The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Architecture
- Connectivity
- Core Processor
- Flash Size
- Number of I/Os
- Operating Temperature
- Package / Case
- Peripherals
- Primary Attributes
- RAM Size
- Series
- Speed
- Series:
Automotive, AEC-Q100, SmartFusion®2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Supplier Device Package | Base Product Number | Display | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Mounting | Number of I/Os | Package | Package Description | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Typical Operating Supply Voltage | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Temperature Coefficient | Resistance | Terminal Finish | Applications | Power Rating | Peak Reflow Temperature (Cel) | Depth | Resistor Type | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Output | Function | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Programmable Logic Type | Max Frequency | Speed Grade | Resistance Tolerance | Primary Attributes | Flash Size | Nominal Input Voltage (AC) | Product Length | Product Width | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2S060TS-1VFG400T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | MICROSEMI CORP | Miscellaneous | IRTR68 | Microchip Technology | 3 | 207 | Tray | , | Active | Active | 40 | 5.8 | Yes | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 256KB | ||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG676T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | Johnson Controls | VS027431B-SM1P3 | Microchip Technology | Panel | 387 | JHSN_DRIV_VSD-II | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 15.3125 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 320 Hz | 1 | FPGA - 60K Logic Modules | 256KB | 480 VAC | 9.40625 | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256T2 | Microchip | Datasheet | 2150 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S025 | No Display | Honeywell | C7772G1004/U | Microchip Technology | 138 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | Indoor | 10 kOhm NTC | Temperature | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG400T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | MICROSEMI CORP | Microsemi Corporation | M2S025TS-1VFG400T2 | Microchip Technology | 207 | Tray | Active | Active | 40 | 5.81 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VFG256T2 | Microchip | Datasheet | 22 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | MICROSEMI CORP | Microsemi Corporation | M2S005S-1VFG256T2 | Microchip Technology | 161 | Tray | , | Active | Active | 40 | 5.8 | Yes | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG256T2 | Microchip | Datasheet | 29 | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010TS-1VFG256T2 | Microchip Technology | 138 | Tray | Active | Active | 40 | 5.8 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | 100 ppm/K | 28 Ohm | Tin/Silver/Copper (Sn/Ag/Cu) | 0.5 W | 250 | General Purpose | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | 1 | FPGA - 10K Logic Modules | 256KB | 3.2 | 2.5 | ||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG484T2 | Microchip | Datasheet | 2204 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S060 | Microchip Technology | 267 | Tray | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484T2 | Microchip | Datasheet | 1680 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | Microchip Technology | 267 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG400T2 | Microchip | Datasheet | 1809 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010TS-1VFG400T2 | Microchip Technology | 195 | Tray | , | Active | Active | 40 | 5.8 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1FGG484T2 | Microchip | Datasheet | 1648 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010TS-1FGG484T2 | Microchip Technology | 233 | Tray | Active | Active | 40 | 5.81 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG676T2 | Microchip | Datasheet | 2153 | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | Microchip Technology | 425 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S005S-1VFG256T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | 161 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | 138 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S010TS-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 233 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 209 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG256T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | 138 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S025TS-1VFG400T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 207 | -40°C~125°C TJ | Tray | 2016 | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 267 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1VFG400T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 207 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 267 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 256KB | RoHS Compliant |
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M2S060TS-1VFG400T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG676T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
207.144895
-
M2S025TS-1VFG400T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
57.597934
-
M2S010TS-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1FGG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-1VFG400T2
Microchip
Package:Embedded - System On Chip (SoC)
127.505329
-
M2S010TS-1FGG484T2
Microchip
Package:Embedded - System On Chip (SoC)
147.818893
-
M2S090TS-1FGG676T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VFG256T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG256T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010TS-1VFG256T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG400T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1VFG400T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire