The category is 'Embedded - System On Chip (SoC)'
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- Data RAM Size
- Factory Pack QuantityFactory Pack Quantity
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- Series:
A2F500
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Number of Pins | Supplier Device Package | Base Product Number | Core | Data RAM Size | Device Logic Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Part Life Cycle Code | Product Status | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | Max Operating Temperature | Min Operating Temperature | HTS Code | Reach Compliance Code | Frequency | Operating Supply Voltage | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Core Architecture | Speed Grade | Primary Attributes | Number of Registers | Number of Cores | Flash Size |
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 | Mfr Part No A2F500M3G-1FG484M | Microchip Technology | Datasheet | 404 |
| Min: 1 Mult: 1 | 484-BGA | 484 | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | A2F500M3G-1FG484M | 100 MHz | Microchip Technology | Yes | MCU - 41, FPGA - 128 | - | 6000 LE | Tray | Active | Active | 5.86 | N | No | ARMu00ae Cortexu00ae-M3 System On Chip (SOC) IC SmartFusionu00ae ProASICu00ae3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 100MHz 484-FPBGA (23x23) | This product may require additional documentation to export from the United States. | SmartFusion | -55°C ~ 125°C (TJ) | Tray | A2F500 | 125 °C | -55 °C | 8542.39.00.01 | unknown | 100 MHz | 1.5 V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 13.5 kB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 1 Core | 512KB | ||||||
| Mfr Part No A2F500M3G-1FGG256M | Microchip Technology | Datasheet | 745 | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 90 | MICROSEMI CORP | - | - | A2F500M3G-1FGG256M | 100 MHz | 1.575 V | Microchip Technology | 1.425 V | Yes | 3 | MCU - 25, FPGA - 66 | - | 6000 LE | Tray | Active | Active | 5.79 | Details | Yes | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 125 °C | -55 °C | 8542.39.00.01 | compliant | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB |