The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Output Function | Number of Transceivers | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No eX64-PTQG64I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP-64 | YES | 64-TQFP (10x10) | 64 | EX64 | 357 MHz | 160 | MICROSEMI CORP | EX64-PTQG64I | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 41 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.6 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | Actel | 0.012720 oz | -40°C ~ 85°C (TA) | Tray | eX64 | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G64 | 2.5 V | INDUSTRIAL | 3000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 128 | 3000 | 0.7 ns | 3000 | 1.4 mm | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-2FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3PE600 | 60 | MICROSEMI CORP | A3PE600-2FG484 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 270 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE600 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P250-1VQG100 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | M1A3P250 | 350 MHz | 90 | MICROSEMI CORP | M1A3P250-1VQG100 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 68 I/O | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P250 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600L-FGG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P600 | 350 MHz | 160 | MICROSEMI CORP | M1A3P600L-FGG144 | 781.25 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P600L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 97 | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150-FCSG536 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2GL150 | 90 | MICROSEMI CORP | M2GL150-FCSG536 | Microchip Technology | Yes | 3 | 293 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL150 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B536 | OTHER | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-1FGG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P400 | 350 MHz | 160 | MICROSEMI CORP | A3P400-1FGG144I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 272 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 6.8 kB | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 272 MHz | 1 | 9216 | 9216 | 400000 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-FFG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX32 | 172 MHz | 90 | MICROSEMI CORP | A54SX32A-FFG256 | 172 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 203 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX32A | e0 | TIN LEAD/TIN LEAD SILVER | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,2.5/5 V | COMMERCIAL | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.7 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX16-PQG160A | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-160 | YES | 160-PQFP (28x28) | 160 | A42MX16 | 24 | MICROSEMI CORP | A42MX16-PQG160A | 153 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 140 I/O | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Active | Active | 40 | 5.53 | Details | Yes | 5.25 V | 4.75 V | 5 V | Actel | 0.196363 oz | -40°C ~ 125°C (TA) | Tray | A42MX16 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 5 V | AUTOMOTIVE | 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | STD | 2.4 ns | 24000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL010 | 60 | MICROSEMI CORP | M2GL010T-FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 233 I/O | 12084 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL010T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | STD | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090T-FCS325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | 325-FCBGA (11x11) | M2GL090 | 176 | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 180 I/O | 86184 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090T | 1.14V ~ 2.625V | 1.2 V | 86184 | 2648064 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-FG676I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | M2GL090 | 40 | MICROSEMI CORP | M2GL090TS-FG676I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 425 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL090TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCV600-4HQ240I | Xilinx Inc. | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 240-BFQFP Exposed Pad | 240 | 166 | -40°C~100°C TJ | Tray | 2000 | Virtex® | e0 | no | Obsolete | 3 (168 Hours) | 240 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 2.375V~2.625V | QUAD | GULL WING | 225 | 2.5V | 0.5mm | unknown | 30 | XCV600 | 240 | 166 | Not Qualified | 1.2/3.62.5V | 12kB | 250MHz | FIELD PROGRAMMABLE GATE ARRAY | 15552 | 98304 | 661111 | 3456 | 0.8 ns | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EPF10K100ARC240-3 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 240-BFQFP Exposed Pad | YES | 189 | 0°C~70°C TA | Tray | FLEX-10KA® | e0 | Obsolete | 6 (Time on