The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Number of Logic Blocks (LABs) | Primary Attributes | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No A2F500M3G-FG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | YES | 256 | MCU - 25, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | 256 | 8542.39.00.01 | BOTTOM | BALL | 1.5V | 1mm | unknown | 80MHz | A2F500M3G | 66 | 1.575V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 500000 | 512KB | 1.7mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | Mfr Part No M2S005-FGG484 | Microsemi Corporation | Datasheet | 1 | - | Min: 1 Mult: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484 | 484-FPBGA (23x23) | 209 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S005 | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 23.9kB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 6060 | ARM | 505 | FPGA - 5K Logic Modules | 128KB | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||||||||||
 | Mfr Part No M2S005S-VF400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 169 | -40°C~100°C TJ | Tray | 2010 | SmartFusion®2 | e0 | no | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B400 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 161 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S010T-1VF256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 days ago) | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | A2F200 | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1VFG400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 484-BGA | YES | 484 | MCU - 41, FPGA - 94 | -40°C~100°C TJ | Tray | 2009 | SmartFusion® | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 225 | 1.5V | 1mm | 100MHz | 20 | A2F200 | 94 | 1.575V | 1.425V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | 200000 | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 2.44mm | 23mm | 23mm | No | Non-RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S010-1FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 169 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 171 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 171 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.51mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No M2S010TS-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 400-LFBGA | YES | 195 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 195 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 195 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S010T-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 195 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 195 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 195 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No M2S010-1TQG144I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | yes | Active | 3 (168 Hours) | 144 | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PQFP-G144 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | 1.6mm | 20mm | 20mm | RoHS Compliant | |||||||||||||||||||||||||||
| Mfr Part No M2S010T-1FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | 484-FPBGA (23x23) | 233 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S010T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VF256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S010TS-1VF256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S025-VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 256-LBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No M2S025TS-FCSG325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No M2S025T-1FCSG325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No A2F500M3G-1PQG208 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 208-BFQFP | YES | 208 | MCU - 22, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | 208 | Pure Matte Tin (Sn) | 8542.39.00.01 | QUAD | GULL WING | 245 | 1.5V | 0.5mm | 100MHz | 30 | A2F500M3G | 1.5V | Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 500000 | 512KB | 4.1mm | 28mm | 28mm | RoHS Compliant |
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A2F500M3G-FG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-VF400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-1VF256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-1FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-1VFG400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-1FG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-1FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-1TQG144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-1FG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-VF256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1VF256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-FCSG325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-1FCSG325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1PQG208
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire