The category is 'Embedded - System On Chip (SoC)'
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SmartFusion2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Length | Width |
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 | Mfr Part No M2S005-TQG144 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-144 | ARM Cortex M3 | 64 kB | 191 kbit | 60 | - | - | 166 MHz | + 85 C | 0 C | Yes | SMD/SMT | 84 I/O | 505 LAB | 6060 LE | Details | 0.035380 oz | Tray | SmartFusion2 | 1.2 V | 128 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQG144 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Yes | 505 LAB | 6060 LE | Details | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 128 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQG144I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-144 | ARM Cortex M3 | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Details | 0.035380 oz | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQG144 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-144 | ARM Cortex M3 | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 85 C | 0 C | Yes | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Details | 0.035380 oz | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 191 kbit | 119 | - | - | 166 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | Details | Tray | SmartFusion2 | 1.2 V | 128 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG400I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Yes | SMD/SMT | 1007 LAB | 12084 LE | Details | This product may require additional documentation to export from the United States. | 0.236569 oz | Tray | SmartFusion2 | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | + 85 C | 0 C | Yes | SMD/SMT | 273 I/O | 2308 LAB | 27696 LE | Details | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S025 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S025TS-1FGG484 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||
| Mfr Part No M2S010TS-1VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Yes | SMD/SMT | 1007 LAB | 12084 LE | Details | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Yes | SMD/SMT | 505 LAB | 6060 LE | Details | Tray | SmartFusion2 | 128 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1VFG400I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S010 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S010T-1VFG400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | SMD/SMT | 195 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||
| Mfr Part No M2S050-FG484I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Yes | SMD/SMT | 4695 LAB | 56340 LE | N | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG484I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Yes | SMD/SMT | 4695 LAB | 56340 LE | Details | This product may require additional documentation to export from the United States. | 0.489749 oz | Tray | SmartFusion2 | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 138 I/O | 1007 LAB | 12084 LE | Details | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | ARM Cortex M3 | 64 kB | 1.314 Mbit | 64 kB | 60 | - | - | 166 MHz | + 85 C | 0 C | Yes | SMD/SMT | 267 I/O | 4695 LAB | 56340 LE | Details | This product may require additional documentation to export from the United States. | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQG144I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-144 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Yes | SMD/SMT | 505 LAB | 6060 LE | Details | This product may require additional documentation to export from the United States. | 0.046530 oz | Tray | SmartFusion2 | 128 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FCS325I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S060-1FCS325I | 166 MHz | Microchip Technology | Yes | 200 | 4710 LAB | 56520 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||
| Mfr Part No M2S150T-1FC1152I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1152 | ARM Cortex M3 | 64 kB | 24 | - | - | 166 MHz | Yes | SMD/SMT | 12177 LAB | 146124 LE | N | 1.234218 oz | Tray | SmartFusion2 | 512 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm |
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M2S005-TQG144
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-TQG144
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-TQG144I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-TQG144
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-VFG400I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010T-1VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FG484I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-FGG484I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-TQG144I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FCS325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FC1152I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire