The category is 'Embedded - System On Chip (SoC)'
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SmartFusion®2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Material | Number of Terminals | Angle | Approvals | Base Product Number | Brand | Cable Style | Case Size | Case Style | Connections | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Grip Type | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Cable Diameter (mm) | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Cable Diameter (mm) | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shaft Type | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Timing Range | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Termination | Terminal Finish | Composition | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Output Voltage | Output Type | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Mode of Operation | Input Voltage | Product Category | Contacts | Bearings | IP Rating | Mating Connector | Length | Width | Lead Free |
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 | Mfr Part No M2S150-1FC1152I | Microchip | Datasheet | 2135 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FC1152I | 166 MHz | Microchip Technology | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-VFG400 | Microchip | Datasheet | 1890 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | 207 | 27696 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-FGG484I | Microchip | Datasheet | 2399 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050TS-FGG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.82 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FCSG325 | Microchip | Datasheet | 1866 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-FCSG325 | 166 MHz | Microchip Technology | 3 | 200 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FG896I | Microchip | Datasheet | 1968 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050T-FG896I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 377 | 56340 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1TQG144T2 | Microchip | Datasheet | 2144 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S005 | MICROSEMI CORP | Microsemi Corporation | M2S005S-1TQG144T2 | Microchip Technology | 3 | 213 | Tray | Active | Active | 40 | 5.79 | Yes | 0°C ~ 85°C (TJ) | SmartFusion®2 | Pure Matte Tin (Sn) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1TQG144I | Microchip | Datasheet | 2148 |
| Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Steel | Straight | cUL, UL | M2S010 | Round | 64 kB | Bushing Grip with Strain Relief | - | - | Crouse-Hinds Industrial Produc | CGB399 | 30.18 mm | 166 MHz | Microchip Technology | 25.4 mm | SMD/SMT | 84 | 12084 LE | Tray | Active | No | 1.2000 V | -40 to 100 °C | SmartFusion®2 | Metallic | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG256I | Microchip | Datasheet | 39 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 138 | 27696 LE | Tray | Active | Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-TQG144 | Microchip | Datasheet | 300 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S005 | Microchip Technology / Atmel | 64 kB | 191 kbit | 60 | - | - | Microchip | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 84 | 505 LAB | 6060 LE | Tray | Active | Details | 0.035380 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FG484I | Microchip | Datasheet | 2048 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 56340 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-VFG400I | Microchip | Datasheet | 1859 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | 400-VFBGA (17x17) | M2S060 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 207 | 56520 LE | Tray | Active | Non-Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-FG484I | Microchip | Datasheet | 2379 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 27696 LE | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-VF400I | Microchip | Datasheet | 2032 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-VF400I | 166 MHz | Microchip Technology | 207 | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCV484I | Microchip | Datasheet | 1744 |
| Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCV484I | 166 MHz | Microchip Technology | 273 | 146124 LE | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FG484I | Microchip | Datasheet | 1681 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | Clarostat-Honeywell | 73JA500 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCSG325I | Microchip | Datasheet | 1752 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | DIN Rail,Surface | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | CSA, UL | M2S060 | MICROSEMI CORP | Syrelec, Brand of Crouzet Control | SHS1S24A | 1.26 V | Microchip Technology | 1.14 V | 3 | 200 | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 2.36 | No | Yes | 8542390000 | 1.26 V | 1.14 V | 1.2 V | 1 | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | 0.250 in Flat Blade | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 60K Logic Modules | 56520 | 256KB | Interval | Solid State | IP66 | 11 mm | 11 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-FCG1152 | Microchip | Datasheet | 2374 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2S150 | Danaher Controls | HS350100G134C | Microchip Technology | Hollowshaft | 574 | Tray | Active | Hollow | 1.2000 V | -40 to 70 Degrees C | SmartFusion®2 | 6 ft Cable | 5~26 VDC | Differential | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 512KB | 5~26 VDC | Yes | IP67 | Not Included | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCS536I | Microchip | Datasheet | 1826 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCS536I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 293 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-VFG400 | Microchip | Datasheet | 1688 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S050 | 2.5 | Lower Mount | 1/4 NPT | 64 kB | - | - | NOSHOK | 25-410-1500-psi/kg/cm2 | 166 MHz | Microchip Technology | SMD/SMT | 207 | 56340 LE | Tray | Active | 0-1,500 psi | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FG896I | Microchip | Datasheet | 1696 |
| Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | Electri-Flex | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 896 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB |
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M2S150-1FC1152I
Microchip
Package:Embedded - System On Chip (SoC)
554.240051
-
M2S025T-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FCSG325
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FG896I
Microchip
Package:Embedded - System On Chip (SoC)
212.938777
-
M2S005S-1TQG144T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1TQG144I
Microchip
Package:Embedded - System On Chip (SoC)
42.393072
-
M2S025T-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-VF400I
Microchip
Package:Embedded - System On Chip (SoC)
236.807876
-
M2S150T-FCV484I
Microchip
Package:Embedded - System On Chip (SoC)
246.426339
-
M2S025-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-FCG1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-FCS536I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1FG896I
Microchip
Package:Embedded - System On Chip (SoC)
223.451275