The category is 'Embedded - System On Chip (SoC)'
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A2F500
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Center Frequency | Clock Frequency-Max | Core | Data RAM Size | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Frequency Aging | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Operating Supply Current | Load Capacitance | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Core Architecture | Number of Gates | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Output Level | Flash Size | Product Category | Length | Width |
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 | Mfr Part No A2F500M3G-FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 80 MHz | + 85 C | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Details | This product may require additional documentation to export from the United States. | SmartFusion | Tray | A2F500 | 1.5 V | 16.5 mA | 512 kB | 500000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 80 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Details | SmartFusion | 0.062696 oz | Tray | A2F500 | 1.5 V | 16.5 mA | 512 kB | 500000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 100 MHz | + 85 C | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Details | SmartFusion | 0.534969 oz | Tray | A2F500 | 1.5 V | 16.5 mA | 512 kB | 500000 | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG484 | Microchip Technology | Datasheet | 1712 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 60 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256 | Microchip Technology | Datasheet | 1766 |
| Min: 1 Mult: 1 | FPBGA-256 | 256-FPBGA (17x17) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 90 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 117 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1CSG288 | Microchip Technology | Datasheet | 1936 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F500 | ARM Cortex M3 | 64 kB | 176 | - | - | 100 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 6000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F500 | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG256 | Microchip Technology | Datasheet | 2246 |
| Min: 1 Mult: 1 | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FG256 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 117 I/O | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 17 mm | 17 mm | |||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1PQ208I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F500M3G | ARM Cortex M3 | 64 kB | 24 | - | - | 100 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 113 I/O | - | 6000 LE | Tray | Obsolete | N | This product may require additional documentation to export from the United States. | SmartFusion | 0.183425 oz | -40°C ~ 100°C (TJ) | Tray | A2F500 | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-CS288 | Microchip Technology | Datasheet | 36 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F500 | ARM Cortex M3 | 64 kB | 176 | - | - | 80 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F500 | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1CS288 | Microchip Technology | Datasheet | 38 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | A2F500M3G-1CS288 | 100 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F500 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-CS288I | Microchip Technology | Datasheet | 36 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F500 | ARM Cortex M3 | 64 kB | 176 | - | - | 80 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | -40°C ~ 100°C (TJ) | Tray | A2F500 | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG484M | Microchip Technology | Datasheet | 520 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 60 | - | - | 80 MHz | Microchip Technology | Yes | MCU - 41, FPGA - 128 | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | -55°C ~ 125°C (TJ) | Tray | A2F500 | 125 °C | -55 °C | 80 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 60 | - | - | 80 MHz | Microchip Technology | Yes | MCU - 41, FPGA - 128 | - | 6000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion | -55°C ~ 125°C (TJ) | Tray | A2F500 | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG484 | Microchip Technology | Datasheet | 2031 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 60 | - | - | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG484I | Microchip Technology | Datasheet | 1908 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 500000 | 500000 | 60 | MICROSEMI CORP | - | - | A2F500M3G-1FGG484I | 100 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 204 I/O | - | 6000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | -40 to 100 °C | Tray | A2F500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 16.5 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG484I | Microchip Technology | Datasheet | 1660 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 60 | - | - | 80 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | -40°C ~ 100°C (TJ) | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG484I | Microchip Technology | Datasheet | 2126 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | A2F500M3G-1FG484I | 100 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 204 I/O | - | 6000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | -40 to 100 °C | Tray | A2F500 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 128 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG484M | Microchip Technology | Datasheet | 650 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 60 | - | - | 100 MHz | Microchip Technology | Yes | MCU - 41, FPGA - 128 | - | 6000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion | -55°C ~ 125°C (TJ) | Tray | A2F500 | 125 °C | -55 °C | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484I | Microchip | Datasheet | 1765 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | 80 MHz | 64 kB | 60 | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484I | 80 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 204 I/O | - | 6000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.22 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0.062696 oz | -40°C ~ 100°C (TJ) | Tray | A2F500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 16.5 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | SoC FPGA | 23 mm | 23 mm | ||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484 | Microchip | Datasheet | 1704 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | 40 MHz | 80 MHz | 64 kB | 500000 | 500000 | 60 | ±2.8(20th) ppm/Year | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484 | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 204 I/O | - | 6000 LE | 85 °C | 40 MHz | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.37 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | -20 to 70 °C | Tray | A2F500 | e1 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 4.6 ppm | 10 | S-PBGA-B484 | 128 | Not Qualified | 3.0000 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 10 pF | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | Clipped Sinewave | 512KB | SoC FPGA | 23 mm | 23 mm |
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A2F500M3G-FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-FGG484I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
141.056943
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A2F500M3G-FG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
116.364817
-
A2F500M3G-1CSG288
Microchip Technology
Package:Embedded - System On Chip (SoC)
120.078042
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A2F500M3G-1FG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
130.593301
-
A2F500M3G-1PQ208I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-CS288
Microchip Technology
Package:Embedded - System On Chip (SoC)
107.452506
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A2F500M3G-1CS288
Microchip Technology
Package:Embedded - System On Chip (SoC)
89.841678
-
A2F500M3G-CS288I
Microchip Technology
Package:Embedded - System On Chip (SoC)
104.281795
-
A2F500M3G-FG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
1,094.037392
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A2F500M3G-FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
155.398267
-
A2F500M3G-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
113.381408
-
A2F500M3G-FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
159.550973
-
A2F500M3G-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
175.439367
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A2F500M3G-1FGG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
1,152.468001
-
A2F500M3G-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
136.761535
-
A2F500M3G-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire