCK, DSSS, OFDM | 9 | RF System on a Chip - SoC | 0.85 mm | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A06G037GNP#AA0 | Renesas | Datasheet | 200 | - | Min: 1 Mult: 1 | 64-VFQFN Exposed Pad | Renesas Electronics | 25 | 128 kB | 128 kB | Renesas Electronics | 138 MHz, 276 MHz | + 85 C | Renesas Electronics America Inc | - 40 C | Yes | SMD/SMT | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 85°C (TA) | Tray | - | Microprocessors - MPU | 1.1 V | 128KB | ARM® Cortex®-M3 | PWM | 32 bit | Microprocessors - MPU | - | 2 Core | - | Microprocessors - MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCSG536T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA | 536-BGA (16x16) | Siemens Building Technologies | 599-03156 | Microchip Technology | MCU - 136, FPGA - 168 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Male | Male | Q-2I01A0 | RG-316 | 6 GHz | Amphenol Custom Cable | 720 | 50 Ohms | Bag | Active | - | - | Copper | - | MCX to N-Type | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | MCX Plug, Right Angle | N-Type Plug | FPGA - 2.2M Logic Elements | - | Shielded | 39.4 (1.0m) 3.3 |
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EP06ELA-512-SGA
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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PIC32CX1025SG41100-I/E5X
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS025T-FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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EG21GGB-MINIPCIE-S
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU1EG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-2UBVA530I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-1UBVA530I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU1EG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM6750A2KFEBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS160T-FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM63138DKFSBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-2UBVA530E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU1EG-1SBVA484Q
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB014R24B2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU1EG-1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-1UBVA530E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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ATWINC1500B-MU-Y042
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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R9A06G037GNP#AA0
Renesas
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS250T-FCSG536T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R31C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire