The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Actuator Length
- Actuator Type
- Angle of Throw
- Architecture
- Base Product Number
- Circuit per Deck
- Connectivity
- Contact Finish
- Contact Materials
- Contact Timing
- Current Rating
- Series
- Series:
42
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Contact Materials | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rating AC | Voltage Rating DC | Operating Temperature | Series | JESD-609 Code | Part Status | Number of Positions | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Contact Finish | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Panel Cutout Dimensions | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Number of Decks | Architecture | Number of Inputs | Operating Force | Seated Height-Max | Programmable Logic Type | Contact Timing | Index Stops | Circuit per Deck | Depth Behind Panel | Number of Poles per Deck | Angle of Throw | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Length | Width | Actuator Length |
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 | Mfr Part No M2S060-1FGG676 | Microchip | Datasheet | 1795 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 676-BGA | 676-FBGA (27x27) | M2S060 | Silver Alloy | 64 kB | - | - | 166 MHz | Microchip Technology | 387 | 56520 LE | Tray | Active | Compliant | 115V | 28V | 0°C ~ 85°C (TJ) | 42 | Active | 8 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 1 | MCU, FPGA | 5.761 ~ 83gfm | Non-Shorting (BBM) | Fixed | SP8T | 26.04mm | 1 | 36° | FPGA - 60K Logic Modules | 1 Core | 256KB | -- | 11.10mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FCS325 | Microchip | Datasheet | 2261 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | Silver Alloy | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050T-1FCS325 | 166 MHz | Microchip Technology | SMD/SMT | 200 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 115V | 28V | 0°C ~ 85°C (TJ) | 42 | e0 | Active | 4 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | 1A (AC/DC) | -- | Solder Lug | S-PBGA-B325 | 200 | Not Qualified | Flatted (6.35mm Dia) | -- | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 3 | MCU, FPGA | 200 | 5.761 ~ 83gfm | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | Non-Shorting (BBM) | Fixed | DP4T | 43.61mm | 2 | 36° | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | -- | 11 mm | 11 mm | 11.10mm |