The category is 'Embedded - System On Chip (SoC)'
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SmartFusion®2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Number of Terminals | Base Product Number | Brand | Capacitance Tolerance | Country of Origin | Data RAM Size | Distributed RAM | ECCN | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Additional Feature | HTS Code | Capacitance | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Load Capacitance | Speed | RAM Size | Core Processor | Illumination | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Output Level | Flash Size | Language | Product Category | Product Length | Product Width | Height | Length | Width |
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 | Mfr Part No M2S005-VF256I | Microchip | Datasheet | 38 |
| Min: 1 Mult: 1 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-VF256I | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152M | Microchip | Datasheet | 774 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | MICROSEMI CORP | Cully-Minerallac | NC16 | Microchip Technology | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCVG484 | Microchip | Datasheet | 1614 |
| Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FCVG484 | 166 MHz | Microchip Technology | 4 | 273 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCS325I | Microchip | Datasheet | 2184 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | Polystyrene | M2S060 | US | 64 kB | EAR99 | - | - | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | Facility Identification | 166MHz | 64KB | ARM® Cortex®-M3 | Not Illuminated | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | English | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1FGG484 | Microchip | Datasheet | 20 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010-1FGG484 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 233 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 10% | 64 kB | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 1 uF | 896 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | 3.2 mm | 3.2 x 2.5 x 2.79 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484M | Microchip | Datasheet | 2071 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 27696 LE | Tray | Active | Compliant | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FGG896 | Microchip | Datasheet | 2203 | - | Min: 1 Mult: 1 | 896-BGA | 896-FBGA (31x31) | M2S050 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-FGG484 | Microchip | Datasheet | 60 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-FGG484 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | 3 | SMD/SMT | 209 | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 2.39 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FG484 | Microchip | Datasheet | 1625 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S050 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 56340 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG400I | Microchip | Datasheet | 9 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | 169 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQG144 | Microchip | Datasheet | 2146 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | M2S010 | Microchip Technology / Atmel | 64 kB | 400 kbit | 60 | - | - | Microchip | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 84 | 1007 LAB | 12084 LE | Tray | Active | Details | 0.035380 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQ144I | Microchip | Datasheet | 2151 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S010-TQ144I | Microchip Technology | 3 | Surface Mount | 84 | 38.4 MHz | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.85 | No | SMD | 1.26 V | 1.14 V | 1.2 V | -40 to 85 °C | SmartFusion®2 | e0 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | 4 | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 10 pF | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | Clipped Sinewave | 256KB | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1VFG400I | Microchip | Datasheet | 2057 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-1VFG400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 207 | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 164.3 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-VFG784 | Microchip | Datasheet | 1788 |
| Min: 1 Mult: 1 | 784-FBGA | 784-VFBGA (23x23) | + 85 C | Microchip Technology | 0 C | 56500 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-1FG484M | Microchip | Datasheet | 1900 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050TS-1FG484M | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.87 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1TQ144I | Microchip | Datasheet | 2149 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S010-1TQ144I | Microchip Technology | 3 | 84 | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.88 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1FG484M | Microchip | Datasheet | 2182 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-1FG484M | 166 MHz | Microchip Technology | 3 | SMD/SMT | 233 | 12084 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 150 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | 1 % | e0 | 3A001.A.2.C | 50 ppm/°C | 3.4 Ω | Tin/Lead (Sn/Pb) | 155 °C | -55 °C | Thin Film | 8542.39.00.01 | Field Programmable Gate Arrays | 250 mW | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 650 µm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1TQ144 | Microchip | Datasheet | 2148 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB |
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M2S005-VF256I
Microchip
Package:Embedded - System On Chip (SoC)
36.305453
-
M2S150T-1FC1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-1FCVG484
Microchip
Package:Embedded - System On Chip (SoC)
228.172952
-
M2S060T-FCS325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
98.186041
-
M2S050-FGG896
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
331.211791
-
M2S050T-1FGG896
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
23.437201
-
M2S050-FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-VFG784
Microchip
Package:Embedded - System On Chip (SoC)
170.188472
-
M2S050TS-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
437.253237
-
M2S010-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010T-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
169.872618
-
M2S005S-TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire