The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Peripherals
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Supplier Device Package | Dielectric Material | Body Material | Number of Terminals | Center Contact Plating | Center Contact Material | Base Product Number | Brand | Current Transfer Ratio-Min | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Connector Type | Resistance | Terminal Finish | HTS Code | Fastening Type | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Voltage - Isolation | Housing Color | Output Type | Operating Supply Voltage | Power Supplies | Temperature Grade | Number of Channels | Load Capacitance | Impedance | Connector Style | Number of Ports | Speed | RAM Size | Voltage - Forward (Vf) (Typ) | Core Processor | Peripherals | Program Memory Size | Connectivity | Input Type | Architecture | Mating Cycles | Contact Termination | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Includes | Rise / Fall Time (Typ) | Current - Output / Channel | Voltage - Output (Max) | Insertion Loss | Current - DC Forward (If) (Max) | Body Finish | Output Format | Cable Group | Shield Termination | Primary Attributes | Current Transfer Ratio (Max) | Turn On / Turn Off Time (Typ) | Number of CLBs | Number of Logic Cells | Vce Saturation (Max) | Number of Cores | Flash Size | Product | Features | Product Category | Height | Length | Width | Lead Free |
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 | Mfr Part No 5CSXFC4C6U23C6N | ALTERA | Datasheet | 2087 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSXFC4C6U23C6N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.58 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSXFC4 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXFB3G4F35C5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXFB3G4F35C5N | MCU - 208, FPGA - 385 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXFB3 | S-PBGA-B1152 | 540 | Not Qualified | 1.1,1.2/3.3,2.5 V | COMMERCIAL EXTENDED | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23C6N | ALTERA | Datasheet | 2044 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSXFC6C6U23C6N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.56 | Yes | FPGA - Field Programmable Gate Array Cyclone V SX dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA6U19I7LN | ALTERA | Datasheet | 2019 |
| Min: 1 Mult: 1 | INTEL CORP | Intel Corporation | 5CSEBA6U19I7LN | Active | 5.81 | Non-Compliant | Tray | * | 0.1 % | Active | 8.25 kΩ | 100 mW | compliant | FIELD PROGRAMMABLE GATE ARRAY | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F35E2LG | ALTERA | Datasheet | 680 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H3F35E2LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965050 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NCN5140STXG | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 50-SMD Module | 50-SIP (10x8) | onsemi | 3000 | onsemi | onsemi | Yes | 24 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | - | - | - | ARM® Cortex®-M0+ | - | SPI, UART/USART | MCU | - | - | onsemi | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NCN5140SG | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 50-SMD Module | 50-SIP (10x8) | onsemi | 200 | onsemi | onsemi | Yes | 24 | Tray | Active | -40°C ~ 85°C (TA) | - | - | - | ARM® Cortex®-M0+ | - | SPI, UART/USART | MCU | - | - | onsemi | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-1SFVC784I | AMD | Datasheet | 415 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | TE Connectivity / Laird External Antennas | 1 | TE Connectivity | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | PT | Cable Assemblies | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | RF Cable Assemblies | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | RF Cable Assemblies | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L2FFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | TE Connectivity / Raychem | 1 | TE Connectivity | AMD | 464 | Tray | 328770-000 | Active | Details | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Circular Connectors | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Circular MIL Spec Strain Reliefs & Adapters | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | Circular MIL Spec Strain Reliefs & Adapters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1202-2MLEVSVA2785 | AMD | Datasheet | 598 | - | Min: 1 Mult: 1 | 2785-BFBGA | 2785-BGA (50x50) | ADLINK Technology | 1 | ADLINK Technology | AMD | 780 | Tray | Active | 0°C ~ 100°C (TJ) | Versal® Premium | I/O Modules | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | I/O Modules | Versal™ Premium FPGA, 2M Logic Cells | - | Rear I/O Modules | I/O Modules | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FFVE1156I | AMD | Datasheet | 696 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Carlo Gavazzi | 4 | Carlo Gavazzi | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | GMB63 | Circuit Breakers | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Circuit Breakers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-1SFVC784E | AMD | Datasheet | 443 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | Welwyn Components / TT Electronics | 250 | TT Electronics | AMD | PCB Mount | 252 | Tray | Active | Details | 0.008466 oz | 0°C ~ 100°C (TJ) | Ammo Pack | RC | Resistors | Metal Film | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Metal Film Resistors | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | Metal Film Resistors - Through Hole | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX040HH3F35I3VG | Intel | Datasheet | 796 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | TE Connectivity / AMP | 1000 | TE Connectivity | Intel | 374 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | Wire & Cable Management | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Wire Labels & Markers | FPGA - 400K Logic Elements | - | Wire Labels & Markers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R24C2I3E | Intel | Datasheet | 416 |
| Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R29A1E2VR0 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Raychem | 1 | TE Connectivity | Intel | 720 | Tray | 3-1192074-9 | Active | N | 0°C ~ 100°C (TJ) | Tray | Agilex I | Circular Connectors | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Circular MIL Spec Strain Reliefs & Adapters | FPGA - 2.7M Logic Elements | - | Circular MIL Spec Strain Reliefs & Adapters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Raychem | 1 | TE Connectivity | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | Data Bus Components | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Data Bus Microcouplers | FPGA - 2.7M Logic Elements | - | Data Bus Components - Microcouplers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R31B2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | - | - | - | - | - | - | CBMUHF | TE Connectivity Laird | 720 | Bulk | Obsolete | - | - | Plug, Male Pin | Threaded | - | - | - | UHF, Mini | 1 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | Crimp | - | - | - | RG-58 | - | FPGA - 2.7M Logic Elements | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB019R18A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, Gull Wing | 4-SMD | 50% @ 5mA | Fairchild Semiconductor | 480 | Bulk | Obsolete | -40°C ~ 100°C | - | 3750Vrms | Transistor | 1 | 1.4GHz | 256KB | 1.3V (Max) | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | AC, DC | MPU, FPGA | 3µs, 3µs | 80mA | 40V | 50 mA | FPGA - 1.9M Logic Elements | 300% @ 5mA | - | 300mV | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MSENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 5 mm x 3.2 mm | 1024-BGA (31x31) | CTS Electronic Components | 1000 | CTS | + 85 C | AMD Xilinx | - 40 C | SMD/SMT | 316 | Tray | Active | Details | 3.3 V | 3.3 V | 0°C ~ 100°C (TJ) | Reel | 636 | Oscillators | 75 MHz | 50 PPM | SMD/SMT | 800 mV | 15 pF | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | HCMOS, TTL | Versal™ Prime FPGA, 70k Logic Cells | - | Standard Clock Oscillators | 1.3 mm | 5 mm | 3.2 mm |
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5CSXFC4C6U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
265.065082
-
5ASXFB3G4F35C5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC6C6U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
444.038855
-
5CSEBA6U19I7LN
ALTERA
Package:Embedded - System On Chip (SoC)
344.675820
-
10AS027H3F35E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
2,233.926784
-
NCN5140STXG
ON Semiconductor
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
NCN5140SG
ON Semiconductor
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU5EG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
2,071.528321
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XCZU7EG-L2FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVP1202-2MLEVSVA2785
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
17,540.483881
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XCZU5EV-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
1,823.352804
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AGFB022R31C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX040HH3F35I3VG
Intel
Package:Embedded - System On Chip (SoC)
1,523.910269
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AGFA022R24C2I3E
Intel
Package:Embedded - System On Chip (SoC)
24,398.453322
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AGIB027R29A1E2VR0
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB027R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB027R31B2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB019R18A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-2MSENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire