The category is 'Embedded - System On Chip (SoC)'
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- Composition
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- Ihs Manufacturer
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- Series:
Military, MIL-PRF-55182/01, RNC55
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Power (Watts) | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width |
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 | Mfr Part No M2S150TS-1FC1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC55 | MICROSEMI CORP | Microsemi Corporation | M2S150TS-1FC1152M | Vishay Dale | 574 | 125 °C | -55 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | -65°C ~ 175°C | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±1% | e0 | 2 | 3A001.A.2.C | ±25ppm/°C | 3.65 kOhms | Tin/Lead (Sn/Pb) | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | S (0.001%) | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | Military, Moisture Resistant, Weldable | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||
| Mfr Part No 10AS032H2F35I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RNC55 | INTEL CORP | Intel Corporation | 10AS032H2F35I1SG | Vishay Dale | 384 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -65°C ~ 175°C | Tray | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±1% | Discontinued at Digi-Key | 2 | ±50ppm/°C | 10 Ohms | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | R (0.01%) | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | -- | Military, Moisture Resistant, Weldable | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C4U19I3SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | 484 | Axial | 484 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016C4U19I3SG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964681 | Active | NOT SPECIFIED | 1.96 | Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±50ppm/°C | 22.6 kOhms | 100 °C | -40 °C | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 192 | Not Qualified | 1.8 V | P (0.1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 3 | 6 Transceiver | FPGA - 160K Logic Elements | 246040 | 160000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | -- | 19 mm | 19 mm |