The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Product Style | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Composition | Color | Applications | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Current Rating (Amps) | Pitch | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Base Part Number | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Illumination Voltage (Nominal) | Load Capacitance | Speed | RAM Size | Operating Mode | Shell Size, MIL | Lead Style | Core Processor | Number of Poles | Illumination | Frequency Tolerance | Peripherals | Program Memory Size | Connectivity | Breaker Type | Cable Opening | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Number of Transceivers | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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 | Mfr Part No LS1046AAN3Q1A | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | Tape and Reel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F34I2LG | ALTERA | Datasheet | 663 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H2F34I2LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964800 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FFVF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 1760-BBGA, FCBGA | Bulkhead - Front Side Nut | Aluminum | 1760-FCBGA (42.5x42.5) | Thermoplastic | - | TV07RQDZ | Gold | Copper Alloy | Amphenol Aerospace Operations | 622 | Bulk | Metal | Active | - | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Crimp | Receptacle, Male Pins | 39 (38 + 1 Quadrax) | Black | Aviation, Marine, Military | Threaded | - | N (Normal) | Unshielded | Environment Resistant | Black Zinc Nickel | 17-2 | 500MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1LSEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1210 (3225 Metric) | 1210 | KOA Speer Electronics, Inc. | 692 | Tape & Reel (TR) | Active | -55°C ~ 155°C | SG73S-RT | 0.126 L x 0.102 W (3.20mm x 2.60mm) | ±2% | 2 | ±200ppm/°C | 12 kOhms | Thick Film | 1W | - | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding | 0.028 (0.70mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1MSEVSVA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Knowles Syfer | 770 | Tape & Reel (TR) | Active | 0°C ~ 100°C (TJ) | * | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FG484IX456 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | Suntsu Electronics, Inc. | Bulk | Active | -20°C ~ 70°C | SXT324 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | MHz Crystal | 40 MHz | ±25ppm | 40 Ohms | 8pF | Fundamental | ±25ppm | 0.031 (0.80mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FSVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Glenair | 561 | Retail Package | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L2FFVC1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | MB9BF003 | Infineon Technologies | 360 | Bulk | Obsolete | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No STID128-BYA | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-L2FFVB1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU6 | AMD | 328 | Tray | Active | BGA Socketing Systems | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Socket Adapter Systems | 1.00mm Pitch | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Socket Adapter Systems | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-1SFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | - | Tray | Active | BGA Socketing Systems | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | Socket Adapter Systems | 1.27mm Pitch | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | Socket Adapter Systems | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095T-FCSG536T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 536-LFBGA | 536-BGA (16x16) | -- | Microchip Technology | MCU - 136, FPGA - 168 | Tray | Active | -40°C ~ 125°C (TJ) | UPG | Obsolete | -- | -- | Toggle | -- | - | 857.6KB | RISC-V | 1 | -- | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | Magnetic (Hydraulic Delay) | MPU, FPGA | FPGA - 93K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1TQ144I | 100 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 5.84 | No | 1.575 V | 1.425 V | 1.5 V | 8542.39.00.01 | CMOS | QUAD | GULL WING | 0.5 mm | compliant | S-PQFP-G144 | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 60000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASTFD5K3F40I3NES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | MCU - 208, FPGA - 540 | -40°C ~ 100°C (TJ) | Tray | Arria V ST | Obsolete | 5ASTFD5 | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F27I1HG | ALTERA | Datasheet | 747 |
| Min: 1 Mult: 1 | Axial | Axial | Intel / Altera | - | 40 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E3F27I1HG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | 964678 | Active | 5.67 | Details | Yes | Arria 10 SoC | -65°C ~ 275°C | Bulk | CP | 1.890 L x 0.394 W (48.00mm x 10.00mm) | ±5% | Active | 2 | ±400ppm/°C | 200 mOhms | Wirewound | 10W | SOC - Systems on a Chip | unknown | 950 mV | -- | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 160K Logic Elements | 2 Core | -- | Flame Proof, Safety | SoC FPGA | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E2F27I1HG | ALTERA | Datasheet | 400 |
| Min: 1 Mult: 1 | Axial | Axial | Intel / Altera | - | 40 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E2F27I1HG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 964759 | Active | 5.64 | Details | Yes | Arria 10 SoC | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.145 Dia x 0.344 L (3.68mm x 8.74mm) | ±0.1% | Active | 2 | ±50ppm/°C | 14.5 kOhms | Metal Film | 1W | SOC - Systems on a Chip | unknown | 950 mV | -- | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 270K Logic Elements | 2 Core | -- | Flame Retardant Coating, Moisture Resistant, Safety | SoC FPGA | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS057N1F40I1HG | ALTERA | Datasheet | 732 |
| Min: 1 Mult: 1 | Panel Mount | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | -- | Intel | 10AS057N1F40I1HG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 588 | 71250 LAB | 570000 LE | 965376 | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | 48V | -40°C ~ 100°C (TJ) | Tray | CB187F | Active | -- | SOC - Systems on a Chip | unknown | 100A | Push to Reset | 950 mV | -- | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1 | -- | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Thermal | MCU, FPGA | SoC FPGA | 48 Transceiver | FPGA - 570K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066K1F40E1HG | ALTERA | Datasheet | 739 |
| Min: 1 Mult: 1 | Radial | Radial Lead | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K1F40E1HG | 1.2 GHz | + 100 C | 0 C | Yes | SMD/SMT | 696 | 82500 LAB | 660000 LE | 965383 | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -65°C ~ 275°C | Bulk | CPCC | 0.472 L x 0.315 W (12.00mm x 8.00mm) | ±5% | Active | 2 | ±400ppm/°C | 27 Ohms | Wirewound | 3W | SOC - Systems on a Chip | unknown | 950 mV | -- | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | Flame Proof, Safety | SoC FPGA | 0.984 (24.99mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R25A2E4F | Intel | Datasheet | 572 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 1206 (3216 Metric) | - | CDR32 | Vishay Vitramon | 624 | Tape & Reel (TR) | Active | 50V | -55°C ~ 125°C | Military, MIL-PRF-55681, CDR32 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±10% | BX | High Reliability | 0.022 µF | R (0.01%) | - | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | - | - | 0.051 (1.30mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-2CLG400E | AMD | Datasheet | 20 | - | Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | XC7Z010 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - |
-
LS1046AAN3Q1A
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H2F34I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
2,530.698308
-
XCZU49DR-1FFVF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-1LSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-1MSEVSVA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FG484IX456
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L1FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-L2FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
STID128-BYA
STMicroelectronics
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6EG-L2FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU1CG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS095T-FCSG536T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASTFD5K3F40I3NES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS016E3F27I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
1,189.920310
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10AS027E2F27I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
1,902.423548
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10AS057N1F40I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
8,522.735231
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10AS066K1F40E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
7,706.329086
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AGFB022R25A2E4F
Intel
Package:Embedded - System On Chip (SoC)
16,397.790347
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XC7Z010-2CLG400E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire