The category is 'Embedded - System On Chip (SoC)'
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SmartFusion®2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Package / Case | Surface Mount | Supplier Device Package | Material | Body Material | Number of Terminals | Mounting Hole Diameter | Package Quantity | Base Product Number | Data RAM Size | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting Method | Mounting Orientation | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Special Features | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Pbfree Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Additional Feature | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Includes | Speed Grade | Primary Attributes | Number of Logic Cells | Finish | Number of Cores | Overall Length | Flash Size | Pin Diameter | Height Seated (Max) | Length | Width |
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 | Mfr Part No M2S150-FCV484I | Microchip | Datasheet | 1764 |
| Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | 273 | 146124 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FCSG325I | Microchip | Datasheet | 2118 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090T-FCSG325I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 180 | 86316 LE | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.74 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484I | Microchip | Datasheet | 1857 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256 | Microchip | Datasheet | 35 | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | 161 | 6060 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG484 | Microchip | Datasheet | 2393 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 56520 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG676I | Microchip | Datasheet | 2161 |
| Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090TS-1FGG676I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG484I | Microchip | Datasheet | 1932 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 56520 LE | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-VF400I | Microchip | Datasheet | 36 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 207 | 27696 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FGG484 | Microchip | Datasheet | 2192 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 86316 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FCSG325I | Microchip | Datasheet | 1764 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Through Hole | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | Non-Compliant | 13 kV | -40°C ~ 100°C (TJ) | Bulk | SmartFusion®2 | 5 % | 100 °C | -55 °C | 5 nF | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | 45.0088 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCVG484 | Microchip | Datasheet | 1602 |
| Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | 273 | 146124 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FGG484 | Microchip | Datasheet | 1947 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-FGG484 | 166 MHz | Microchip Technology | 3 | 267 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FC1152 | Microchip | Datasheet | 2072 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | Stainless Steel | Stainless Steel | 1152 | 6.5 X 12 mm X 2 | 1 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FC1152 | 166 MHz | Microchip Technology | Screw, Weld | Universal | SMD/SMT | 574 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | Concealed, Removable | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | Natural | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | Fasteners not included | FPGA - 150K Logic Modules | 146124 | Natural | 1 Core | 60.0 mm | 512KB | 5.0 mm | 35 mm | 35 mm | ||||||||||||||||||
| Mfr Part No M2S090-1FGG484I | Microchip | Datasheet | 1768 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 1.26 V | Microchip Technology | 1.14 V | 267 | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1FG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 1.26 V | Microchip Technology | 1.14 V | 267 | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FGG676I | Microchip | Datasheet | 1629 | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | MICROSEMI CORP | Microsemi Corporation | M2S060TS-FGG676I | Microchip Technology | 3 | 387 | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1VFG256I | Microchip | Datasheet | 35 |
| Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010-1VFG256I | Microchip Technology | 3 | 138 | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FG676I | Microchip | Datasheet | 1904 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | Microchip Technology | 387 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VF256I | Microchip | Datasheet | 21 |
| Min: 1 Mult: 1 | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1VF256 | Microchip | Datasheet | 1760 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 138 | 27696 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB |
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M2S150-FCV484I
Microchip
Package:Embedded - System On Chip (SoC)
498.600888
-
M2S090T-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
147.574703
-
M2S005S-VFG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
470.875514
-
M2S060-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
229.023927
-
M2S025T-VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
402.927306
-
M2S060T-1FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
202.241829
-
M2S150T-1FCVG484
Microchip
Package:Embedded - System On Chip (SoC)
245.692756
-
M2S060T-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-1FC1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
418.459850
-
M2S025T-1FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
76.879992
-
M2S060-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
269.786104
-
M2S005S-1VF256I
Microchip
Package:Embedded - System On Chip (SoC)
46.558785
-
M2S025-1VF256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire