The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Material | Housing Material | Weight | Body Material | Shape | Number of Terminals | Actuator Material | Jacket (Insulation) Material | Contact Material - Plating | ActuatorColor | Approvals | Base Product Number | Cable Types | Class | Contact Materials | Data RAM Size | For Use With/Related Products | Frequency-Max | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Voltage Rated | Voltage Rating AC | Voltage-Input | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Type | Number of Positions | Terminal Finish | Color | Applications | Number of Rows | Gender | Additional Feature | HTS Code | Subcategory | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Base Part Number | Insulation Color | Output | Contact Finish | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Power Supplies | Temperature Grade | Note | Number of Channels | Interface | Number of Circuits | Plating | Attachment Method | Connector Style | Speed | RAM Size | Current - Output | Accessory Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Cable Opening | Current - Supply | Voltage - Output | Response Time | Architecture | Mating Cycles | Data Bus Width | Frequency - Switching | Number of Inputs | Fuse Type | Seated Height-Max | Utilized IC / Part | Supplied Contents | Programmable Logic Type | Breaking Capacity @ Rated Voltage | Thread Size | Tool Type | Input | Ratio - Input:Output | Number of Positions/Contacts | Includes | 1st Connector | 2nd Connector | PLL | Differential - Input:Output | Internal Switch(s) | Screening Level | Board Type | Insertion Loss | Flat Flex Type | Speed Grade | Connector/Contact Type | Main Purpose | Cable Diameter | Cable End Type | Connector Usage | Locking Feature | Data Rate (Max) | Divider/Multiplier | Primary Attributes | Outputs and Type | Fiber Type | Regulator Topology | Number of Logic Cells | Number of Cores | Body Color | Color - Connectors | Return Loss | Delay Time | Panel Hole Size | Industry Recognized Mating Diameter | Color - Cable | Bend Radius | Actual Diameter | End - Size | Signal Lines | Flash Size | Capacitance - Input | Mating Length/Depth | Features | Signal Conditioning | Device Core | Height | Length | Width | Contact Finish Thickness | Plating Thickness | Length - Overall | Height Above Board | FFC, FCB Thickness | Material Flammability Rating | Ratings |
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 | Mfr Part No M2S050-1VFG400 | Microchip | Datasheet | 2061 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | -- | M2S050 | Twin Zip | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S050-1VFG400 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 207 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | -- | e1 | Active | -- | Multimode, Duplex | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | LC Duplex | ST (2) | 0.20dB | 0.08 (2.0mm) | FPGA - 50K Logic Modules | 62.5/125 | 56340 | 1 Core | Beige | -- | Orange | -- | 256KB | Riser, Zipcord | 17 mm | 17 mm | 131.2 (40.0m) | OFNR | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FSVH1760E | AMD | Datasheet | 433 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | -- | AMD | 574 | Tray | Active | 0°C ~ 100°C (TJ) | -- | Active | 533MHz, 1.333GHz | 256KB | -- | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG400 | Microchip | Datasheet | 30 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | 16-TSSOP | M2S025 | 64 kB | 133MHz | - | - | -- | 166 MHz | Microchip Technology | SMD/SMT | 207 | 27696 LE | Tray | Active | Compliant | 0°C ~ 70°C | Tape & Reel (TR) | -- | Active | -- | Zero Delay Buffer | 3 V ~ 3.6 V | IDT2309-1 | LVTTL | 1 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | LVTTL | 1:9 | Yes with Bypass | No/No | No/No | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FGG676I | Microchip | Datasheet | 2269 | - | Min: 1 Mult: 1 | Surface Mount, Right Angle | 676-BGA | YES | 676-FBGA (27x27) | Thermoplastic, Glass Filled | 676 | -- | -- | M2S090 | Phosphor Bronze | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S090T-FGG676I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 50V | -20°C ~ 85°C | Tape & Reel (TR) | -- | e1 | Active | -- | Solder | 26 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | 0.039 (1.00mm) | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 