The category is 'Embedded - System On Chip (SoC)'
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SmartFusion®2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Data RAM Size | Dim | Factory colour | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Voltage, Rating | Wireless charging | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Number of Terminations | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Additional Feature | HTS Code | Subcategory | Power Rating | Max Power Dissipation | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Military Standard | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Diameter | Height | Length | Width | Lead Free |
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 | Mfr Part No M2S060-FGG676 | Microchip | Datasheet | 2400 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 387 | 56520 LE | Tray | Active | Non-Compliant | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VF400 | Microchip | Datasheet | 1931 | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S025 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S025-VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 207 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-FGG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | Through Hole | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050TS-FGG896I | 166 MHz | Microchip Technology | SMD/SMT | 377 | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.82 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tape & Reel (TR) | SmartFusion®2 | 1 % | e1 | 2 | 50 ppm/°C | 1.62 MΩ | Tin/Silver/Copper (Sn/Ag/Cu) | 175 °C | -65 °C | Metal Film | 8542.39.00.01 | Field Programmable Gate Arrays | 250 mW | 250 mW | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | MIL-R-10509 | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | Flame Retardant Coating, Military, Moisture Resistant | 3.68 mm | 8.7376 mm | 3.68 mm | Contains Lead | ||||||||||||||||||||||||
| Mfr Part No M2S010-1VFG400I | Microchip | Datasheet | 16 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S010 | Microchip Technology | 195 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQ144I | Microchip | Datasheet | 2142 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 4400g | 144 | (W x H x D) 348 x 100 x 289 mm | Black | MICROSEMI CORP | Microsemi Corporation | M2S005S-TQ144I | Microchip Technology | 3 | 84 | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.88 | No | 1.26 V | 1.14 V | 1.2 V | No | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | 289mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 100m | 20 mm | 348mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FGG484 | Microchip | Datasheet | 1740 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S025 | 64 kB | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | 10250T436H621 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2S150 | Microchip Technology | 574 | Tray | Active | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-1FG484M | Microchip | Datasheet | 1621 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050TS-1FG484M | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.87 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1TQ144I | Microchip | Datasheet | 2149 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S010-1TQ144I | Microchip Technology | 3 | 84 | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.88 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1FG484M | Microchip | Datasheet | 1948 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-1FG484M | 166 MHz | Microchip Technology | 3 | SMD/SMT | 233 | 12084 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 150 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | 1 % | e0 | 3A001.A.2.C | 50 ppm/°C | 3.4 Ω | Tin/Lead (Sn/Pb) | 155 °C | -55 °C | Thin Film | 8542.39.00.01 | Field Programmable Gate Arrays | 250 mW | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 650 µm | 23 mm | 23 mm | ||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1TQ144 | Microchip | Datasheet | 2148 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCS536I | Microchip | Datasheet | 764 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 293 | 146124 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-VF400 | Microchip | Datasheet | 1974 | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S050 | MICROSEMI CORP | Microsemi Corporation | M2S050-VF400 | Microchip Technology | 207 | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 48672 | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FCSG325 | Microchip | Datasheet | 1763 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 200 | 56520 LE | Tray | Active | Compliant | 1.2 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-1FG676I | Microchip | Datasheet | 2256 |
| Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 425 | 86316 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1FGG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | Microchip Technology | 233 | Tray | Active | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCVG484 | Microchip | Datasheet | 1850 |
| Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FCVG484 | 166 MHz | Microchip Technology | 4 | 273 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1VFG400I | Microchip | Datasheet | 1749 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-1VFG400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | 207 | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 164.3 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-FCG1152I | Microchip | Datasheet | 2013 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150T-FCG1152I | 166 MHz | + 100 C | Microchip Technology | - 40 C | 4 | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 5.77 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm |
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M2S060-FGG676
Microchip
Package:Embedded - System On Chip (SoC)
198.884470
-
M2S025-VF400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-FGG896I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCG1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
435.270411
-
M2S010-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010T-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
170.171491
-
M2S005S-TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCS536I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-VF400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FCSG325
Microchip
Package:Embedded - System On Chip (SoC)
203.235454
-
M2S090T-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
494.192596
-
M2S010T-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-1FCVG484
Microchip
Package:Embedded - System On Chip (SoC)
227.305612
-
M2S060T-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-FCG1152I
Microchip
Package:Embedded - System On Chip (SoC)
459.159614