The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Center Frequency | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Frequency Aging | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Mode of Oscillation | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Qualification | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Standard Frequency | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Temperature Coefficient | Type | Resistance | Terminal Finish | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency Stability | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Load Capacitance | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Number of Gates | Series Resistance | Speed Grade | Resistance Tolerance | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Output Level | Flash Size | Product Category | Product Length | Product Width | Length | Width |
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![]() | Mfr Part No M2S005S-1VFG256I | Microchip | Datasheet | 162 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005-VFG400 | Microchip | Datasheet | 12 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-VFG400 | 166 MHz | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 169 | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.28 | Yes | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 171 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-FGG484I | Microchip | Datasheet | 2290 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | 80 MHz | 64 kB | 60 | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484I | 80 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 204 I/O | - | 6000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.22 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0.062696 oz | -40°C ~ 100°C (TJ) | Tray | A2F500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 16.5 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | SoC FPGA | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-VFG400 | Microchip | Datasheet | 12 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | 207 | 27696 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1FGG484 | Microchip | Datasheet | 1646 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | 100 MHz | 64 kB | 60 | MICROSEMI CORP | - | - | Microchip | A2F500M3G-1FGG484 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | MCU - 41, FPGA - 128 | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.36 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0.534969 oz | 0 to 85 °C | Tray | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | SoC FPGA | 23 mm | 23 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-FGG484 | Microchip | Datasheet | 72 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | 25 V | 0 to 85 °C | SmartFusion®2 | 200 ppm/°C | 6.8 | 0.05 W | General Purpose | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010T-FGG484 | Microchip | Datasheet | 20 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | 64 kB | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 233 | 12084 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010TS-1VFG256I | Microchip | Datasheet | 12 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | 256-FPBGA (17x17) | M2S010 | Microchip Technology / Atmel | 64 kB | 119 | - | - | Microchip | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | Active | Compliant | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-FGG484 | Microchip | Datasheet | 2292 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | 40 MHz | 80 MHz | 64 kB | 500000 | 500000 | 60 | ±2.8(20th) ppm/Year | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484 | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 204 I/O | - | 6000 LE | 85 °C | 40 MHz | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.37 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | -20 to 70 °C | Tray | A2F500 | e1 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 4.6 ppm | 10 | S-PBGA-B484 | 128 | Not Qualified | 3.0000 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 10 pF | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | Clipped Sinewave | 512KB | SoC FPGA | 23 mm | 23 mm | |||||||||||||||||
![]() | Mfr Part No XCVM1402-1LLIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | AEC-Q200 | 100 ppm/K | 15 Ohm | SOC - Systems on a Chip | 0.75 W | General Purpose | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | 5 mm | 2.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQVC1802-1LSIVIQA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | 100.0000 ppm/°C | 560 Ohm | SOC - Systems on a Chip | 0.25 W | High Reliability, MIL-PRF-39017 | 700 mV | System-On-Modules - SOM | 2 | SoC FPGA | 7.62 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE2102-2LLESBVA484 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | 100 ppm/K | 2.15 Ohm | SOC - Systems on a Chip | 0.0625 W | General Purpose | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | 1 | 0.5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM2202-3HSEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | 100.0000 ppm/°C | 2.37 kOhm | SOC - Systems on a Chip | 0.25 W | High Reliability, MIL-PRF-39017 | 880 mV | System-On-Modules - SOM | 1 | SoC FPGA | 7.62 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU55DR-L2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Xilinx | 1 | Xilinx | AMD Xilinx | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 100.0000 ppm/°C | 1.24 kOhm | SOC - Systems on a Chip | 0.25 W | High Reliability, MIL-PRF-39017 | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 1 | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | 7.62 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XQVP1202-2MSIVSQA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | Fundamental | Surface Mount | 25 MHz | SMD | -40 to 85 °C | Crystal | SOC - Systems on a Chip | 2 | 800 mV | System-On-Modules - SOM | 40 Ohm | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE2202-2HSISFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | 25 ppm/°C | 549 Ohm | SOC - Systems on a Chip | 0.15 W | High Reliability | 880 mV | System-On-Modules - SOM | 1 | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE2002-2LLESBVA625 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | 200 V | 25 ppm/°C | 2.8 | SOC - Systems on a Chip | 0.4 W | Precision | 700 mV | System-On-Modules - SOM | 0.1 | SoC FPGA | 3.2 mm | 1.6 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE2102-2MLISBVA484 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | 50 ppm/°C | 2.21 kOhm | SOC - Systems on a Chip | 0.2 W | High Reliability | 800 mV | System-On-Modules - SOM | 0.1 | SoC FPGA | 2.66 | 1.27 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM2202-2MSEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | 50.0000 ppm/°C | 453 Ohm | SOC - Systems on a Chip | 0.125 W | High Reliability, MIL-PRF-55182 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 7.62 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU57DR-L1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Xilinx | 1 | Xilinx | AMD Xilinx | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 50.0000 ppm/°C | 22.1 Ohm | SOC - Systems on a Chip | 0.1 W | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 1 | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | 7.06 |
M2S005S-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
46.570470
M2S005-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
73.599754
A2F500M3G-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
136.616802
M2S025-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010T-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
93.835819
M2S010TS-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
89.661652
A2F500M3G-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-1LLIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQVC1802-1LSIVIQA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE2102-2LLESBVA484
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM2202-3HSEVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU55DR-L2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XQVP1202-2MSIVSQA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE2202-2HSISFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE2002-2LLESBVA625
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE2102-2MLISBVA484
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM2202-2MSEVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU57DR-L1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
