The category is 'Embedded - System On Chip (SoC)'
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SmartFusion®2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Number of Terminals | # I/Os (Max) | Approvals | Base Product Number | Base/Housing Material | Body Orientation | Brand | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operation | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Switching Regulator | Termination Method | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Gender | Additional Feature | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Output Voltage | Operating Supply Voltage | Power Supplies | Temperature Grade | Number of Ports | Speed | RAM Size | Output Current | Core Processor | Peripherals | Program Memory Size | Connectivity | Output Power | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Terminal Type | Product Type | Total RAM Bits | Speed Grade | Resistance Tolerance | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Connection Type | Input Voltage | Product Category | Contacts | IP Rating | Length | Width | Width (in) |
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 | Mfr Part No M2S050TS-FG484 | Microchip | Datasheet | 1642 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 56340 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG676I | Microchip | Datasheet | 1779 |
| Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 425 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152I | Microchip | Datasheet | 1843 |
| Min: 1 Mult: 1 | Gold | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 15 | M2S150 | PCT (Polychlorinated Terphenyl) | Right Angle | Microchip Technology / Atmel | Copper Alloy | 64 kB | 24 | MICROSEMI CORP | - | - | Microchip | M2S150T-1FC1152I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 574 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | 1.26 V | 1.14 V | 1.2 V | Solder | 1.2 V | 1.234218 oz | -55 to 125 °C | Tray | SmartFusion®2 | e0 | D-Subminiature | Tin/Lead (Sn/Pb) | Receptacle | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | 1152 | S-PBGA-B1152 | 574 | Not Qualified | 15 POS | 1.2 V | 1 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG400I | Microchip | Datasheet | 2042 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | Through Hole | SMD/SMT | 207 | 27696 LE | Tray | Active | Eighth-Brick | Yes | -40 to 125 °C | SmartFusion®2 | Step Down | 8 | 1 | 3.3 V | 166MHz | 64KB | 20 A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 66 W | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | 36 to 75 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-VFG400 | Microchip | Datasheet | 2049 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | 207 | M2S050 | 64 kB | SMARTFUSION2 | - | - | 56340 | 166 MHz | + 85 C | Microchip Technology | 0 C | Surface Mount | SMD/SMT | 207 | 56340 | 56340 LE | 1.26(V) | 1.14(V) | 1.2(V) | 0C to 85C | 85C | 0C | COMMERCIALC | Tray | VFBGA | 65nm | Active | Yes | No | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | 400 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG484I | Microchip | Datasheet | 1762 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1FGG484I | Microchip | Datasheet | 4000 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-1FGG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | MSL 3 - 168 hours | 209 | 6060 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.79 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 191Kbit | 1 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-TQ144 | Microchip | Datasheet | 2143 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S005-TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.85 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-FGG484 | Microchip | Datasheet | 39 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | 64 kB | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | SMD/SMT | 233 | 12084 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VFG256I | Microchip | Datasheet | 134 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VFG400 | Microchip | Datasheet | 25 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-VFG400 | 166 MHz | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 169 | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.28 | Yes | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 171 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VFG400 | Microchip | Datasheet | 25 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | 207 | 27696 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-FGG484 | Microchip | Datasheet | 96 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | 25 V | 0 to 85 °C | SmartFusion®2 | 200 ppm/°C | 6.8 | 0.05 W | General Purpose | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-FGG484 | Microchip | Datasheet | 24 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | 64 kB | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 233 | 12084 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-FCS325 | Microchip | Datasheet | 1617 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | 200 | 56340 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-VFG256 | Microchip | Datasheet | 106 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 256-LBGA | 256 | 256-FPBGA (17x17) | CE, CSA, UL | M2S010 | 64 kB | - | - | Cutler Hammer, Div of Eaton Co | 10250T112-2 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | SMD/SMT | 138 | 12084 LE | Momentary | Tray | Active | Compliant | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 85 °C | 0 °C | 1.2 V | 166MHz | 50 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Screw | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | 2NO | IP65 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCSG325 | Microchip | Datasheet | 1670 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | Nylon | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Thomas & Betts | TY23M-4 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 200 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 5.82 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Yellow | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | 0.093 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FCSG325I | Microchip | Datasheet | 2081 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Schneider | 136499 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 200 | 56340 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Yes | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | Threaded | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FG676I | Microchip | Datasheet | 1721 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-1FG676I | 166 MHz | Microchip Technology | 3 | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm |
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M2S050TS-FG484
Microchip
Package:Embedded - System On Chip (SoC)
235.024276
-
M2S090-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
311.754501
-
M2S150T-1FC1152I
Microchip
Package:Embedded - System On Chip (SoC)
528.956497
-
M2S025T-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
125.949537
-
M2S090-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
46.595146
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M2S005-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
73.638752
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M2S025-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
94.451693
-
M2S010S-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050TS-FCS325
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-VFG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-FCSG325
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
307.666446