Label) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 3V~3.6V | QUAD | GULL WING | 220 | 3.3V | 0.5mm | 30 | EPF10K100 | S-PQFP-G240 | 189 | Not Qualified | 2.5/3.33.3V | 0.8 ns | 189 | LOADABLE PLD | 4992 | 24576 | 158000 | 624 | REGISTERED | 4 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP4SGX230DF29I3N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 780-BBGA, FCBGA | YES | 372 | -40°C~100°C TJ | Tray | Stratix® IV GX | e1 | Active | 3 (168 Hours) | 780 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 245 | 0.9V | 1mm | 40 | EP4SGX230 | S-PBGA-B780 | 372 | Not Qualified | 0.91.2/31.52.5V | 717MHz | 372 | FIELD PROGRAMMABLE GATE ARRAY | 228000 | 17544192 | 9120 | 3.5mm | 29mm | 29mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CGXFC4C6F23I7N | Intel | Datasheet | 8000 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 484-BGA | YES | 240 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V GX | e1 | Active | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CGXFC4 | S-PBGA-B484 | 240 | Not Qualified | 1.11.2/3.32.5V | 240 | FIELD PROGRAMMABLE GATE ARRAY | 50000 | 2862080 | 18868 | 2mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO2-2000HE-4BG256I | Lattice Semiconductor Corporation | Datasheet | 4052 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-LFBGA | 256 | FLASH | 206 | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | not_compliant | 30 | LCMXO2-2000 | 207 | Not Qualified | 1.2V | 21.3kB | 82μA | 9.3kB | FIELD PROGRAMMABLE GATE ARRAY | 2112 | 75776 | 133MHz | 264 | 1056 | 1.7mm | 14mm | 14mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC2S600E-6FGG456C | Xilinx Inc. | Datasheet | 112 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 456-BBGA | 456 | 329 | 0°C~85°C TJ | Tray | 2008 | Spartan®-IIE | e1 | yes | Obsolete | 3 (168 Hours) | 456 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 250 | 1.8V | 1mm | 30 | XC2S600E | 456 | 514 | 1.8V | 36kB | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 15552 | 294912 | 600000 | 3456 | 6 | 0.47 ns | 210000 | 23mm | 23mm | No | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EPF6016ATI100-2 | Intel | Datasheet | 507 | - | Min: 1 Mult: 1 | Surface Mount | 100-TQFP | YES | 81 | -40°C~100°C TJ | Tray | FLEX 6000 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | ALSO CONFIGURABLE WITH 5V VCC | 8542.39.00.01 | 3V~3.6V | QUAD | GULL WING | 235 | 3.3V | 0.5mm | 30 | EPF6016 | S-PQFP-G100 | 81 | Not Qualified | 2.5/3.33.3V | 153MHz | 81 | LOADABLE PLD | 1320 | 16000 | 132 | MACROCELL | 4 | 1.27mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP2AGX65CU17C6N | Intel | Datasheet | 421 | - | Min: 1 Mult: 1 | Surface Mount | 358-LFBGA, FCBGA | YES | 156 | 0°C~85°C TJ | Tray | Arria II GX | e1 | Obsolete | 3 (168 Hours) | 358 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.87V~0.93V | BOTTOM | BALL | 260 | 0.9V | 0.8mm | 40 | EP2AGX65 | S-PBGA-B358 | 156 | Not Qualified | 0.91.2/3.31.52.5V | 500MHz | 156 | FIELD PROGRAMMABLE GATE ARRAY | 60214 | 5371904 | 2530 | 1.7mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7VX485T-2FFG1761C | Xilinx Inc. | Datasheet | 541 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 1760-BBGA, FCBGA | YES | 700 | 0°C~85°C TJ | Tray | 2010 | Virtex®-7 XT | e1 | yes | Active | 4 (72 Hours) | 1761 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 1V | 1mm | XC7VX485T | 1761 | S-PBGA-B1761 | 700 | 11.8V | 4.5MB | 1818MHz | 700 | FIELD PROGRAMMABLE GATE ARRAY | 485760 | 37969920 | 37950 | -2 | 607200 | 0.61 ns | 3.5mm | 42.5mm | 42.5mm | No | ROHS3 Compliant |
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eX64-PTQG64I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE600-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P250-1VQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P600L-FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL150-FCSG536
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P400-1FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX32A-FFG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A42MX16-PQG160A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL010T-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090T-FCS325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090TS-FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCV600-4HQ240I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EPF10K100ARC240-3
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP4SGX230DF29I3N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5CGXFC4C6F23I7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO2-2000HE-4BG256I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
22.398198
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XC2S600E-6FGG456C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EPF6016ATI100-2
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP2AGX65CU17C6N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC7VX485T-2FFG1761C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire