The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Material | Insert Material | Shape | Number of Terminals | Terminal Material | Base Product Number | Clock Frequency-Max | Contact Sizes | Data RAM Size | Device Logic Gates | Device Logic Units | Ihs Manufacturer | Insulation Materials | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Voltage-Input | Wire Size | Operating Temperature | Series | JESD-609 Code | Pbfree Code | Part Status | Connector Type | Type | Number of Positions | Terminal Finish | Additional Feature | HTS Code | Fastening Type | Subcategory | Contact Type | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Base Part Number | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Output Type | Power Supplies | Temperature Grade | Note | Plating | Attachment Method | Speed | RAM Size | Shell Size, MIL | Current - Output | Core Processor | Peripherals | Program Memory Size | Connectivity | Input Type | Voltage - Output | Architecture | Frequency - Switching | Number of Inputs | Organization | Seated Height-Max | Utilized IC / Part | Supplied Contents | Programmable Logic Type | Size | Terminal Type | Wire Strip Length | Wire Size (AWG) | Includes | Screening Level | Board Type | Speed Grade | Main Purpose | Primary Attributes | Outputs and Type | Number of Registers | Regulator Topology | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Constant Current Load - Max | Features | Mesh Length | Insulated | Height | Length | Width | Plating Thickness | Material Flammability Rating |
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 | Mfr Part No XCVM1402-1MSEVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1MSIVSVA2197 | AMD | Datasheet | 701 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1MSENBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-2FFVB1156E | AMD | Datasheet | 476 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU6 | 0.892 V | AMD | 0.808 V | 328 | Bulk | Active | 0.8500 V | 0 to 100 °C | * | Active | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-2CLG484I | AMD | Datasheet | 2106 |
| Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | XC7Z014 | 1.05 V | AMD | 0.95 V | 200 | Tray | Active | 1.0000 V | 5 V ~ 15 V | -40 to 100 °C | -- | Active | LT1425 | 766MHz | 256KB | -- | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ±15V | MCU, FPGA | -- | LT1425 | Board(s) | Fully Populated | 2 | DC/DC Converter | Artix™-7 FPGA, 65K Logic Cells | 2, Isolated | Flyback | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM47622A1KFEBG | Broadcom | Datasheet | 3116 |
| Min: 1 Mult: 1 | - | - | Aluminum | Nylon | Burndy | ES4W8W | Broadcom Limited | - | Tray | Active | Side A 4 AWG, Side B 8 AWG | - | - | 1.5GHz | - | ARM® Cortex®-A7 | DDR3, DDR4, LED | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | MPU | Splice Reducer | 0.88 | 4 AWG, 8 AWG | - | - | Insulated | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FG676I | Microchip | Datasheet | 2129 |
| Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090T-FG676I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.83 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | 1500 | e0 | Active | Panel Mount | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 120VAC | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | Not Qualified | Terminals | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Terminals | 120VAC, 140VAC | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 8.810 L x 7.250 W x 13.000 H (223.77mm x 184.15mm x 330.20mm) | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 15A (2.1kVA) | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FFVF1760E | AMD | Datasheet | 446 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FCSG325I | Microchip | Datasheet | 2282 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | Rectangle | 325 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-FCSG325I | 166 MHz | Microchip Technology | 3 | 200 | 56520 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | -- | e1 | Active | Fabric Over Foam | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | -- | Adhesive | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 0.079 (2.00mm) | 18.000 (457.20mm) | 0.161 (4.10mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCSG536I | Microchip | Datasheet | 2134 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | 64 kB | - | - | 166 MHz | PEI-Genesis | 293 | 146124 LE | Bulk | Active | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | 366 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVG1517E | AMD | Datasheet | 567 |
| Min: 1 Mult: 1 | Panel Mount | 1517-BBGA, FCBGA | Flange | Circular | Aluminum | 1517-FCBGA (40x40) | - | TVP00RW | 22D | Amphenol Aerospace Operations | 561 | Bulk | Active | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Receptacle Housing | For Female Sockets | 66 | Threaded | Crimp | C | Shielded | Environment Resistant | Cadmium | 19-35 | Olive Drab | Contacts Not Included | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG400T2 | Microchip | Datasheet | 1999 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010TS-1VFG400T2 | Microchip Technology | 195 | Tray | , | Active | Active | 40 | 5.8 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-2FFVB1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | AMD | 488 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-CSG288 | Microchip | Datasheet | 24 |
| Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F200 | 80 MHz | 200000 | MICROSEMI CORP | Microsemi Corporation | A2F200M3F-CSG288 | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 31, FPGA - 78 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.23 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 85 °C | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-PQG208I | Microchip | Datasheet | 24 | - | Min: 1 Mult: 1 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A2F200 | 80 MHz | 200000 | MICROSEMI CORP | Microsemi Corporation | A2F200M3F-PQG208I | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 22, FPGA - 66 | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 1.51 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 100 °C | SmartFusion® | Pure Matte Tin (Sn) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVB1517I | AMD | Datasheet | 699 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU17 | AMD | 644 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-1FFVB1517I | AMD | Datasheet | 447 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU17 | AMD | 644 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-2FBVB900I | AMD | Datasheet | 742 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | 192,150 | 204 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 900 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F200 | 200000 | Cooper | SKT12516 | 1.575 V | Microchip Technology | 1.425 V | MCU - 25, FPGA - 66 | Tray | Active | 1.5000 V | 0 to 85 °C | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 17 |
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XCVM1402-1MSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-1MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
26,545.521054
-
XCVM1402-1MSENBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
3,723.482268
-
XC7Z014S-2CLG484I
AMD
Package:Embedded - System On Chip (SoC)
154.747961
-
BCM47622A1KFEBG
Broadcom
Package:Embedded - System On Chip (SoC)
36.349775
-
M2S090T-FG676I
Microchip
Package:Embedded - System On Chip (SoC)
443.655242
-
XCZU49DR-1FFVF1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150T-1FCSG536I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-L2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-2FSVG1517E
AMD
Package:Embedded - System On Chip (SoC)
22,504.925367
-
M2S010TS-1VFG400T2
Microchip
Package:Embedded - System On Chip (SoC)
128.251427
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XCZU11EG-2FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-CSG288
Microchip
Package:Embedded - System On Chip (SoC)
69.546303
-
A2F200M3F-PQG208I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-2FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
6,919.879712
-
XCZU17EG-1FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
2,376.490741
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A2F200M3F-FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire