The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No A42MX24-FPQG160 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-160 | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | A42MX24 | 50.4 MHz | 24 | MICROSEMI CORP | A42MX24-FPQG160 | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 125 I/O | 70 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | SQUARE | FLATPACK | Active | Active | 40 | 5.26 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.196363 oz | 0°C ~ 70°C (TA) | Tray | A42MX24 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | 36000 | 912 | 1410 | 3.4 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-3PLG68I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX04 | 109 MHz | 19 | MICROSEMI CORP | A40MX04-3PLG68I | 188 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 57 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | 0.171777 oz | -40°C ~ 85°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 1.7 ns | 547 | 6000 | 3.68 mm | 24.23 mm | 24.23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL600V5-FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V5-FG256 | 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | AGL600V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX02-1PLG68 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX02 | 92 MHz | 19 | MICROSEMI CORP | A40MX02-1PLG68 | 160 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 57 I/O | 295 LAB | 70 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.171777 oz | 0°C ~ 70°C (TA) | Tube | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.3 ns | 295 | 3000 | 3.68 mm | 24.23 mm | 24.23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX08A-1TQG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP-144 | YES | 144-TQFP (20x20) | 144 | A54SX08 | 278 MHz | 60 | MICROSEMI CORP | A54SX08A-1TQG144 | 278 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 113 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.25 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.046530 oz | 0°C ~ 70°C (TA) | Tray | A54SX08A | e3 | Matte Tin (Sn) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 113 | 768 CLBS, 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 12000 | 768 | 1.1 ns | 768 | 768 | 12000 | 1.4 mm | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS250-2FGG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS250 | 90 | MICROSEMI CORP | M1AFS250-2FGG256I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 114 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL250V5-CS196 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CSP-196 | YES | 196-CSP (8x8) | 196 | AGL250 | 108 MHz | 348 | MICROSEMI CORP | AGL250V5-CS196 | 250 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 143 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0 to 70 °C | Tray | AGL250V5 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B196 | Not Qualified | 1.5 V | OTHER | 20 uA | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 0.7 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 763 MHz | 60 | MICROSEMI CORP | AX250-1FG484 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 248 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | e0 | TIN LEAD | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS250-2FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | 90 | MICROSEMI CORP | AFS250-2FG256 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 114 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS250 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1.47059 GHz | 2 | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000L-1FG256 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000L | e0 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-3PQG100 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-100 | YES | 100-PQFP (20x14) | 100 | A40MX04 | 109 MHz | 66 | MICROSEMI CORP | A40MX04-3PQG100 | 188 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 69 I/O | 70 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Active | Active | 40 | 5.3 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.062040 oz | 0°C ~ 70°C (TA) | Tray | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 245 | 0.65 mm | compliant | R-PQFP-G100 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 547 CLBS, 6000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 1.7 ns | 547 | 6000 | 2.7 mm | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-2FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | A3PE600 | 90 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 165 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 2 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060T-1FCSG325I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL060 | 176 | MICROSEMI CORP | M2GL060T-1FCSG325I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 200 I/O | 56520 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 1.2 V | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 2 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060-1FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-676 | 676-FBGA (27x27) | M2GL060 | 40 | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 387 I/O | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL060 | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP1K10TC100-2N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-TQFP | YES | 66 | 0°C~70°C TA | Tray | ACEX-1K® | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~2.625V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | compliant | 40 | EP1K10 | S-PQFP-G100 | 66 | Not Qualified | 2.52.5/3.3V | 37.5MHz | 0.5 ns | 66 | LOADABLE PLD | 576 | 12288 | 56000 | 72 | MIXED | 576 | 1.27mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EPF10K50SQC240-2 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 240-BFQFP | YES | 189 | 0°C~70°C TA | Tray | FLEX-10KS® | e0 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | GULL WING | 220 | 2.5V | 0.5mm | compliant | 30 | EPF10K50 | S-PQFP-G240 | 189 | Not Qualified | 2.52.5/3.3V | 0.4 ns | 189 | LOADABLE PLD | 2880 | 40960 | 199000 | 360 | MIXED | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5AGXBA5D4F31I5N | Intel | Datasheet | 78 | - | Min: 1 Mult: 1 | Surface Mount | 896-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria V GX | e1 | Obsolete | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.07V~1.13V | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5AGXBA5 | S-PBGA-B896 | 384 | Not Qualified | 1.11.2/3.32.5V | 622MHz | 384 | FIELD PROGRAMMABLE GATE ARRAY | 190000 | 13284352 | 8962 | 2.7mm | 31mm | 31mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7K410T-3FBG676E | Xilinx Inc. | Datasheet | 407 |
| Min: 1 Mult: 1 | 12 Weeks | Surface Mount | 676-BBGA, FCBGA | YES | 400 | 0°C~100°C TJ | Tray | 2009 | Kintex®-7 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | NOT SPECIFIED | XC7K410T | 676 | S-PBGA-B676 | 400 | Not Qualified | 1V | 11.83.3V | 3.5MB | 1412MHz | 400 | FIELD PROGRAMMABLE GATE ARRAY | 406720 | 29306880 | 31775 | -3 | 508400 | 0.58 ns | 2.54mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC4VLX100-11FFG1148C | Xilinx Inc. | Datasheet | 132 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 1148-BBGA, FCBGA | 768 | 0°C~85°C TJ | Tray | 1999 | Virtex®-4 LX | e1 | yes | Active | 4 (72 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 245 | 1.2V | 1mm | not_compliant | 30 | XC4VLX100 | 768 | Not Qualified | 1.2V | 540kB | 1205MHz | 768 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 4423680 | 12288 | 11 | 3.4mm | 35mm | 35mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP2S130F780C5 | Intel | Datasheet | 60 | - | Min: 1 Mult: 1 | Surface Mount | 780-BBGA | YES | 534 | 0°C~85°C TJ | Tray | Stratix® II | e0 | Not For New Designs | 3 (168 Hours) | 780 | 3A001.A.7.A | TIN LEAD | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP2S130 | S-PBGA-B780 | 526 | Not Qualified | 1.21.5/3.33.3V | 640MHz | 534 | 53016 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 132540 | 6747840 | 6627 | 5.962 ns | 53016 | 3.5mm | 29mm | 29mm | Non-RoHS Compliant |
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A42MX24-FPQG160
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX04-3PLG68I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL600V5-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX02-1PLG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX08A-1TQG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AFS250-2FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL250V5-CS196
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AX250-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS250-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000L-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX04-3PQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE600-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL060T-1FCSG325I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL060-1FG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP1K10TC100-2N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EPF10K50SQC240-2
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5AGXBA5D4F31I5N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC7K410T-3FBG676E
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,767.082043
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XC4VLX100-11FFG1148C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP2S130F780C5
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire