The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Nominal Supply Current | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Output Function | Number of Transceivers | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No EPF6016AFC100-2 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LBGA | YES | 81 | 0°C~85°C TJ | Tray | FLEX 6000 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 3V~3.6V | BOTTOM | BALL | 235 | 3.3V | 1mm | compliant | 30 | EPF6016 | S-PBGA-B100 | 81 | Not Qualified | 2.5/3.33.3V | 153MHz | 81 | LOADABLE PLD | 1320 | 16000 | 132 | MACROCELL | 4 | 1.7mm | 11mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A3P600-2PQ208I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 1 month ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A3P600 | 350 MHz | 24 | MICROSEMI CORP | A3P600-2PQ208I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 154 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | A3P600 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 310 MHz | 2 | 13824 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-1FG256I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P1000 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL030V5-VQ100I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | AGL030 | 108 MHz | 90 | MICROSEMI CORP | AGL030V5-VQ100I | 892.86 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 77 I/O | 330 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 1.56 | N | No | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | -40 to 85 °C | Tray | AGL030V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 230 | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 768 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF200T-FCG784I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | BGA-784 | YES | 784-FCBGA (29x29) | 784 | MPF200 | 1 | MICROSEMI CORP | MPF200T-FCG784I | + 100 C | Microchip Technology | - 40 C | Yes | 4 | SMD/SMT | 364 I/O | 192000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.8 | Details | Yes | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | 1 V | PolarFire | 2.674354 oz | -40°C ~ 100°C (TJ) | Tray | MPF200T | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V ~ 1.08V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B784 | 1 V, 1.05 V | INDUSTRIAL | 12.7 Gb/s | 3.47 mm | FIELD PROGRAMMABLE GATE ARRAY | 192000 | 13619200 | 16 Transceiver | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP4S100G5H40I1N | Intel | Datasheet | 277 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 1517-BBGA, FCBGA | YES | 654 | 0°C~100°C TJ | Tray | STRATIX® IV GT | e1 | Active | 3 (168 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.92V~0.98V | BOTTOM | BALL | 245 | 0.95V | 1mm | not_compliant | 40 | EP4S100G5 | S-PBGA-B | 654 | Not Qualified | 0.951.2/31.52.5V | 654 | FIELD PROGRAMMABLE GATE ARRAY | 531200 | 28033024 | 21248 | 3.8mm | 42.5mm | 42.5mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AX027H4F34I3SG | Intel | Datasheet | 320 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 GX | Active | 3 (168 Hours) | 8542.39.00.01 | 0.87V~0.98V | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 384 | Not Qualified | 0.9V | 384 | FIELD PROGRAMMABLE GATE ARRAY | 270000 | 17870848 | 101620 | 3.65mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC2V6000-5FF1152I | Xilinx Inc. | Datasheet | 8000 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 1152-BBGA, FCBGA | 1152 | 824 | -40°C~100°C TJ | Tray | 2011 | Virtex®-II | e0 | no | Obsolete | 4 (72 Hours) | 3A001.A.7.A | Tin/Lead (Sn63Pb37) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | XC2V6000 | 824 | 1.5V | 324kB | FIELD PROGRAMMABLE GATE ARRAY | 2654208 | 6000000 | 8448 | 5 | 67584 | 0.39 ns | 76032 | 3.4mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO2280C-3FT324C | Lattice Semiconductor Corporation | Datasheet | 48 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 324-LBGA | 324 | SRAM | 271 | 0°C~85°C TJ | Tray | 2009 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | BOTTOM | BALL | 225 | 1.8V | 1mm | not_compliant | 30 | LCMXO2280 | 324 | 271 | Not Qualified | 3.3V | 23mA | 23mA | 5.1 ns | 5.1 ns | FLASH PLD | 2280 | 28262 | 500MHz | 285 | MACROCELL | 1140 | 7 | 1.7mm | 19mm | 19mm | Non-RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10M16DCF256I7G | Intel | Datasheet | 208 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 178 | -40°C~100°C TJ | Tray | MAX® 10 | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B256 | 178 | Not Qualified | 1.2V | 178 | FIELD PROGRAMMABLE GATE ARRAY | 16000 | 562176 | 1000 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO3LF-6900E-6MG256I | Lattice Semiconductor Corporation | Datasheet | 1040 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-VFBGA | 256 | 206 | -40°C~100°C TJ | Tray | 2015 | MachXO3 | Active | 3 (168 Hours) | 256 | EAR99 | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | 30kB | FIELD PROGRAMMABLE GATE ARRAY | 6864 | 245760 | 858 | 858 | 1mm | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCV50-5BG256C | Xilinx Inc. | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-BBGA | 256 | 180 | 0°C~85°C TJ | Tray | 2000 | Virtex® | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 225 | 2.5V | 1.27mm | not_compliant | 30 | XCV50 | 256 | 180 | Not Qualified | 1.2/3.62.5V | 4kB | 294MHz | FIELD PROGRAMMABLE GATE ARRAY | 1728 | 32768 | 57906 | 384 | 0.7 ns | 384 | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO2-640HC-6MG132C | Lattice Semiconductor Corporation | Datasheet | 159 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 132-LFBGA, CSPBGA | 132 | FLASH | 79 | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e1 | yes | Active | 3 (168 Hours) | 132 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 250 | 2.5V | 0.5mm | 30 | LCMXO2-640 | 80 | Not Qualified | 2.5V | 2.5/3.3V | 5.9kB | 28μA | 2.3kB | FIELD PROGRAMMABLE GATE ARRAY | 640 | 18432 | 133MHz | 80 | 320 | 640 | 1.35mm | 8mm | 8mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCS40XL-4BG256C | Xilinx Inc. | Datasheet | 13 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-BBGA | 256 | 205 | 0°C~85°C TJ | Tray | 1999 | Spartan®-XL | e0 | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 3V~3.6V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | 30 | XCS40XL | 256 | 205 | 3.3V | 3.1kB | 217MHz | FIELD PROGRAMMABLE GATE ARRAY | 1862 | 25088 | 40000 | 784 | 4 | 2016 | 1.1 ns | 784 | 784 | 13000 | 2.55mm | 27mm | 27mm | No | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-1FGG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | M2GL090 | 40 | MICROSEMI CORP | M2GL090TS-1FGG676 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 425 I/O | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060TS-1VF400I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFBGA-400 | 90 | + 100 C | - 40 C | Yes | SMD/SMT | 207 I/O | 56520 LE | N | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | IGLOO2 | 0.217405 oz | Tray | M2GL060TS | 1.2 V | 667 Mb/s | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000-1FGG896 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 27 | MICROSEMI CORP | A3PE3000-1FGG896 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 620 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 272 MHz | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-2FG144 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC5VLX110-1FF1153C | Xilinx Inc. | Datasheet | 246 | - | Min: 1 Mult: 1 | 13 Weeks | Surface Mount | Surface Mount | 1153-BBGA, FCBGA | 1153 | 800 | 0°C~85°C TJ | Tray | 1999 | Virtex®-5 LX | e0 | no | Active | 4 (72 Hours) | Tin/Lead (Sn63Pb37) | 0.95V~1.05V | BOTTOM | BALL | 225 | 1V | not_compliant | 30 | XC5VLX110 | 800 | Not Qualified | 1V | 576kB | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 4718592 | 8640 | 1 | 3.4mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10CL016YU484C8G | Intel | Datasheet | 800 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 484-FBGA | YES | 340 | 0°C~85°C TJ | Tray | Cyclone® 10 LP | Active | 3 (168 Hours) | 484 | 1.2V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | S-PBGA-B484 | FIELD PROGRAMMABLE GATE ARRAY | 15408 | 516096 | 963 | 963 | RoHS Compliant |
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EPF6016AFC100-2
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P600-2PQ208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-1FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL030V5-VQ100I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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MPF200T-FCG784I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP4S100G5H40I1N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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10AX027H4F34I3SG
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC2V6000-5FF1152I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO2280C-3FT324C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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10M16DCF256I7G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO3LF-6900E-6MG256I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
19.760287
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XCV50-5BG256C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO2-640HC-6MG132C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCS40XL-4BG256C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090TS-1FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL060TS-1VF400I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE3000-1FGG896
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC5VLX110-1FF1153C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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10CL016YU484C8G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire