Embedded - System On Chip (SoC) (1)

Package / Case

Surface Mount

Terminal Shape

Mounting Feature

Supplier Device Package

Dielectric Material

Number of Terminals

Ihs Manufacturer

Manufacturer

Manufacturer Part Number

Manufacturer Series

Number of I/Os

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Reflow Temperature-Max (s)

Risk Rank

Rohs Code

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Operating Temperature

Packaging

Series

JESD-609 Code

Part Status

Temperature Coefficient

Terminal Finish

Capacitance

Packing Method

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Base Part Number

JESD-30 Code

Number of Outputs

Capacitor Type

Temperature Characteristics Code

Multilayer

Temperature Grade

Size Code

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Positive Tolerance

Negative Tolerance

Architecture

Number of Inputs

Organization

Seated Height-Max

Programmable Logic Type

Primary Attributes

Number of CLBs

Number of Logic Cells

Flash Size

Height

Length

Width