The category is 'Embedded - System On Chip (SoC)'
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SmartFusion®2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Package Quantity | Approvals | Base Product Number | Brand | Breakdown Voltage / V | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Input Signal Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Family | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of Elements | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Operation | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Reverse Stand-off Voltage | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | With Switch | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | HTS Code | Subcategory | Power Rating | Pitch | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Style | Resistor Type | Reach Compliance Code | Current Rating | JESD-30 Code | Function | Number of Outputs | Qualification Status | Output Type | Operating Supply Voltage | Polarity | Power Supplies | Temperature Grade | Number of Channels | Voltage | Leakage Current | Element Configuration | Speed | RAM Size | Accessory Type | Core Processor | Number of Poles | Peripherals | Power Line Protection | Program Memory Size | Quiescent Current | Connectivity | Supply Current-Max | Switch Type | Max Reverse Leakage Current | Clamping Voltage | Architecture | Peak Pulse Current | Max Surge Current | Peak Pulse Power | Number of Inputs | Direction | Test Current | Seated Height-Max | Logic Type | Programmable Logic Type | Terminal Type | Product Type | Total RAM Bits | Reverse Breakdown Voltage | High Level Output Current | Depth Behind Panel | Low Level Output Current | Speed Grade | Number of Input Lines | Number of Output Lines | Resistance Tolerance | Primary Attributes | Number of Logic Cells | Finish | Number of Cores | Number of Bidirectional Channels | Flash Size | Min Breakdown Voltage | Lamp Type | Product Category | Cam Length | Contacts | IP Rating | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No M2S010T-VFG400I | Microchip | Datasheet | 38 | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | YES | 2 | 400-VFBGA (17x17) | 400 | M2S010 | 12.2 V | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-VFG400I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 1 | 195 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 11 V | 5.77 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 150 °C | -55 °C | Zener | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 11 V | Bidirectional | 1.2 V | 5 µA | Single | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | No | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 5 µA | 18.2 V | MCU, FPGA | 82.4 A | 82.4 A | 1.5 kW | 195 | Bidirectional | 1 mA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12.2 V | FPGA - 10K Logic Modules | 12084 | 1 Core | 1 | 256KB | 12.2 V | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FG484 | Microchip | Datasheet | 1753 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG484M | Microchip | Datasheet | 448 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | CUL, UL | M2S090 | 64 kB | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | DH361UGK | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 86316 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | Metallic | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 30 A | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 600 V | 166MHz | 64KB | ARM® Cortex®-M3 | 3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Heavy Duty | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | CSA, IEC, UL | M2S005 | 64 kB | MICROSEMI CORP | - | - | ABB | MP1-42L10L8 | 166 MHz | Microchip Technology | SMD/SMT | 169 | 6060 LE | Momentary | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | Fingersafe Screw | 1.91 | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | LED | 1NO | IP66 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FGG484I | Microchip | Datasheet | 2059 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090TS-FGG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FGG484I | Microchip | Datasheet | 2003 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 56340 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-FG484I | Microchip | Datasheet | 2294 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S025 | 1.26 V | Microchip Technology | 1.14 V | 267 | Tray | Active | Non-Compliant | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | Deltron | 10 | MICROSEMI CORP | Deltron | M2S010S-TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | No | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Enclosures, Racks and Boxes | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | Enclosures, Boxes, & Cases | FPGA - 10K Logic Modules | 256KB | Enclosures, Boxes, & Cases | IP66 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | TSSOP-20 | 144-TQFP (20x20) | Texas Instruments | 2000 | Single-Ended | HCT | Texas Instruments | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 84 | Tray | Obsolete | Details | 5.5 V | 4.5 V | 0.002751 oz | -40°C ~ 100°C (TJ) | Reel | SmartFusion®2 | Logic ICs | CMOS | Buffer/Line Driver | 3-State | 5 V | Non-Inverting | 16 Channel | 166MHz | 64KB | ARM® Cortex®-M3 | - | 8 uA | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 8 uA | MCU, FPGA | CMOS | Buffers & Line Drivers | - 6 mA | 6 mA | 8 Input | 8 Output | FPGA - 10K Logic Modules | 256KB | Buffers & Line Drivers | 1.05 mm | 6.6 mm | 4.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1TQG144T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Grayhill | Grayhill | Microchip Technology | 84 | Tray | Active | Pushbutton Switch | -40°C ~ 125°C (TJ) | SmartFusion®2 | Encoders | 0.05 in | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Encoders | FPGA - 10K Logic Modules | 256KB | Encoders | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Advantech | 1 | Advantech | Microchip Technology | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | Memory & Data Storage | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Solid State Drives - SSD | FPGA - 10K Logic Modules | 256KB | Solid State Drives - SSD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-VFG784 | Microchip | Datasheet | 1802 |
| Min: 1 Mult: 1 | 784-FBGA | 784-VFBGA (23x23) | + 85 C | Microchip Technology | 0 C | SMD/SMT | 395 | 56500 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FG484I | Microchip | Datasheet | 1683 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 56340 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-VFG400 | Microchip | Datasheet | 16 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010TS-VFG400 | 166 MHz | Microchip Technology | 3 | 195 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1FGG484I | Microchip | Datasheet | 21 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-1FGG484I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 233 | 12084 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | 100 ppm/K | 60.4 kOhm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | 1 W | CMOS | BOTTOM | BALL | 250 | 1 mm | General Purpose | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-1FG676I | Microchip | Datasheet | 2256 |
| Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 425 | 86316 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-VFG400I | Microchip | Datasheet | 2036 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 207 | 56340 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152 | Microchip | Datasheet | 2280 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 1 | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 574 | 146124 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | No Stopper | 166MHz | 64KB | Cam | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | Zinc-Plated | 1 Core | 512KB | 45.0 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VFG256I | Microchip | Datasheet | 129 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | Microchip Technology | MSL 3 - 168 hours | 161 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 191Kbit | FPGA - 5K Logic Modules | 128KB |
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M2S010T-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-1FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
449.715724
-
M2S050T-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
168.240471
-
M2S010S-TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-1TQG144T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-1TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-VFG784
Microchip
Package:Embedded - System On Chip (SoC)
192.282226
-
M2S050-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
92.100440
-
M2S010T-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
494.192596
-
M2S050T-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FC1152
Microchip
Package:Embedded - System On Chip (SoC)
474.705330
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M2S005-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
40.897119