0.5A | Tin | S-PBGA-B676 | 425 | Not Qualified | Black | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | -- | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPC | Contacts, Bottom | Straight | -- | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | Solder Retention | 27 mm | 27 mm | 120.0µin (3.05µm) | 0.126 (3.20mm) | 0.30mm | UL94 V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3382DKFEBG | AVAGO | Datasheet | - | - | Min: 1 Mult: 1 | Holder | Rectangular, Blade | CSA, UR | -- | -- | Compliant | 1.3kV | -- | Bulk | -- | 2.913 L x 2.402 W x 3.032 H (74.00mm x 61.00mm x 77.00mm) | Active | -- | Electrical, Industrial | 350A | -- | Square | 100kA | Indicating | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VF256I | Microchip | Datasheet | 30 | - | Min: 1 Mult: 1 | -- | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | 64 kB | - | - | -- | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | -- | -- | Active | -- | -- | 8 | -- | -- | -- | -- | Drawer | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Plug | FPGA - 5K Logic Modules | 1 Core | 128KB | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FFVE1156I | AMD | Datasheet | 464 | - | Min: 1 Mult: 1 | Through Hole | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | -- | Copper Alloy | Tin | Copper Alloy | 1.8, 2.5, 3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | -- | AMD | Surface Mount | 366 | Tray | Active | Industrial grade | -- | -20°C ~ 65°C | Bulk | -- | Obsolete | Solder | Phono (RCA) Jack | Female | Unshielded | Black | 3.4, 5.5 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | -- | MCU, FPGA | 64 Bit | -- | 2 Conductors, 2 Contacts | -- | Does Not Contain Switch | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | Silver | -- | 3.20mm ID, 9.00mm OD (RCA) | -- | Mono | - | -- | Mounting Hardware | ARM Cortex-A53/ARM Cortex-R5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-1LSINSVG1369 | AMD | Datasheet | 472 | - | Min: 1 Mult: 1 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-TSSOP | AMD | 500 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | -- | Obsolete | Buffer, ReDriver | I²C - Hotswap | 2.7 V ~ 5.5 V | PCA9510 | 2-Wire Bus | 1 | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 6mA | MPU, FPGA | 2-Wire Bus | 400kHz | Versal™ AI Core FPGA, 1M Logic Cells | -- | - | 1.9pF | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FCSG325I | Microchip | Datasheet | 2267 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | Rectangle | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-FCSG325I | 166 MHz | Microchip Technology | 3 | 200 | 56520 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | -- | e1 | Active | Fabric Over Foam | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | -- | Adhesive | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 0.079 (2.00mm) | 18.000 (457.20mm) | 0.161 (4.10mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3384EUKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | -- | Broadcom Limited | Tray | Obsolete | -- | Active | Wrench Set | 1-1/8 ~ 1-1/2 | Set of 5, Angled 15° | Assorted | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-2CLG484I | AMD | Datasheet | 1601 |
| Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | XC7Z014 | 1.05 V | AMD | 0.95 V | 200 | Tray | Active | 1.0000 V | 5 V ~ 15 V | -40 to 100 °C | -- | Active | LT1425 | 766MHz | 256KB | -- | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ±15V | MCU, FPGA | -- | LT1425 | Board(s) | Fully Populated | 2 | DC/DC Converter | Artix™-7 FPGA, 65K Logic Cells | 2, Isolated | Flyback | - |
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M2S050-1VFG400
Microchip
Package:Embedded - System On Chip (SoC)
215.417972
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XCZU46DR-2FSVH1760E
AMD
Package:Embedded - System On Chip (SoC)
30,636.389419
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M2S025TS-1VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3382DKFEBG
AVAGO
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-VF256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE1752-1LSINSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3384EUKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z014S-2CLG484I
AMD
Package:Embedded - System On Chip (SoC)
174.228382